LPC2200

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LPC4300: Inter-processor communication (Cortex-M4 ...
LPC4300: Inter-processor communication (Cortex-M4 to Cortex-M0)
Introduction to NXP's LPC4300 Cortex-M4 based digi...
Introduction to NXP's LPC4300 Cortex-M4 based digital controller
Elevator pitch for MCU...
Elevator pitch for MCU

The LPC2200 microcontroller series are based on the ARM7TDMI-S CPU with real-time emulation and embedded trace support. With their 144-pin package, low power consumption, various 32-bit timers, 8-channel 10-bit ADC, PWM channels, and up to nine external interrupt pins these microcontrollers are particularly suitable for industrial control, medical systems, access control and point-of-sale. The LPC2200 series can provide up to 76 GPIOs depending on bus configuration. With a wide range of serial communications interfaces, it is also very well suited for communication gateways, protocol converters and embedded soft modems as well as many other general-purpose applications.

Parametrics of this product

Type number	Package	Core	f_max [max](MHz)	FLASH(kB)	RAM(kB)	I/O pins	CAN	UART	SPI	SPI/SSP	ADC channels	ADC(bits)	# of timers	Timer(bits)	PWM	Temperature range	Temperature range	PLL	V_DD [min](V)	V_DD [max](V)	Package name	Product status
LPC2210FBD144	SOT486-1 (LQFP144)	ARM7	60		16	76		2	2	2	8	10	3	32	6	F	-40 °C to +85 °C	Y	3	3.6	LQFP144	Production
LPC2212FBD144	SOT486-1 (LQFP144)	ARM7	60	128	16	112		2	2	2	8	10	3	32	6	F	-40 °C to +85 °C	Y	3	3.6	LQFP144	Production
LPC2214FBD144	SOT486-1 (LQFP144)	ARM7	60	256	16	112		2	2	2	8	10	3	32	6	F	-40 °C to +85 °C	Y	3	3.6	LQFP144	Production
LPC2220FBD144	SOT486-1 (LQFP144)	ARM7	75		64	76		2	2	2	8	10	3	32	6	F	-40 °C to +85 °C	Y	3	3.6	LQFP144	Production
LPC2220FET144	SOT569-2 (TFBGA144)	ARM7	75		64	76		2	2	2	8	10	3	32	6	F	-40 °C to +85 °C	Y	3	3.6	TFBGA144	Production
LPC2290FBD144	SOT486-1 (LQFP144)	ARM7	60		64	76	2	2	2	2	8	10	3	32	6	F	-40 °C to +85 °C	Y	3	3.6	LQFP144	Production
LPC2292FBD144	SOT486-1 (LQFP144)	ARM7	60	256	16	112	2	2	2	2	8	10	3	32	6	F	-40 °C to +85 °C	Y	3	3.6	LQFP144	Production
LPC2292FET144	SOT569-2 (TFBGA144)	ARM7	60	256	16	112	2	2	2	2	8	10	3	32	6	F	-40 °C to +85 °C	Y	3	3.6	TFBGA144	Production
LPC2294HBD144	SOT486-1 (LQFP144)	ARM7	60	256	16	112	4	2	2	2	8	10	3	32	6	H	-40 °C to +125 °C	Y	3	3.6	LQFP144	Production

Package

Type number	Orderable part number	Ordering code (12NC)	Product status	Package	Packing	Marking
LPC2210FBD144/01	LPC2210FBD144/01,5	9352 820 78551	Volume production	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2212FBD144/01	LPC2212FBD144/01,5	9352 848 92551	Volume production	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2214FBD144/01	LPC2214FBD144/01,5	9352 848 93551	Volume production	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2220FBD144	LPC2220FBD144,551	9352 788 29551	Volume production	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2220FET144/G	LPC2220FET144/G,51	9352 812 16518	Volume production	SOT569-2 (TFBGA144)	Reel Dry Pack, SMD, 13"	Standard Marking
LPC2220FET144/G	LPC2220FET144/G,55	9352 812 16551	Volume production	SOT569-2 (TFBGA144)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2290FBD144/01	LPC2290FBD144/01,5	9352 820 79551	Volume production	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2292FBD144/01	LPC2292FBD144/01,5	9352 848 95551	Volume production	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2292FET144/01	LPC2292FET144/01,5	9352 848 97551	Volume production	SOT569-2 (TFBGA144)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2294HBD144/01	LPC2294HBD144/01,5	9352 848 77551	Volume production	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Single	Standard Marking

