LPC2300

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Latest videos

LPC4300: Inter-processor communication (Cortex-M4 ...
LPC4300: Inter-processor communication (Cortex-M4 to Cortex-M0)
Introduction to NXP's LPC4300 Cortex-M4 based digi...
Introduction to NXP's LPC4300 Cortex-M4 based digital controller
Elevator pitch for MCU...
Elevator pitch for MCU

The LPC2300 microcontroller series are based on the ARM7TDMI-S CPU with real-time emulation that combines the microcontroller with up to 128 kB of embedded high-speed flash memory. The LPC2300 series are ideal for multi-purpose serial communication applications. They incorporate a 10/100 Ethernet Media Access Controller (MAC), USB full speed device with 4 kB of endpoint RAM, four UARTs, two CAN channels, an SPI interface, two Synchronous Serial Ports (SSP), three I²C interfaces, and an I²S interface make these devices very well suited for communication gateways and protocol converters. Various 32-bit timers, an improved 10-bit ADC, 10-bit DAC, one PWM unit, a CAN control unit, and up to 70 fast GPIO lines with up to 12 edge or level sensitive external interrupt pins make these microcontrollers particularly suitable for industrial control and medical systems.

Parametrics of this product

Type number	Package	Core	f_max [max](MHz)	FLASH(kB)	RAM(kB)	I/O pins	Ethernet	USB	CAN	UART	SPI	SPI/SSP	SSP	ADC channels	ADC(bits)	# of timers	Timer(bits)	PWM	Temperature range	Temperature range	PLL	V_DD [min](V)	V_DD [max](V)	Package name	Product status
LPC2361FBD100	SOT407-1 (LQFP100)	ARM7	72	64	34	70		1	2	4	2	4	2	8	10	4	32	12	F	-40 °C to +85 °C	Y	3	3.6	LQFP100	Production
LPC2362FBD100	SOT407-1 (LQFP100)	ARM7	72	58	128	70	1	1	2	4	2	4	2			4	32	12	F	-40 °C to +85 °C	Y	3	3.6	LQFP100	Production
LPC2364FBD100	SOT407-1 (LQFP100)	ARM7	72	128	34	70	1	1	2	4	1	3	2	8	10	4	32	12	F	-40 °C to +85 °C	Y	3	3.6	LQFP100	Production
LPC2364FET100	SOT926-1 (TFBGA100)	ARM7	72	128	34	70	1	1	2	4	1	3	2	8	10	4	32	12	F	-40 °C to +85 °C	Y	3	3.6	TFBGA100	Production
LPC2364HBD100	SOT407-1 (LQFP100)	ARM7	72	128	34	70	1	1	2	4	1	3	2	8	10	4	32	12	H	-40 °C to +125 °C	Y	3	3.6	LQFP100	Production
LPC2365FBD100	SOT407-1 (LQFP100)	ARM7	72	256	58	70	1			4	1	3	2	8	10	4	32	12	F	-40 °C to +85 °C	Y	3	3.6	LQFP100	Production
LPC2366FBD100	SOT407-1 (LQFP100)	ARM7	72	256	58	70	1	1	2	4	1	3	2	8	10	4	32	12	F	-40 °C to +85 °C	Y	3	3.6	LQFP100	Production
LPC2367FBD100	SOT407-1 (LQFP100)	ARM7	72	512	58	70	1			4	1	3	2	8	10	4	32	12	F	-40 °C to +85 °C	Y	3	3.6	LQFP100	Production
LPC2368FBD100	SOT407-1 (LQFP100)	ARM7	72	512	58	70	1	1	2	4	1	3	2	8	10	4	32	12	F	-40 °C to +85 °C	Y	3	3.6	LQFP100	Production
LPC2368FET100	SOT926-1 (TFBGA100)	ARM7	72	512	58	70	1	1	2	4	1	3	2	8	10	4	32	12	F	-40 °C to +85 °C	Y	3	3.6	TFBGA100	Production
LPC2377FBD144	SOT486-1 (LQFP144)	ARM7	72	512	58	104	1			4	1	3	2	8	10	4	32	12	F	-40 °C to +85 °C	Y	3	3.6	LQFP144	Production
LPC2378FBD144	SOT486-1 (LQFP144)	ARM7	72	512	58	104	1	1	2	4	1	3	2	8	10	4	32	12	F	-40 °C to +85 °C	Y	3	3.6	LQFP144	Production
LPC2387FBD100	SOT407-1 (LQFP100)	ARM7	72	512	98	70	1	1	2	4	1	3	2	8	10	4	32	12	F	-40 °C to +85 °C	Y	3	3.6	LQFP100	Production
LPC2388FBD144	SOT486-1 (LQFP144)	ARM7	72	512	98	104	1	1	2	4	1	3	2	8	10	4	32	12	F	-40 °C to +85 °C	Y	3	3.6	LQFP144	Production

