LPC1300

72 MHz Cortex-M3, Single power supply (1.8 V to 3.6 V), 10-bit ADC, I2C, SPI, power profiles, 256 byte flash page

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Parametrics
Products / Packages / Packing
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The LPC1300 devices are for embedded applications featuring a high level of integration and low power consumption that offers system enhancements such as enhanced debug features and a higher level of support block integration. The LPC1300 devices operate at CPU frequencies of up to 72 MHz. The ARM Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals.

Parametrics of this product

Type number	Package	Core	f_max [max](MHz)	FLASH(kB)	RAM(kB)	I/O pins	USB	UART	I²C	SPI	SPI/SSP	ADC channels	ADC(bits)	# of timers	Timer(bits)	PWM	Temperature range	Temperature range	PLL	Demoboard	Package name	Product status
LPC1311FHN33	SOT865-3 (HVQFN32)	Cortex-M3	72	8	4	28		1	1	1	1	8	10	4	32	11	F	-40 °C to +85 °C	Y	OM11040; OM11039	HVQFN32	Production
LPC1313FBD48	SOT313-2 (LQFP48)	Cortex-M3	72	32	8	42		1	1	1	1	8	10	4	32	11	F	-40 °C to +85 °C	Y	OM11040; OM11039	LQFP48	Production
LPC1313FHN33	SOT865-3 (HVQFN32)	Cortex-M3	72	32	8	28		1	1	1	1	8	10	4	32	11	F	-40 °C to +85 °C	Y	OM11040; OM11039	HVQFN32	Production
LPC1315FBD48	SOT313-2 (LQFP48)	Cortex-M3	72	32	8	40		1	1	2	2	8	12	4	32	11	F	-40 °C to +85 °C	Y		LQFP48	Production
LPC1315FHN33	SOT865-3 (HVQFN32)	Cortex-M3	72	32	8	28		1	1	2	2	8	12	4	32	11	F	-40 °C to +85 °C	Y		HVQFN32	Production
LPC1316FBD48	SOT313-2 (LQFP48)	Cortex-M3	72	48	8	40		1	1	2	2	8	12	4	32	11	F	-40 °C to +85 °C	Y		LQFP48	Production
LPC1316FHN33	SOT865-3 (HVQFN32)	Cortex-M3	72	48	8	28		1	1	2	2	8	12	4	32	11	F	-40 °C to +85 °C	Y		HVQFN32	Production
LPC1317FBD48	SOT313-2 (LQFP48)	Cortex-M3	72	64	10	40		1	1	2	2	8	12	4	32	11	F	-40 °C to +85 °C	Y		LQFP48	Production
LPC1317FBD64	SOT314-2 (LQFP64)	Cortex-M3	72	64	10	51		1	1	2	2	8	12	4	32	11	F	-40 °C to +85 °C	Y		LQFP64	Production
LPC1317FHN33	SOT865-3 (HVQFN32)	Cortex-M3	72	64	10	28		1	1	2	2	8	12	4	32	11	F	-40 °C to +85 °C	Y		HVQFN32	Production
LPC1342FBD48	SOT313-2 (LQFP48)	Cortex-M3	72	16	4	42	1	1	1	1	1	8	12	4	32	11	F	-40 °C to +85 °C	Y	OM11040; OM11039	LQFP48	Production
LPC1342FHN33	SOT865-3 (HVQFN32)	Cortex-M3	72	16	4	28	1	1	1	1	1	8	12	4	32	11	F	-40 °C to +85 °C	Y	OM11040; OM11039	HVQFN32	Production
LPC1343FBD48	SOT313-2 (LQFP48)	Cortex-M3	72	32	8	42	1	1	1	1	1	8	12	4	32	11	F	-40 °C to +85 °C	Y	OM11040; OM11039	LQFP48	Production
LPC1343FHN33	SOT865-3 (HVQFN32)	Cortex-M3	72	32	8	28	1	1	1	1	1	8	12	4	32	11	F	-40 °C to +85 °C	Y	OM11040; OM11039	HVQFN32	Production
LPC1345FBD48	SOT313-2 (LQFP48)	Cortex-M3	72	32	10	40	1	1	1	2	2	8	12	4	32	11	F	-40 °C to +85 °C	Y		LQFP48	Production
LPC1345FHN33	SOT865-3 (HVQFN32)	Cortex-M3	72	32	10	26	1	1	1	2	2	8	12	4	32	11	F	-40 °C to +85 °C	Y		HVQFN32	Production
LPC1346FBD48	SOT313-2 (LQFP48)	Cortex-M3	72	48	10	40	1	1	1	2	2	8	12	4	32	11	F	-40 °C to +85 °C	Y		LQFP48	Production
LPC1346FHN33	SOT865-3 (HVQFN32)	Cortex-M3	72	48	10	26	1	1	1	2	2	8	12	4	32	11	F	-40 °C to +85 °C	Y		HVQFN32	Production
LPC1347FBD48	SOT313-2 (LQFP48)	Cortex-M3	72	64	12	40	1	1	1	2	2	8	12	4	32	11	F	-40 °C to +85 °C	Y	OM13045; OM13045	LQFP48	Production
LPC1347FBD64	SOT314-2 (LQFP64)	Cortex-M3	72	64	12	51	1	1	1	2	2	8	12	4	32	11	F	-40 °C to +85 °C	Y	OM13045	LQFP64	Production
LPC1347FHN33	SOT865-3 (HVQFN32)	Cortex-M3	72	64	12	26	1	1	1	2	2	8	12	4	32	11	F	-40 °C to +85 °C	Y	OM13045	HVQFN32	Production