The variants in the table below are discontinued. See the table Discontinuation information at the bottom of this page for more information.

Type number	Orderable part number	Ordering code (12NC)	Product status	Package	Packing	Marking
LPC2212FBD144	LPC2212FBD144,551	9352 756 86551	Withdrawn Replacement product	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2214FBD144	LPC2214FBD144,551	9352 747 41551	Withdrawn Replacement product	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2214FBD144	LPC2214FBD144,557	9352 747 41557	Withdrawn Replacement product	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Multiple	Standard Marking
LPC2214FBD144/00	LPC2214FBD144/00,5	9352 823 56551	Withdrawn Replacement product	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2292FBD144/00	LPC2292FBD144/00,5	9352 823 57551	Withdrawn Replacement product	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2292FET144/00	LPC2292FET144/00,5	9352 823 58551	Discontinued cement productReplacement product	SOT569-2 (TFBGA144)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2294HBD144	LPC2294HBD144,551	9352 787 05551	Withdrawn Replacement product	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Single	Standard Marking

Outline drawing

Package Version	Package Name	Package Description	Reference Codes	Issue Date
SOT486-1	LQFP144	plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm	136E23 (IEC); MS-026 (JEDEC);	2003-02-20
SOT569-2	TFBGA144	plastic thin fine-pitch ball grid array package; 144 balls		2008-03-14

Discontinuation information

Type number	Ordering code (12NC)	Last-time buy date	Last-time delivery date	Replacement product	DN Notice	Status	Comments
LPC2292FBD144/00	935282357551	30-Sep-08	31-Dec-08	LPC2292FBD144/01	DN 60	Sole source product Standard availability	Standard End of Life. See Replacement.
LPC2214FBD144	935274741551	30-Sep-08	31-Dec-08	LPC2214FBD144/01	DN 60	Sole source product Standard availability	Standard End of Life. See Replacement.
LPC2214FBD144	935274741557	30-Sep-08	31-Dec-08	LPC2214FBD144/01	DN 60	Sole source product Standard availability	Standard End of Life. See Replacement.
LPC2214FBD144/00	935282356551	30-Sep-08	31-Dec-08	LPC2214FBD144/01	DN 60	Sole source product Standard availability	Standard End of Life. See Replacement.
LPC2294HBD144	935278705551	30-Sep-08	31-Dec-08	LPC2294HBD144/01	DN 60	Sole source product Standard availability	Standard End of Life. See Replacement.
LPC2212FBD144	935275686551	30-Sep-08	31-Dec-08	LPC2212FBD144/01	DN 60	Sole source product Standard availability	Standard End of Life. See Replacement.
LPC2292FET144/00	935282358551	30-Sep-08	31-Dec-08	LPC2292FET144/01	DN 60	Sole source product Standard availability	Standard End of Life. See Replacement.