Package

Type number	Orderable part number	Ordering code (12NC)	Product status	Package	Packing	Marking
LPC2361FBD100	LPC2361FBD100,551	9352 869 91551	Volume production	SOT407-1 (LQFP100)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2362FBD100	LPC2362FBD100,551	9352 867 44551	Volume production	SOT407-1 (LQFP100)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2364FBD100	LPC2364FBD100,551	9352 824 63551	Volume production	SOT407-1 (LQFP100)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2364FET100	LPC2364FET100,518	9352 851 03518	Volume production	SOT926-1 (TFBGA100)	Reel Dry Pack, SMD, 13"	Standard Marking
LPC2364HBD100	LPC2364HBD100,551	9352 887 99551	Volume production	SOT407-1 (LQFP100)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2365FBD100	LPC2365FBD100,551	9352 860 17551	Volume production	SOT407-1 (LQFP100)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2366FBD100	LPC2366FBD100,551	9352 824 62551	Volume production	SOT407-1 (LQFP100)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2367FBD100	LPC2367FBD100,551	9352 860 18551	Volume production	SOT407-1 (LQFP100)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2368FBD100	LPC2368FBD100,551	9352 824 61551	Volume production	SOT407-1 (LQFP100)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2368FET100	LPC2368FET100,518	9352 851 02518	Volume production	SOT926-1 (TFBGA100)	Reel Dry Pack, SMD, 13"	Standard Marking
LPC2377FBD144	LPC2377FBD144,551	9352 860 19551	Volume production	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2378FBD144	LPC2378FBD144,551	9352 824 58551	Volume production	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2387FBD100	LPC2387FBD100,551	9352 849 32551	Volume production	SOT407-1 (LQFP100)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC2388FBD144	LPC2388FBD144,551	9352 854 17551	Volume production	SOT486-1 (LQFP144)	Tray Dry Pack, Bakeable, Single	Standard Marking

Outline drawing

Package Version	Package Name	Package Description	Reference Codes	Issue Date
SOT486-1	LQFP144	plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm	136E23 (IEC); MS-026 (JEDEC);	2003-02-20
SOT926-1	TFBGA100	plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm		2005-12-22
SOT407-1	LQFP100	plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm	MS-026 (JEDEC); 136E20 (IEC);	2003-02-20