Package

Type number	Orderable part number	Ordering code (12NC)	Product status	Package	Packing	Marking
LPC1311FHN33	LPC1311FHN33,551	9352 896 54551	Volume production	SOT865-3 (HVQFN32)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1311FHN33/01	LPC1311FHN33/01,55	9352 950 11551	Volume production	SOT865-3 (HVQFN32)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1313FBD48	LPC1313FBD48,151	9352 896 51151	Volume production	SOT313-2 (LQFP48)	Tray Pack, Bakeable, Single	Standard Marking
LPC1313FBD48/01	LPC1313FBD48/01,15	9352 950 13151	Volume production	SOT313-2 (LQFP48)	Tray Pack, Bakeable, Single	Standard Marking
LPC1313FHN33	LPC1313FHN33,551	9352 896 53551	Volume production	SOT865-3 (HVQFN32)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1313FHN33/01	LPC1313FHN33/01,55	9352 950 12551	Volume production	SOT865-3 (HVQFN32)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1313FHN33/01	LPC1313FHN33/01,51	9352 950 12518	Volume production	SOT865-3 (HVQFN32)	Reel Dry Pack, SMD, 13"	Standard Marking
LPC1315FBD48	LPC1315FBD48,551	9352 974 86551	Volume production	SOT313-2 (LQFP48)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1315FHN33	LPC1315FHN33,551	9352 975 12551	Volume production	SOT865-3 (HVQFN32)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1316FBD48	LPC1316FBD48,551	9352 974 87551	Volume production	SOT313-2 (LQFP48)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1316FHN33	LPC1316FHN33,551	9352 975 13551	Volume production	SOT865-3 (HVQFN32)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1317FBD48	LPC1317FBD48,551	9352 974 88551	Volume production	SOT313-2 (LQFP48)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1317FBD64	LPC1317FBD64,551	9352 974 93551	Volume production	SOT314-2 (LQFP64)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1317FHN33	LPC1317FHN33,551	9352 975 14551	Volume production	SOT865-3 (HVQFN32)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1342FBD48	LPC1342FBD48,151	9352 927 53151	Volume production	SOT313-2 (LQFP48)	Tray Pack, Bakeable, Single	Standard Marking
LPC1342FBD48	LPC1342FBD48,118	9352 927 53118	Volume production	SOT313-2 (LQFP48)	Reel Pack, SMD, 13"	Standard Marking
LPC1342FHN33	LPC1342FHN33,551	9352 896 56551	Volume production	SOT865-3 (HVQFN32)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1342FHN33	LPC1342FHN33,518	9352 896 56518	Volume production	SOT865-3 (HVQFN32)	Reel Dry Pack, SMD, 13"	Standard Marking
LPC1343FBD48	LPC1343FBD48,151	9352 896 52151	Volume production	SOT313-2 (LQFP48)	Tray Pack, Bakeable, Single	Standard Marking
LPC1343FHN33	LPC1343FHN33,551	9352 896 55551	Volume production	SOT865-3 (HVQFN32)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1343FHN33	LPC1343FHN33,518	9352 896 55518	Volume production	SOT865-3 (HVQFN32)	Reel Dry Pack, SMD, 13"	Standard Marking
LPC1345FBD48	LPC1345FBD48,151	9352 974 89151	Volume production	SOT313-2 (LQFP48)	Tray Pack, Bakeable, Single	Standard Marking
LPC1345FHN33	LPC1345FHN33,551	9352 975 15551	Volume production	SOT865-3 (HVQFN32)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1346FBD48	LPC1346FBD48,151	9352 974 91151	Volume production	SOT313-2 (LQFP48)	Tray Pack, Bakeable, Single	Standard Marking
LPC1346FHN33	LPC1346FHN33,551	9352 975 16551	Volume production	SOT865-3 (HVQFN32)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1347FBD48	LPC1347FBD48,151	9352 974 92151	Volume production	SOT313-2 (LQFP48)	Tray Pack, Bakeable, Single	Standard Marking
LPC1347FBD64	LPC1347FBD64,551	9352 974 94551	Volume production	SOT314-2 (LQFP64)	Tray Dry Pack, Bakeable, Single	Standard Marking
LPC1347FHN33	LPC1347FHN33,551	9352 975 17551	Volume production	SOT865-3 (HVQFN32)	Tray Dry Pack, Bakeable, Single	Standard Marking