Quality, reliability & chemical content

Type number	Orderable part number	Chemical content	Leadfree conversion date	IFR (FIT)	MTBF (hours)	MSL	MSL LF
LPC2210FBD144/01	LPC2210FBD144/01,5	LPC2210FBD144/01	Always Pb-free	2.84	2.5839793281653747E8	2	2
LPC2212FBD144/01	LPC2212FBD144/01,5	LPC2212FBD144/01	Always Pb-free	2.84	2.5839793281653747E8	2	2
LPC2214FBD144/01	LPC2214FBD144/01,5	LPC2214FBD144/01	Always Pb-free	2.84	2.5839793281653747E8	2	2
LPC2220FBD144	LPC2220FBD144,551	LPC2220FBD144	Always Pb-free	2.84	2.5839793281653747E8	2	2
LPC2220FET144/G	LPC2220FET144/G,51	LPC2220FET144/G	Always Pb-free	2.84	2.5839793281653747E8	NA	2
LPC2220FET144/G	LPC2220FET144/G,55	LPC2220FET144/G	Always Pb-free	2.84	2.5839793281653747E8	NA	2
LPC2290FBD144/01	LPC2290FBD144/01,5	LPC2290FBD144/01	Always Pb-free	2.84	2.5839793281653747E8	2	2
LPC2292FBD144/01	LPC2292FBD144/01,5	LPC2292FBD144/01	Always Pb-free	2.84	2.5839793281653747E8	2	2
LPC2292FET144/01	LPC2292FET144/01,5	LPC2292FET144/01	Always Pb-free	2.84	2.5839793281653747E8	NA	2
LPC2294HBD144/01	LPC2294HBD144/01,5	LPC2294HBD144/01	Always Pb-free	2.84	2.5839793281653747E8	2	2

The variants in the table below are discontinued. See the table Discontinuation information at the bottom of this page for more information.

Type number	Orderable part number	Chemical content	Leadfree conversion date	IFR (FIT)	MTBF (hours)	MSL	MSL LF
LPC2212FBD144	LPC2212FBD144,551	Not available	week 37, 2004	2.84	2.5839793281653747E8	2	2
LPC2214FBD144	LPC2214FBD144,551	Not available	week 39, 2004	2.84	2.5839793281653747E8	2	2
LPC2214FBD144	LPC2214FBD144,557	Not available	week 39, 2004	2.84	2.5839793281653747E8	2	2
LPC2214FBD144/00	LPC2214FBD144/00,5	Not available	Always Pb-free	2.84	2.5839793281653747E8	2	2
LPC2292FBD144/00	LPC2292FBD144/00,5	Not available	Always Pb-free	2.84	2.5839793281653747E8	2	2
LPC2292FET144/00	LPC2292FET144/00,5	LPC2292FET144/00	Always Pb-free	2.84	2.5839793281653747E8	NA	2
LPC2294HBD144	LPC2294HBD144,551	Not available	Always Pb-free	2.84	2.5839793281653747E8	2	2

Quality and reliability disclaimer

Important Legal Notice on the product/generic quality information, No Warranty

NXP Semiconductors is providing this data for your convenience only. Please note however that NO WARRANTY, REPRESENTATION, GUARANTEE OR LEGALLY BINDING PRODUCT DESCRIPTION is provided by publishing this informational data, nor does NXP Semiconductors acknowledge or accept any liability related thereto. The documentation and data on NXP Semiconductors products can be found in the data sheets as officially published by NXP Semiconductors. For all purchase of products from NXP Semiconductors the NXP Semiconductors' General Terms and Conditions of Commercial Sale will apply.

NXP SEMICONDUCTORS PROVIDES THE DATA HEREUNDER “AS IS” WITHOUT WARRANTY WHATSOEVER. NXP SEMICONDUCTORS DOES NOT WARRANT OR REPRESENT THAT ANY DATA PROVIDED ON THIS WEBSITE IS CORRECT OR FIT FOR A PARTICULAR PURPOSE WHATSOEVER. IT IS PROVIDED WITHOUT ANY WARRANTY WHATSOEVER, WHETHER EXPRESS, IMPLIED OR OTHERWISE, REGARDING ITS ACCURACY, COMPLETENESS NONINFRINGEMENT OF INTELLECTUAL PROPERTY OR OTHERWISE AND MAY BE CHANGED, MODIFIED OR DELETED BY NXP SEMICONDUCTORS AT ANY TIME.