Quality, reliability & chemical content

Type number	Orderable part number	Chemical content	Leadfree conversion date	IFR (FIT)	MTBF (hours)	MSL	MSL LF
LPC2361FBD100	LPC2361FBD100,551	LPC2361FBD100	Always Pb-free	2.84	2.5839793281653747E8	3	3
LPC2362FBD100	LPC2362FBD100,551	LPC2362FBD100	Always Pb-free	2.84	2.5839793281653747E8	3	3
LPC2364FBD100	LPC2364FBD100,551	LPC2364FBD100	Always Pb-free	2.84	2.5839793281653747E8	3	3
LPC2364FET100	LPC2364FET100,518	LPC2364FET100	Always Pb-free	2.84	2.5839793281653747E8	NA	3
LPC2364HBD100	LPC2364HBD100,551	LPC2364HBD100	Always Pb-free	2.84	2.5839793281653747E8	3	3
LPC2365FBD100	LPC2365FBD100,551	LPC2365FBD100	Always Pb-free	2.84	2.5839793281653747E8	3	3
LPC2366FBD100	LPC2366FBD100,551	LPC2366FBD100	Always Pb-free	2.84	2.5839793281653747E8	3	3
LPC2367FBD100	LPC2367FBD100,551	LPC2367FBD100	Always Pb-free	2.84	2.5839793281653747E8	3	3
LPC2368FBD100	LPC2368FBD100,551	LPC2368FBD100	Always Pb-free	2.84	2.5839793281653747E8	3	3
LPC2368FET100	LPC2368FET100,518	LPC2368FET100	Always Pb-free	2.84	2.5839793281653747E8	NA	3
LPC2377FBD144	LPC2377FBD144,551	LPC2377FBD144	Always Pb-free	2.84	2.5839793281653747E8	2	2
LPC2378FBD144	LPC2378FBD144,551	LPC2378FBD144	Always Pb-free	2.84	2.5839793281653747E8	2	2
LPC2387FBD100	LPC2387FBD100,551	LPC2387FBD100	Always Pb-free	2.84	2.5839793281653747E8	3	3
LPC2388FBD144	LPC2388FBD144,551	LPC2388FBD144	Always Pb-free	2.84	2.5839793281653747E8	2	2

Quality and reliability disclaimer

Important Legal Notice on the product/generic quality information, No Warranty

NXP Semiconductors is providing this data for your convenience only. Please note however that NO WARRANTY, REPRESENTATION, GUARANTEE OR LEGALLY BINDING PRODUCT DESCRIPTION is provided by publishing this informational data, nor does NXP Semiconductors acknowledge or accept any liability related thereto. The documentation and data on NXP Semiconductors products can be found in the data sheets as officially published by NXP Semiconductors. For all purchase of products from NXP Semiconductors the NXP Semiconductors' General Terms and Conditions of Commercial Sale will apply.

NXP SEMICONDUCTORS PROVIDES THE DATA HEREUNDER “AS IS” WITHOUT WARRANTY WHATSOEVER. NXP SEMICONDUCTORS DOES NOT WARRANT OR REPRESENT THAT ANY DATA PROVIDED ON THIS WEBSITE IS CORRECT OR FIT FOR A PARTICULAR PURPOSE WHATSOEVER. IT IS PROVIDED WITHOUT ANY WARRANTY WHATSOEVER, WHETHER EXPRESS, IMPLIED OR OTHERWISE, REGARDING ITS ACCURACY, COMPLETENESS NONINFRINGEMENT OF INTELLECTUAL PROPERTY OR OTHERWISE AND MAY BE CHANGED, MODIFIED OR DELETED BY NXP SEMICONDUCTORS AT ANY TIME.

Any use of the data provided hereunder is at your own risk.

IN NO EVENT SHALL NXP SEMICONDUCTORS, BE LIABLE FOR ANY DIRECT, SPECIAL, INDIRECT, CONSEQUENTIAL, PUNITIVE, OR INCIDENTAL DAMAGES (INCLUDING WITHOUT LIMITATION DAMAGES FOR LOSS OF BUSINESS, BUSINESS INTERRUPTION, LOSS OF USE, LOSS OF DATA OR INFORMATION, AND THE LIKE) ARISING OUT OF THE USE OF THE DATA, WHETHER OR NOT BASED ON TORT (INCLUDING NEGLIGENCE), STRICT LIABILITY, BREACH OF CONTRACT, BREACH OF WARRANTY OR ANY OTHER THEORY, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. NOTWITHSTANDING ANY DAMAGES THAT YOU MIGHT INCUR FOR ANY REASON WHATSOEVER (INCLUDING, WITHOUT LIMITATION, ALL DAMAGES REFERENCED ABOVE AND ALL GENERAL DAMAGES), THE ENTIRE LIABILITY OF NXP SEMICONDUCTORS, AND YOUR EXCLUSIVE REMEDY FOR ALL OF THE FOREGOING SHALL BE LIMITED TO ACTUAL DAMAGES INCURRED BY YOU BASED ON REASONABLE RELIANCE UP TO ONE DOLLARS (US$1.00). THE FOREGOING LIMITATIONS, EXCLUSIONS AND DISCLAIMERS SHALL APPLY TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, EVEN IF ANY REMEDY FAILS OF ITS ESSENTIAL PURPOSE.

