LPC3100

LPC3100


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The NXP LPC3100 combines an 180 MHz ARM926EJ-S CPU core, high-speed USB 2.0 On-The-Go (OTG), up to 192 KB SRAM, NAND flash controller, flexible external bus interface, four channel 10-bit ADC, and a myriad of serial and parallel interfaces in a single chip targeted at consumer, industrial, medical, and communication markets.

Show functional diagram

Block diagram: LPC3130FET180, LPC3131FET180
Block diagram: LPC3130FET180, LPC3131FET180
LPC3100 block diagram
LPC3100 block diagram

Parametrics of this product

Type numberPackageCorefmax [max](MHz)RAM(kB)I/O pinsUSBUARTSPISPI/SSPADC channelsADC(bits)# of timersTimer(bits)PWMTemperature rangeTemperature rangePLLDemoboardPackage nameProduct status
LPC3130FET180SOT570-3
(TFBGA180)
ARM9180969711114104321F-40 °C to +85 °CYTFBGA180Production
LPC3131FET180SOT570-3
(TFBGA180)
ARM91801929711114104321F-40 °C to +85 °CYTFBGA180Production
LPC3143FET180SOT570-3
(TFBGA180)
ARM9270192971114104321F-40 °C to +85 °CYOM11037TFBGA180Production
LPC3154FET208SOT930-1
(TFBGA208)
ARM91801927711113104321F-40 °C to +85 °CYOM11029TFBGA208Production
LPC3180FEL320SOT824-1
(LFBGA320)
ARM9208645517223102322F-40 °C to +85 °CYLFBGA320Production

Package

Type numberOrderable part numberOrdering code (12NC)Product statusPackagePackingMarking
LPC3130FET180LPC3130FET180,5519352 880 13551Volume productionSOT570-3
(TFBGA180)
Tray Dry Pack, Bakeable, SingleStandard Marking
LPC3131FET180LPC3131FET180,5519352 880 14551Volume productionSOT570-3
(TFBGA180)
Tray Dry Pack, Bakeable, SingleStandard Marking
LPC3143FET180LPC3143FET180,5519352 897 12551Volume productionSOT570-3
(TFBGA180)
Tray Dry Pack, Bakeable, SingleStandard Marking
LPC3154FET208LPC3154FET208,5519352 875 63551Volume productionSOT930-1
(TFBGA208)
Tray Dry Pack, Bakeable, SingleStandard Marking
LPC3180FEL320/01LPC3180FEL320/01,59352 869 83551Volume productionSOT824-1
(LFBGA320)
Tray Dry Pack, Bakeable, SingleStandard Marking

The variants in the table below are discontinued. See the table Discontinuation information at the bottom of this page for more information.

Type numberOrderable part numberOrdering code (12NC)Product statusPackagePackingMarking
LPC3180FEL320LPC3180FEL320,5519352 818 74551Discontinued
cement productReplacement product
SOT824-1
(LFBGA320)
Tray Dry Pack, Bakeable, SingleStandard Marking

Outline drawing

Package VersionPackage NamePackage DescriptionReference CodesIssue Date
SOT930-1TFBGA208plastic thin fine-pitch ball grid array package; 208 balls; body 12 x 12 x 0.7 mm2006-01-03
SOT570-3TFBGA180thin fine-pitch ball grid array package; 180 balls2010-04-15
SOT824-1LFBGA320plastic low profile fine-pitch ball grid array package; 320 balls; body 13 x 13 x 0.9 mm2003-07-09

Related documents

Reflow soldering

Discontinuation information

Type numberOrdering code (12NC)Last-time buy dateLast-time delivery dateReplacement productDN NoticeStatusComments
LPC3180FEL32093528187455131-Mar-1330-Jun-13LPC3180FEL320/01DN NXP-DN_201206034DN
    Standard End of Life. Sole Source.