Outline drawing

Package Version	Package Name	Package Description	Reference Codes	Issue Date
SOT865-3	HVQFN32	plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm	MO-220 (JEDEC);	2009-02-05
SOT313-2	LQFP48	plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm	MS-026 (JEDEC); 136E05 (IEC);	2003-02-25
SOT314-2	LQFP64	plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm	MS-026 (JEDEC); 136E10 (IEC);	2003-02-25

Quality, reliability & chemical content

Type number	Orderable part number	Chemical content	Leadfree conversion date	MSL	MSL LF
LPC1311FHN33	LPC1311FHN33,551	LPC1311FHN33	Always Pb-free	3	3
LPC1311FHN33/01	LPC1311FHN33/01,55	LPC1311FHN33/01	Always Pb-free	3	3
LPC1313FBD48	LPC1313FBD48,151	LPC1313FBD48	Always Pb-free	1	1
LPC1313FBD48/01	LPC1313FBD48/01,15	LPC1313FBD48/01	Always Pb-free	1	1
LPC1313FHN33	LPC1313FHN33,551	LPC1313FHN33	Always Pb-free	3	3
LPC1313FHN33/01	LPC1313FHN33/01,55	LPC1313FHN33/01	Always Pb-free	3	3
LPC1313FHN33/01	LPC1313FHN33/01,51	LPC1313FHN33/01	Always Pb-free	3	3
LPC1315FBD48	LPC1315FBD48,551	LPC1315FBD48	Always Pb-free	1	3
LPC1315FHN33	LPC1315FHN33,551	LPC1315FHN33	Always Pb-free	3	3
LPC1316FBD48	LPC1316FBD48,551	LPC1316FBD48	Always Pb-free	1	3
LPC1316FHN33	LPC1316FHN33,551	LPC1316FHN33	Always Pb-free	3	3
LPC1317FBD48	LPC1317FBD48,551	LPC1317FBD48	Always Pb-free	1	3
LPC1317FBD64	LPC1317FBD64,551	LPC1317FBD64	Always Pb-free	1	3
LPC1317FHN33	LPC1317FHN33,551	LPC1317FHN33	Always Pb-free	3	3
LPC1342FBD48	LPC1342FBD48,151	LPC1342FBD48	Always Pb-free	1	1
LPC1342FBD48	LPC1342FBD48,118	LPC1342FBD48	Always Pb-free	1	1
LPC1342FHN33	LPC1342FHN33,551	LPC1342FHN33	Always Pb-free	3	3
LPC1342FHN33	LPC1342FHN33,518	LPC1342FHN33	Always Pb-free	3	3
LPC1343FBD48	LPC1343FBD48,151	LPC1343FBD48	Always Pb-free	1	1
LPC1343FHN33	LPC1343FHN33,551	LPC1343FHN33	Always Pb-free	3	3
LPC1343FHN33	LPC1343FHN33,518	LPC1343FHN33	Always Pb-free	3	3
LPC1345FBD48	LPC1345FBD48,151	LPC1345FBD48	Always Pb-free	1	1
LPC1345FHN33	LPC1345FHN33,551	LPC1345FHN33	Always Pb-free	3	3
LPC1346FBD48	LPC1346FBD48,151	LPC1346FBD48	Always Pb-free	1	1
LPC1346FHN33	LPC1346FHN33,551	LPC1346FHN33	Always Pb-free	3	3
LPC1347FBD48	LPC1347FBD48,151	LPC1347FBD48	Always Pb-free	1	1
LPC1347FBD64	LPC1347FBD64,551	LPC1347FBD64	Always Pb-free	1	3
LPC1347FHN33	LPC1347FHN33,551	LPC1347FHN33	Always Pb-free	3	3