Your use of this data, and all consequences of such use, is solely your responsibility. You must perform sufficient engineering and additional qualification testing in order to properly evaluate your application and determine whether a candidate NXP Semiconductors device is suitable for use in that application.

NXP Semiconductors' products are specifically designed and manufactured to be used within the electrical, thermal, mechanical and other parameters set forth in NXP Semiconductors' data sheets. Quality and reliability data provided by NXP Semiconductors, such as MTBF, MSL and FIT, is intended to be a non-binding estimate of product performance based upon diffusion process, history only. It does not imply that any performance levels reflected in such data can be met if the product is operated outside the conditions expressly stated in the latest published data sheet for a device or in your application.

The RoHS data provided hereunder is preliminary and non binding for NXP Semiconductors. NXP Semiconductors does not accept any liability related to this data.

NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage nor for any other use that is not explicitly agreed between the parties. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk.

Any use of NXP Semiconductors' products beyond the scope defined in the current NXP Semiconductors' data sheet voids all warranty responsibility of NXP Semiconductors with respect to such devices, and also voids all responsibility of NXP Semiconductors with respect to any applications assistance, product design, software performance or services of any kind that were or may have been performed in connection with the sale of any such devices.

Further, resale of NXP Semiconductors' products or services with statements different from or beyond the parameters stated by NXP Semiconductors for that product in official NXP Semiconductors data sheets, or without the warnings or instructions provided by NXP Semiconductors, voids all express and any implied warranties for the associated NXP Semiconductors product or service, and is an unfair and deceptive business practice.

Documentation for this product

Download all documentation (zip)

File name	Title	Type	Format	Date
LPC2361_62	Single-chip 16-bit/32-bit MCU; up to 128 kB flash with ISP/IAP, Ethernet, USB 2.0 device/host/OTG, CAN, and 10-bit ADC/DAC	Data sheet	pdf	2011-10-25
LPC2377_78	Single-chip 16-bit/32-bit microcontrollers; 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC	Data sheet	pdf	2011-11-15
LPC2364_65_66_67_68	Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC	Data sheet	pdf	2011-10-20
LPC2388	Single-chip 16-bit/32-bit micro; 512 kB flash with ISP/IAP, Ethernet, USB 2.0 device/host/OTG, CAN, and 10-bit ADC/DAC	Data sheet	pdf	2010-07-13
LPC2387	Single-chip 16-bit/32-bit MCU; 512 kB flash with ISP/IAP, Ethernet, USB 2.0 device/host/OTG, CAN, and 10-bit ADC/DAC	Data sheet	pdf	2012-01-09
TN0700x	PWM dual edge driver for 3-phase motor control using LPC23xx, LPC24xx	Technical note	zip	2007-06-22