Any use of the data provided hereunder is at your own risk.

IN NO EVENT SHALL NXP SEMICONDUCTORS, BE LIABLE FOR ANY DIRECT, SPECIAL, INDIRECT, CONSEQUENTIAL, PUNITIVE, OR INCIDENTAL DAMAGES (INCLUDING WITHOUT LIMITATION DAMAGES FOR LOSS OF BUSINESS, BUSINESS INTERRUPTION, LOSS OF USE, LOSS OF DATA OR INFORMATION, AND THE LIKE) ARISING OUT OF THE USE OF THE DATA, WHETHER OR NOT BASED ON TORT (INCLUDING NEGLIGENCE), STRICT LIABILITY, BREACH OF CONTRACT, BREACH OF WARRANTY OR ANY OTHER THEORY, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. NOTWITHSTANDING ANY DAMAGES THAT YOU MIGHT INCUR FOR ANY REASON WHATSOEVER (INCLUDING, WITHOUT LIMITATION, ALL DAMAGES REFERENCED ABOVE AND ALL GENERAL DAMAGES), THE ENTIRE LIABILITY OF NXP SEMICONDUCTORS, AND YOUR EXCLUSIVE REMEDY FOR ALL OF THE FOREGOING SHALL BE LIMITED TO ACTUAL DAMAGES INCURRED BY YOU BASED ON REASONABLE RELIANCE UP TO ONE DOLLARS (US$1.00). THE FOREGOING LIMITATIONS, EXCLUSIONS AND DISCLAIMERS SHALL APPLY TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, EVEN IF ANY REMEDY FAILS OF ITS ESSENTIAL PURPOSE.

Your use of this data, and all consequences of such use, is solely your responsibility. You must perform sufficient engineering and additional qualification testing in order to properly evaluate your application and determine whether a candidate NXP Semiconductors device is suitable for use in that application.

NXP Semiconductors' products are specifically designed and manufactured to be used within the electrical, thermal, mechanical and other parameters set forth in NXP Semiconductors' data sheets. Quality and reliability data provided by NXP Semiconductors, such as MTBF, MSL and FIT, is intended to be a non-binding estimate of product performance based upon diffusion process, history only. It does not imply that any performance levels reflected in such data can be met if the product is operated outside the conditions expressly stated in the latest published data sheet for a device or in your application.

The RoHS data provided hereunder is preliminary and non binding for NXP Semiconductors. NXP Semiconductors does not accept any liability related to this data.

NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage nor for any other use that is not explicitly agreed between the parties. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk.

Any use of NXP Semiconductors' products beyond the scope defined in the current NXP Semiconductors' data sheet voids all warranty responsibility of NXP Semiconductors with respect to such devices, and also voids all responsibility of NXP Semiconductors with respect to any applications assistance, product design, software performance or services of any kind that were or may have been performed in connection with the sale of any such devices.

Further, resale of NXP Semiconductors' products or services with statements different from or beyond the parameters stated by NXP Semiconductors for that product in official NXP Semiconductors data sheets, or without the warnings or instructions provided by NXP Semiconductors, voids all express and any implied warranties for the associated NXP Semiconductors product or service, and is an unfair and deceptive business practice.

Discontinuation information

Type number	Ordering code (12NC)	Last-time buy date	Last-time delivery date	Replacement product	DN Notice	Status	Comments
LPC2292FBD144/00	935282357551	30-Sep-08	31-Dec-08	LPC2292FBD144/01	DN 60	Sole source product Standard availability	Standard End of Life. See Replacement.
LPC2214FBD144	935274741551	30-Sep-08	31-Dec-08	LPC2214FBD144/01	DN 60	Sole source product Standard availability	Standard End of Life. See Replacement.
LPC2214FBD144	935274741557	30-Sep-08	31-Dec-08	LPC2214FBD144/01	DN 60	Sole source product Standard availability	Standard End of Life. See Replacement.
LPC2214FBD144/00	935282356551	30-Sep-08	31-Dec-08	LPC2214FBD144/01	DN 60	Sole source product Standard availability	Standard End of Life. See Replacement.
LPC2294HBD144	935278705551	30-Sep-08	31-Dec-08	LPC2294HBD144/01	DN 60	Sole source product Standard availability	Standard End of Life. See Replacement.
LPC2212FBD144	935275686551	30-Sep-08	31-Dec-08	LPC2212FBD144/01	DN 60	Sole source product Standard availability	Standard End of Life. See Replacement.
LPC2292FET144/00	935282358551	30-Sep-08	31-Dec-08	LPC2292FET144/01	DN 60	Sole source product Standard availability	Standard End of Life. See Replacement.