Quality and reliability disclaimer

Important Legal Notice on the product/generic quality information, No Warranty

NXP Semiconductors is providing this data for your convenience only. Please note however that NO WARRANTY, REPRESENTATION, GUARANTEE OR LEGALLY BINDING PRODUCT DESCRIPTION is provided by publishing this informational data, nor does NXP Semiconductors acknowledge or accept any liability related thereto. The documentation and data on NXP Semiconductors products can be found in the data sheets as officially published by NXP Semiconductors. For all purchase of products from NXP Semiconductors the NXP Semiconductors' General Terms and Conditions of Commercial Sale will apply.

NXP SEMICONDUCTORS PROVIDES THE DATA HEREUNDER “AS IS” WITHOUT WARRANTY WHATSOEVER. NXP SEMICONDUCTORS DOES NOT WARRANT OR REPRESENT THAT ANY DATA PROVIDED ON THIS WEBSITE IS CORRECT OR FIT FOR A PARTICULAR PURPOSE WHATSOEVER. IT IS PROVIDED WITHOUT ANY WARRANTY WHATSOEVER, WHETHER EXPRESS, IMPLIED OR OTHERWISE, REGARDING ITS ACCURACY, COMPLETENESS NONINFRINGEMENT OF INTELLECTUAL PROPERTY OR OTHERWISE AND MAY BE CHANGED, MODIFIED OR DELETED BY NXP SEMICONDUCTORS AT ANY TIME.

Any use of the data provided hereunder is at your own risk.

IN NO EVENT SHALL NXP SEMICONDUCTORS, BE LIABLE FOR ANY DIRECT, SPECIAL, INDIRECT, CONSEQUENTIAL, PUNITIVE, OR INCIDENTAL DAMAGES (INCLUDING WITHOUT LIMITATION DAMAGES FOR LOSS OF BUSINESS, BUSINESS INTERRUPTION, LOSS OF USE, LOSS OF DATA OR INFORMATION, AND THE LIKE) ARISING OUT OF THE USE OF THE DATA, WHETHER OR NOT BASED ON TORT (INCLUDING NEGLIGENCE), STRICT LIABILITY, BREACH OF CONTRACT, BREACH OF WARRANTY OR ANY OTHER THEORY, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. NOTWITHSTANDING ANY DAMAGES THAT YOU MIGHT INCUR FOR ANY REASON WHATSOEVER (INCLUDING, WITHOUT LIMITATION, ALL DAMAGES REFERENCED ABOVE AND ALL GENERAL DAMAGES), THE ENTIRE LIABILITY OF NXP SEMICONDUCTORS, AND YOUR EXCLUSIVE REMEDY FOR ALL OF THE FOREGOING SHALL BE LIMITED TO ACTUAL DAMAGES INCURRED BY YOU BASED ON REASONABLE RELIANCE UP TO ONE DOLLARS (US$1.00). THE FOREGOING LIMITATIONS, EXCLUSIONS AND DISCLAIMERS SHALL APPLY TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, EVEN IF ANY REMEDY FAILS OF ITS ESSENTIAL PURPOSE.

Your use of this data, and all consequences of such use, is solely your responsibility. You must perform sufficient engineering and additional qualification testing in order to properly evaluate your application and determine whether a candidate NXP Semiconductors device is suitable for use in that application.