Ordering & availability

Type number	Ordering code (12NC)	Orderable part number	Region	Distributor	In stock	Order quantity	Inventory date
LPC2362FBD100	9352 867 44551	LPC2362FBD100,551	NA	DIGI-KEY CORPORATION	480		5/21/2013
			JAPAN	CHIP ONE STOP	100		05/21/2013
			NA	AVNET EXPRESS AMERICAS	70		5/21/2013
LPC2378FBD144	9352 824 58551	LPC2378FBD144,551	NA	AVNET EXPRESS AMERICAS	2,844		5/21/2013
			NA	DIGI-KEY CORPORATION	2,794		5/21/2013
			NA	ARROW ELECTRONICS	2,210		5/21/2013
			NA	FUTURE ELECTRONICS	1,772		5/20/2013
			EU	FUTURE ELECTRONICS UK	1,772		5/20/2013
			ASIA	FUTURE ELECTRONICS- ASIA	1,772		5/20/2013
			EU	Farnell Europe	457	1	05/21/2013
			ASIA	WPI	244	60	05/21/2013
			ASIA	ARROW ASIA PAC LTD	240		1/31/2013
			NA	Newark element14	185	60	5/21/2013
			ASIA	Element 14	0	1	21/05/2013
LPC2388FBD144	9352 854 17551	LPC2388FBD144,551	NA	FUTURE ELECTRONICS	4,207		5/20/2013
			EU	FUTURE ELECTRONICS UK	4,207		5/20/2013
			ASIA	FUTURE ELECTRONICS- ASIA	4,207		5/20/2013
			NA	AVNET EXPRESS AMERICAS	2,484		5/21/2013
			NA	DIGI-KEY CORPORATION	1,572		5/21/2013
			JAPAN	CHIP ONE STOP	521		05/21/2013
			EU	ARROW EUROPE	518		5/21/2013
			NA	ARROW ELECTRONICS	189		5/21/2013
			NA	Newark element14	50	1	5/21/2013
			ASIA	Newark	2	1	21/05/2013
LPC2366FBD100	9352 824 62551	LPC2366FBD100,551	NA	AVNET EXPRESS AMERICAS	32,016		5/21/2013
			NA	FUTURE ELECTRONICS	3,385		5/20/2013
			EU	FUTURE ELECTRONICS UK	3,385		5/20/2013
			ASIA	FUTURE ELECTRONICS- ASIA	3,385		5/20/2013
			NA	DIGI-KEY CORPORATION	1,176		5/21/2013
			ASIA	WPI	540	90	05/21/2013
			EU	Farnell Europe	110	1	05/21/2013
			JAPAN	CHIP ONE STOP	100		05/21/2013
			NA	Newark element14	74	90	5/21/2013
			ASIA	Element 14	0	1	21/05/2013
LPC2387FBD100	9352 849 32551	LPC2387FBD100,551	NA	AVNET EXPRESS AMERICAS	7,703		5/21/2013
			EU	ARROW EUROPE	7,226		5/21/2013
			NA	ARROW ELECTRONICS	951		5/21/2013
			NA	DIGI-KEY CORPORATION	789		5/21/2013
			JAPAN	CHIP ONE STOP	170		05/21/2013
			NA	Newark element14	143	1	5/21/2013
			NA	WPG AMERICAS INC.	90		5/21/2013
			NA	FUTURE ELECTRONICS	74		5/20/2013
			EU	FUTURE ELECTRONICS UK	74		5/20/2013
			ASIA	FUTURE ELECTRONICS- ASIA	74		5/20/2013
			ASIA	WPI	40	90	05/21/2013
LPC2364FBD100	9352 824 63551	LPC2364FBD100,551	NA	AVNET EXPRESS AMERICAS	18,259		5/21/2013
			NA	DIGI-KEY CORPORATION	9,782		5/21/2013
			EU	ARROW EUROPE	1,140		5/21/2013
			ASIA	WPI	360	90	05/21/2013
			ASIA	AVNET EXPRESS ASIA	180		5/21/2013
			JAPAN	CHIP ONE STOP	100		05/21/2013
			EU	Farnell Europe	21	1	05/21/2013
			NA	Newark element14	17	1	5/21/2013
			ASIA	Element 14	0	1	21/05/2013
LPC2377FBD144	9352 860 19551	LPC2377FBD144,551	JAPAN	CHIP ONE STOP	100		05/21/2013
			NA	DIGI-KEY CORPORATION	60		5/21/2013
			NA	FUTURE ELECTRONICS	60		5/20/2013