    Quality, reliability & chemical content

    Type numberOrderable part numberChemical contentRoHSLeadfree conversion dateRHFIFR (FIT)MTBF (hours)MSLMSL LF
    LPC3130FET180LPC3130FET180,551LPC3130FET180Always Pb-free2.842.5839793281653747E8NA3
    LPC3131FET180LPC3131FET180,551LPC3131FET180Always Pb-free2.842.5839793281653747E8NA3
    LPC3143FET180LPC3143FET180,551LPC3143FET180Always Pb-freeNA3
    LPC3154FET208LPC3154FET208,551LPC3154FET208Always Pb-free2.842.5839793281653747E8NA3
    LPC3180FEL320/01LPC3180FEL320/01,5LPC3180FEL320/01Always Pb-free2.842.5839793281653747E8NA3

    The variants in the table below are discontinued. See the table Discontinuation information at the bottom of this page for more information.

    Type numberOrderable part numberChemical contentRoHSLeadfree conversion dateRHFIFR (FIT)MTBF (hours)MSLMSL LF
    LPC3180FEL320LPC3180FEL320,551LPC3180FEL320Always Pb-free2.842.5839793281653747E8NA3
    Quality and reliability disclaimer

    Quality and reliability disclaimer

    Important Legal Notice on the product/generic quality information, No Warranty

    NXP Semiconductors is providing this data for your convenience only. Please note however that NO WARRANTY, REPRESENTATION, GUARANTEE OR LEGALLY BINDING PRODUCT DESCRIPTION is provided by publishing this informational data, nor does NXP Semiconductors acknowledge or accept any liability related thereto. The documentation and data on NXP Semiconductors products can be found in the data sheets as officially published by NXP Semiconductors. For all purchase of products from NXP Semiconductors the NXP Semiconductors' General Terms and Conditions of Commercial Sale will apply.

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    NXP Semiconductors' products are specifically designed and manufactured to be used within the electrical, thermal, mechanical and other parameters set forth in NXP Semiconductors' data sheets. Quality and reliability data provided by NXP Semiconductors, such as MTBF, MSL and FIT, is intended to be a non-binding estimate of product performance based upon diffusion process, history only. It does not imply that any performance levels reflected in such data can be met if the product is operated outside the conditions expressly stated in the latest published data sheet for a device or in your application.

    The RoHS data provided hereunder is preliminary and non binding for NXP Semiconductors. NXP Semiconductors does not accept any liability related to this data.

    NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage nor for any other use that is not explicitly agreed between the parties. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk.

    Any use of NXP Semiconductors' products beyond the scope defined in the current NXP Semiconductors' data sheet voids all warranty responsibility of NXP Semiconductors with respect to such devices, and also voids all responsibility of NXP Semiconductors with respect to any applications assistance, product design, software performance or services of any kind that were or may have been performed in connection with the sale of any such devices.

    Further, resale of NXP Semiconductors' products or services with statements different from or beyond the parameters stated by NXP Semiconductors for that product in official NXP Semiconductors data sheets, or without the warnings or instructions provided by NXP Semiconductors, voids all express and any implied warranties for the associated NXP Semiconductors product or service, and is an unfair and deceptive business practice.

    Discontinuation information

    Type numberOrdering code (12NC)Last-time buy dateLast-time delivery dateReplacement productDN NoticeStatusComments
    LPC3180FEL32093528187455131-Mar-1330-Jun-13LPC3180FEL320/01DN NXP-DN_201206034DN
      Standard End of Life. Sole Source.