NXP Semiconductors' products are specifically designed and manufactured to be used within the electrical, thermal, mechanical and other parameters set forth in NXP Semiconductors' data sheets. Quality and reliability data provided by NXP Semiconductors, such as MTBF, MSL and FIT, is intended to be a non-binding estimate of product performance based upon diffusion process, history only. It does not imply that any performance levels reflected in such data can be met if the product is operated outside the conditions expressly stated in the latest published data sheet for a device or in your application.

The RoHS data provided hereunder is preliminary and non binding for NXP Semiconductors. NXP Semiconductors does not accept any liability related to this data.

NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage nor for any other use that is not explicitly agreed between the parties. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk.

Any use of NXP Semiconductors' products beyond the scope defined in the current NXP Semiconductors' data sheet voids all warranty responsibility of NXP Semiconductors with respect to such devices, and also voids all responsibility of NXP Semiconductors with respect to any applications assistance, product design, software performance or services of any kind that were or may have been performed in connection with the sale of any such devices.

Further, resale of NXP Semiconductors' products or services with statements different from or beyond the parameters stated by NXP Semiconductors for that product in official NXP Semiconductors data sheets, or without the warnings or instructions provided by NXP Semiconductors, voids all express and any implied warranties for the associated NXP Semiconductors product or service, and is an unfair and deceptive business practice.

Documentation for this product

Download all documentation (zip)

File name	Title	Type	Format	Date
LPC1311_13_42_43	32-bit ARM Cortex-M3 microcontroller; up to 32 kB flash and 8 kB SRAM; USB device	Data sheet	pdf	2012-06-06
LPC1315_16_17_45_46_47	32-bit ARM Cortex-M3 microcontroller; up to 64 kB flash; up to 12 kB SRAM; USB device; USART; EEPROM	Data sheet	pdf	2012-09-20
75016842	Low-cost development platform for 32-bit LPC microcontroller family; NXP LPCXpresso	Leaflet	pdf	2011-01-28
75016895	Low-power Cortex-M3 based microcontrollers simplify USB designs; NXP 72 MHz, 32-bit Cortex-M3™ microcontrollers LPC1300	Leaflet	pdf	2011-01-28
LPC1300_chipshot	LPC1300	MarCom	jpg	2011-01-27