			EU	FUTURE ELECTRONICS UK	60		5/20/2013
			ASIA	FUTURE ELECTRONICS- ASIA	60		5/20/2013
LPC2361FBD100	9352 869 91551	LPC2361FBD100,551	NA	DIGI-KEY CORPORATION	1,447		5/21/2013
			NA	FUTURE ELECTRONICS	230		5/20/2013
			EU	FUTURE ELECTRONICS UK	230		5/20/2013
			ASIA	FUTURE ELECTRONICS- ASIA	230		5/20/2013
			NA	ARROW ELECTRONICS	119		5/21/2013
			JAPAN	CHIP ONE STOP	100		05/21/2013
			ASIA	WPI	80	90	05/21/2013
LPC2367FBD100	9352 860 18551	LPC2367FBD100,551	NA	DIGI-KEY CORPORATION	492		5/21/2013
			JAPAN	CHIP ONE STOP	100		05/21/2013
			EU	ARROW EUROPE	90		5/21/2013
			NA	ARROW ELECTRONICS	60		5/21/2013
LPC2368FBD100	9352 824 61551	LPC2368FBD100,551	NA	AVNET EXPRESS AMERICAS	11,644		5/21/2013
			NA	FUTURE ELECTRONICS	5,587		5/20/2013
			EU	FUTURE ELECTRONICS UK	5,587		5/20/2013
			ASIA	FUTURE ELECTRONICS- ASIA	5,587		5/20/2013
			NA	ARROW ELECTRONICS	3,419		5/21/2013
			ASIA	WPI	372	90	05/21/2013
			ASIA	AVNET EXPRESS ASIA	270		5/21/2013
			EU	Farnell Europe	186	1	05/21/2013
			JAPAN	CHIP ONE STOP	94		05/21/2013
			NA	Newark element14	91	1	5/21/2013
			EU	ARROW EUROPE	90		5/21/2013
			ASIA	Element 14	24	1	21/05/2013
LPC2364HBD100	9352 887 99551	LPC2364HBD100,551	NA	AVNET EXPRESS AMERICAS	180		5/21/2013
			NA	ARROW ELECTRONICS	180		5/21/2013
			NA	DIGI-KEY CORPORATION	120		5/21/2013
			JAPAN	CHIP ONE STOP	10		05/21/2013
LPC2365FBD100	9352 860 17551	LPC2365FBD100,551	ASIA	WPI	458	90	05/21/2013
			NA	ARROW ELECTRONICS	180		5/21/2013
			JAPAN	CHIP ONE STOP	120		05/21/2013
			NA	DIGI-KEY CORPORATION	79		5/21/2013
			NA	FUTURE ELECTRONICS	30		5/20/2013
			EU	FUTURE ELECTRONICS UK	30		5/20/2013
			ASIA	FUTURE ELECTRONICS- ASIA	30		5/20/2013
			EU	ARROW EUROPE	30		5/21/2013
			NA	AVNET EXPRESS AMERICAS	20		5/21/2013
LPC2364FET100	9352 851 03518	LPC2364FET100,518	NA	DIGI-KEY CORPORATION	166		5/21/2013
LPC2368FET100	9352 851 02518	LPC2368FET100,518	NA	ARROW ELECTRONICS	935		5/21/2013
			NA	FUTURE ELECTRONICS	279		5/20/2013
			EU	FUTURE ELECTRONICS UK	279		5/20/2013
			ASIA	FUTURE ELECTRONICS- ASIA	279		5/20/2013
			NA	DIGI-KEY CORPORATION	71		5/21/2013
			JAPAN	CHIP ONE STOP	10		05/21/2013

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LPC2300

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Latest videos

LPC4300: Inter-processor communication (Cortex-M4 ...

Introduction to NXP's LPC4300 Cortex-M4 based digi...

Elevator pitch for MCU...

Parametrics of this product

Package

Outline drawing

Related documents

Reflow soldering

Wave soldering

Quality, reliability & chemical content

Quality and reliability disclaimer

Documentation for this product

Ordering & availability

Sample

Technical support

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