      Documentation for this product

      File nameTitleTypeFormatDate
      LPC3130_31Low-cost, low-power ARM926EJ-S MCUs with high-speed USB 2.0 OTG, SD/MMC, and NAND flash controllerData sheetpdf2012-05-29
      LPC318016/32-bit ARM microcontroller; hardware floating-point coprocessor, USB On-The-Go, and SDRAM memory interfaceData sheetpdf2007-02-15
      LPC3152_54ARM926EJ microcontrollers with USB High-speed OTG, SD/MMC, NAND flash controller, and audio codecData sheetpdf2012-05-31
      LPC3141_43Low-cost, low-power ARM926EJ microcontrollers with USB High-speed OTG, SD/MMC, and NAND flash controllerData sheetpdf2012-06-04
      AN10880Using the LCD interface in the LPC313x/LPC314x/LPC315x devicesApplication notepdf2009-11-10
      LPC3131_NAND_flashingAN10901 - LPC3131 NAND flashingApplication notezip2010-01-07
      75016629Industry’s Lowest Cost ARM9 with High Speed USB 2.0 OTG; NXP ARM926EJ-S processor LPC313xLeafletpdf2008-09-01
      75016606Low-power, ARM9-based microcontroller; 266-MHz, 32-bit microcontroller with ARM9EJ-S™ core LPC3180/01Leafletpdf2008-08-01
      LPC3141andLPC3143Lowest Cost ARM9 with HS USB 2.0 OTG & Decryption EngineLeafletpdf2009-05-01
      LPC313x_SPI_ProgrammerAN10811 sample codeOther typezip2009-04-30
      UM10314LPC3130/31 User manualUser manualpdf2012-06-26

      Ordering & availability

      Type numberOrdering code (12NC)Orderable part numberRegionDistributorIn stockOrder quantityInventory dateBuy onlineSamples
      LPC3143FET1809352 897 12551LPC3143FET180,551NAAVNET EXPRESS AMERICAS2,0925/20/2013Buy online 
         ASIAWPI94518905/20/2013Buy online 
         NADIGI-KEY CORPORATION155/18/2013Buy online 
         JAPANCHIP ONE STOP1005/20/2013Buy online 
      LPC3154FET2089352 875 63551LPC3154FET208,551JAPANCHIP ONE STOP1005/20/2013Buy online 
         EUFarnell Europe8105/20/2013Buy online 
         ASIAElement 140120/05/2013Buy online 
      LPC3131FET1809352 880 14551LPC3131FET180,551EUAVNET EXPRESS EUROPE4,1585/20/2013Buy online 
         ASIAWPI1,75118905/20/2013Buy online 
         NAAVNET EXPRESS AMERICAS2185/20/2013Buy online 
         NAARROW ELECTRONICS1895/20/2013Buy online 
         NANewark element1413915/20/2013Buy online 
         EUFarnell Europe134105/20/2013Buy online 
         EUARROW EUROPE485/8/2013Buy online 
         ASIAElement 1410120/05/2013Buy online 
      LPC3180FEL320/019352 869 83551LPC3180FEL320/01,5NAAVNET EXPRESS AMERICAS2985/20/2013Buy online 
         NADIGI-KEY CORPORATION1605/18/2013Buy online 
         NAARROW ELECTRONICS1605/20/2013Buy online 
         EUFarnell Europe131105/20/2013Buy online 
         JAPANCHIP ONE STOP1005/20/2013Buy online 
         NAFUTURE ELECTRONICS45/19/2013Buy online 
         EUFUTURE ELECTRONICS UK45/19/2013Buy online 
         ASIAFUTURE ELECTRONICS- ASIA45/19/2013Buy online 
         ASIAElement 140120/05/2013Buy online 
      LPC3130FET1809352 880 13551LPC3130FET180,551EUARROW EUROPE1,8905/8/2013Buy online 
         NADIGI-KEY CORPORATION1,0845/18/2013Buy online 
         ASIAAVNET EXPRESS ASIA9455/20/2013Buy online 
         EUFarnell Europe748105/20/2013Buy online 
         NAAVNET EXPRESS AMERICAS1875/20/2013Buy online 
         NANewark element141791895/20/2013Buy online 
         ASIAWPI12018905/20/2013Buy online 
         JAPANCHIP ONE STOP8905/20/2013Buy online 
         NANEWARK/ELEMENT14185/20/2013Buy online 
         NANewark element141815/20/2013Buy online 
         ASIAElement 1410120/05/2013Buy online 
         ASIASACL - Hong Kong/Chinayes18905/01/2013Buy online 

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