Ordering & availability

Type number	Ordering code (12NC)	Orderable part number	Region	Distributor	In stock	Order quantity	Inventory date	Samples
LPC1315FHN33	9352 975 12551	LPC1315FHN33,551	EU	Farnell Europe	289	1	05/22/2013
			JAPAN	CHIP ONE STOP	260		05/22/2013
			NA	NEWARK/ELEMENT14	259		5/22/2013
			ASIA	Element 14	18	1	22/05/2013
LPC1317FBD48	9352 974 88551	LPC1317FBD48,551	JAPAN	CHIP ONE STOP	248		05/22/2013
			NA	DIGI-KEY CORPORATION	204		5/22/2013
			NA	NEWARK/ELEMENT14	132		5/22/2013
			EU	Farnell Europe	132	1	05/22/2013
			ASIA	Element 14	14	1	22/05/2013
LPC1313FBD48	9352 896 51151	LPC1313FBD48,151	EU	ARROW EUROPE	4,436		5/22/2013	Not available
			ASIA	WPI	500	250	05/22/2013
			NA	DIGI-KEY CORPORATION	322		5/22/2013
			JAPAN	CHIP ONE STOP	250		05/22/2013
			EU	Farnell Europe	209	1	05/22/2013
			NA	FUTURE ELECTRONICS	110		5/21/2013
			EU	FUTURE ELECTRONICS UK	110		5/21/2013
			ASIA	FUTURE ELECTRONICS- ASIA	110		5/21/2013
			ASIA	Element 14	0	1	22/05/2013
LPC1313FBD48/01	9352 950 13151	LPC1313FBD48/01,15	NA	DIGI-KEY CORPORATION	245		5/22/2013
			EU	Farnell Europe	245	1	05/22/2013
			NA	Newark element14	2	1	5/22/2013
			ASIA	Element 14	0	1	22/05/2013
LPC1342FBD48	9352 927 53151	LPC1342FBD48,151	JAPAN	CHIP ONE STOP	260		05/22/2013
			NA	DIGI-KEY CORPORATION	193		5/22/2013
LPC1342FBD48	9352 927 53118	LPC1342FBD48,118	NA	AVNET EXPRESS AMERICAS	2,000		5/22/2013	Not available
LPC1347FBD48	9352 974 92151	LPC1347FBD48,151	NA	ARROW ELECTRONICS	2,500		5/22/2013
			JAPAN	CHIP ONE STOP	211		05/22/2013
			NA	AVNET EXPRESS AMERICAS	80		5/22/2013
			EU	Farnell Europe	48	1	05/22/2013
			NA	DIGI-KEY CORPORATION	22		5/22/2013
			NA	NEWARK/ELEMENT14	13		5/22/2013
			ASIA	Element 14	2	1	22/05/2013
LPC1315FBD48	9352 974 86551	LPC1315FBD48,551	JAPAN	CHIP ONE STOP	397		05/22/2013
			NA	NEWARK/ELEMENT14	131		5/22/2013
			EU	Farnell Europe	131	1	05/22/2013
			NA	DIGI-KEY CORPORATION	9		5/22/2013
			ASIA	Element 14	5	1	22/05/2013
LPC1342FHN33	9352 896 56551	LPC1342FHN33,551	ASIA	ARROW ASIA PAC LTD	10,140		1/31/2013
			NA	DIGI-KEY CORPORATION	480		5/22/2013
			NA	ARROW ELECTRONICS	348		5/22/2013
			NA	AVNET EXPRESS AMERICAS	310		5/22/2013
			JAPAN	CHIP ONE STOP	270		05/22/2013
			EU	ARROW EUROPE	260		5/22/2013
			EU	Farnell Europe	94	1	05/22/2013
			ASIA	Element 14	38	1	22/05/2013
			ASIA	Element 14	0	1	22/05/2013
LPC1342FHN33	9352 896 56518	LPC1342FHN33,518	NA	ARROW ELECTRONICS	4,000		5/22/2013	Not available
			ASIA	Element 14	38	1	22/05/2013
LPC1345FHN33	9352 975 15551	LPC1345FHN33,551	JAPAN	CHIP ONE STOP	260		05/22/2013
			NA	NEWARK/ELEMENT14	223		5/22/2013
			EU	Farnell Europe	223	1	05/22/2013
			ASIA	Element 14	14	1	22/05/2013
LPC1343FHN33	9352 896 55551	LPC1343FHN33,551	NA	AVNET EXPRESS AMERICAS	2,214		5/22/2013
			JAPAN	CHIP ONE STOP	270		05/22/2013
			EU	Farnell Europe	228	1	05/22/2013
			NA	FUTURE ELECTRONICS	137		5/21/2013
			EU	FUTURE ELECTRONICS UK	137		5/21/2013
			ASIA	FUTURE ELECTRONICS- ASIA	137		5/21/2013
			NA	ARROW ELECTRONICS	110		5/22/2013
			ASIA	Element 14	85	1	22/05/2013
			NA	DIGI-KEY CORPORATION	78		5/22/2013
			NA	Newark element14	53	260	5/22/2013
			EU	ARROW EUROPE	10		5/22/2013
			ASIA	Element 14	8	1	22/05/2013
LPC1343FHN33	9352 896 55518	LPC1343FHN33,518	EU	Farnell Europe	228	1	05/22/2013	Not available
			ASIA	Element 14	85	1	22/05/2013