Documentation for this product

Download all documentation (zip)

File name	Title	Type	Format	Date
LPC2290	16/32-bit ARM microcontroller with CAN, 10-bit ADC and external memory interface	Data sheet	pdf	2006-11-16
LPC2210_2220	16/32-bit ARM microcontrollers; flashless, with 10-bit ADC and external memory interface	Data sheet	pdf	2008-12-11
LPC2292_2294	16/32-bit ARM microcontrollers; 256 kB ISP/IAP flash with CAN, 10-bit ADC and external memory interface	Data sheet	pdf	2011-06-08
LPC2212_2214	Single-chip 16/32-bit ARM microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC and external memory interface	Data sheet	pdf	2011-06-14
LPC221xextmem	ARM7-based MCUs with up to 256-KB Flash and external memory interface	Leaflet	pdf	2007-03-01
LPC22x0	ARM7-based MCUs for memory-intensive applications	Leaflet	pdf	2007-03-01
LPC229xwith4xCAN	ARM7-based MCUs with up to 256-KB Flash and 4x CAN	Leaflet	pdf	2007-03-01

Ordering & availability

Type number	Ordering code (12NC)	Orderable part number	Region	Distributor	In stock	Order quantity	Inventory date	Samples
LPC2220FET144/G	9352 812 16518	LPC2220FET144/G,51						Not available
LPC2220FET144/G	9352 812 16551	LPC2220FET144/G,55	NA	FUTURE ELECTRONICS	192		5/21/2013
			EU	FUTURE ELECTRONICS UK	192		5/21/2013
			ASIA	FUTURE ELECTRONICS- ASIA	192		5/21/2013
			JAPAN	CHIP ONE STOP	100		05/22/2013
LPC2292FBD144/01	9352 848 95551	LPC2292FBD144/01,5	NA	AVNET EXPRESS AMERICAS	1,754		5/22/2013
			NA	DIGI-KEY CORPORATION	612		5/22/2013
			ASIA	WPI	300	60	05/22/2013
			NA	FUTURE ELECTRONICS	291		5/21/2013
			EU	FUTURE ELECTRONICS UK	291		5/21/2013
			ASIA	FUTURE ELECTRONICS- ASIA	291		5/21/2013
			JAPAN	CHIP ONE STOP	100		05/22/2013
			NA	Newark element14	49	1	5/22/2013
			ASIA	SACC - Singapore	yes	60	05/01/2013
LPC2210FBD144/01	9352 820 78551	LPC2210FBD144/01,5	NA	FUTURE ELECTRONICS	10,030		5/21/2013
			EU	FUTURE ELECTRONICS UK	10,030		5/21/2013
			ASIA	FUTURE ELECTRONICS- ASIA	10,030		5/21/2013
			EU	ARROW EUROPE	3,372		5/22/2013
			ASIA	AVNET EXPRESS ASIA	900		5/22/2013
			JAPAN	CHIP ONE STOP	100		05/22/2013
LPC2214FBD144/01	9352 848 93551	LPC2214FBD144/01,5	NA	FUTURE ELECTRONICS	2,887		5/21/2013
			EU	FUTURE ELECTRONICS UK	2,887		5/21/2013
			ASIA	FUTURE ELECTRONICS- ASIA	2,887		5/21/2013
			NA	AVNET EXPRESS AMERICAS	787		5/22/2013
			NA	DIGI-KEY CORPORATION	343		5/22/2013
			NA	ARROW ELECTRONICS	343		5/22/2013
			JAPAN	CHIP ONE STOP	98		05/22/2013
			EU	ARROW EUROPE	60		5/22/2013
			NA	Newark element14	25	60	5/22/2013
LPC2294HBD144/01	9352 848 77551	LPC2294HBD144/01,5	NA	ARROW ELECTRONICS	1,411		5/22/2013
			NA	DIGI-KEY CORPORATION	599		5/22/2013
			NA	AVNET EXPRESS AMERICAS	423		5/22/2013
			EU	ARROW EUROPE	311		5/22/2013
			NA	FUTURE ELECTRONICS	260		5/21/2013
			EU	FUTURE ELECTRONICS UK	260		5/21/2013
			ASIA	FUTURE ELECTRONICS- ASIA	260		5/21/2013
			EU	Farnell Europe	115	1	05/22/2013
			JAPAN	CHIP ONE STOP	100		05/22/2013
			NA	Newark element14	35	1	5/22/2013
			ASIA	Element 14	0	1	22/05/2013
LPC2212FBD144/01	9352 848 92551	LPC2212FBD144/01,5	ASIA	AVNET EXPRESS ASIA	600		5/22/2013
			NA	AVNET EXPRESS AMERICAS	302		5/22/2013
			NA	DIGI-KEY CORPORATION	167		5/22/2013
			NA	ARROW ELECTRONICS	110		5/22/2013
			JAPAN	CHIP ONE STOP	20		05/22/2013
LPC2290FBD144/01	9352 820 79551	LPC2290FBD144/01,5	JAPAN	CHIP ONE STOP	92		05/22/2013
			NA	FUTURE ELECTRONICS	60		5/21/2013
			EU	FUTURE ELECTRONICS UK	60		5/21/2013
			ASIA	FUTURE ELECTRONICS- ASIA	60		5/21/2013
			NA	DIGI-KEY CORPORATION	20		5/22/2013
LPC2292FET144/01	9352 848 97551	LPC2292FET144/01,5	NA	DIGI-KEY CORPORATION	339		5/22/2013
			NA	AVNET EXPRESS AMERICAS	153		5/22/2013
			JAPAN	CHIP ONE STOP	99		05/22/2013
			NA	ARROW ELECTRONICS	43		5/22/2013
LPC2220FBD144	9352 788 29551	LPC2220FBD144,551	NA	AVNET EXPRESS AMERICAS	2,377		5/22/2013
			NA	DIGI-KEY CORPORATION	731		5/22/2013
			ASIA	WPI	300	60	05/22/2013
			JAPAN	CHIP ONE STOP	100		05/22/2013
			NA	NEWARK/ELEMENT14	31		5/22/2013
			EU	Farnell Europe	31	1	05/22/2013
			NA	Newark element14	24	1	5/22/2013
			NA	FUTURE ELECTRONICS	10		5/21/2013
			EU	FUTURE ELECTRONICS UK	10		5/21/2013
			ASIA	FUTURE ELECTRONICS- ASIA	10		5/21/2013
			ASIA	Element 14	0	1	22/05/2013
			ASIA	SACL - Hong Kong/China	yes	60	05/01/2013
			ASIA	SACC - Singapore	yes	60	05/01/2013

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LPC2200

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LPC4300: Inter-processor communication (Cortex-M4 ...

Introduction to NXP's LPC4300 Cortex-M4 based digi...

Elevator pitch for MCU...

Parametrics of this product

Package

Outline drawing

Related documents

Reflow soldering

Wave soldering

Discontinuation information

Quality, reliability & chemical content

Quality and reliability disclaimer

Discontinuation information

Documentation for this product

Ordering & availability

Sample

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