LPC1346FHN33	9352 975 16551	LPC1346FHN33,551	JAPAN	CHIP ONE STOP	260		05/22/2013
			NA	NEWARK/ELEMENT14	217		5/22/2013
			EU	Farnell Europe	217	1	05/22/2013
			ASIA	Element 14	13	1	22/05/2013
LPC1311FHN33	9352 896 54551	LPC1311FHN33,551	NA	WPG AMERICAS INC.	9,620		5/22/2013	Not available
			ASIA	AVNET EXPRESS ASIA	3,900		5/22/2013
			NA	DIGI-KEY CORPORATION	1,211		5/22/2013
			NA	ARROW ELECTRONICS	820		5/22/2013
			EU	ARROW EUROPE	520		5/22/2013
			JAPAN	CHIP ONE STOP	355		05/22/2013
			NA	FUTURE ELECTRONICS	200		5/21/2013
			EU	FUTURE ELECTRONICS UK	200		5/21/2013
			ASIA	FUTURE ELECTRONICS- ASIA	200		5/21/2013
			NA	Newark element14	159	260	5/22/2013
			EU	Farnell Europe	138	1	05/22/2013
			ASIA	Element 14	10	1	22/05/2013
LPC1311FHN33/01	9352 950 11551	LPC1311FHN33/01,55	NA	ARROW ELECTRONICS	780		5/22/2013
			NA	DIGI-KEY CORPORATION	468		5/22/2013
LPC1316FHN33	9352 975 13551	LPC1316FHN33,551	JAPAN	CHIP ONE STOP	260		05/22/2013
			NA	NEWARK/ELEMENT14	239		5/22/2013
			EU	Farnell Europe	239	1	05/22/2013
			NA	DIGI-KEY CORPORATION	35		5/22/2013
			ASIA	Element 14	16	1	22/05/2013
LPC1343FBD48	9352 896 52151	LPC1343FBD48,151	ASIA	WPI	3,500	250	05/22/2013
			NA	DIGI-KEY CORPORATION	1,343		5/22/2013
			NA	FUTURE ELECTRONICS	1,283		5/21/2013
			EU	FUTURE ELECTRONICS UK	1,283		5/21/2013
			ASIA	FUTURE ELECTRONICS- ASIA	1,283		5/21/2013
			EU	Farnell Europe	781	1	05/22/2013
			JAPAN	CHIP ONE STOP	440		05/22/2013
			ASIA	Newark	407	1	22/05/2013
			NA	Newark element14	182	1	5/22/2013
			EU	Farnell Europe	175	1	05/22/2013
			NA	AVNET EXPRESS AMERICAS	170		5/22/2013
			NA	ARROW ELECTRONICS	136		5/22/2013
			ASIA	Element 14	80	1	22/05/2013
			ASIA	SACL - Hong Kong/China	yes	250	05/01/2013
LPC1346FBD48	9352 974 91151	LPC1346FBD48,151	NA	ARROW ELECTRONICS	500		5/22/2013
			JAPAN	CHIP ONE STOP	250		05/22/2013
			EU	Farnell Europe	236	1	05/22/2013
			NA	NEWARK/ELEMENT14	146		5/22/2013
			ASIA	Element 14	13	1	22/05/2013
LPC1347FBD64	9352 974 94551	LPC1347FBD64,551	JAPAN	CHIP ONE STOP	160		05/22/2013
			NA	DIGI-KEY CORPORATION	159		5/22/2013
			NA	NEWARK/ELEMENT14	99		5/22/2013
			EU	Farnell Europe	99	1	05/22/2013
			ASIA	Element 14	12	1	22/05/2013
LPC1313FHN33/01	9352 950 12551	LPC1313FHN33/01,55	NA	WPG AMERICAS INC.	260		5/22/2013
			NA	DIGI-KEY CORPORATION	235		5/22/2013
			EU	Farnell Europe	177	1	05/22/2013
			ASIA	Element 14	0	1	22/05/2013
LPC1313FHN33/01	9352 950 12518	LPC1313FHN33/01,51						Not available
LPC1313FHN33	9352 896 53551	LPC1313FHN33,551	NA	FUTURE ELECTRONICS	4,609		5/21/2013	Not available
			EU	FUTURE ELECTRONICS UK	4,609		5/21/2013
			ASIA	FUTURE ELECTRONICS- ASIA	4,609		5/21/2013
			NA	DIGI-KEY CORPORATION	624		5/22/2013
			JAPAN	CHIP ONE STOP	260		05/22/2013
			NA	ARROW ELECTRONICS	218		5/22/2013
			NA	Newark element14	110	260	5/22/2013
			EU	Farnell Europe	92	1	05/22/2013
			ASIA	Element 14	0	1	22/05/2013
LPC1317FBD64	9352 974 93551	LPC1317FBD64,551	JAPAN	CHIP ONE STOP	160		05/22/2013
			NA	NEWARK/ELEMENT14	112		5/22/2013
			EU	Farnell Europe	112	1	05/22/2013
			NA	DIGI-KEY CORPORATION	12		5/22/2013
			ASIA	Element 14	4	1	22/05/2013
LPC1317FHN33	9352 975 14551	LPC1317FHN33,551	NA	ARROW ELECTRONICS	280		5/22/2013
			JAPAN	CHIP ONE STOP	260		05/22/2013
			NA	NEWARK/ELEMENT14	212		5/22/2013
			EU	Farnell Europe	212	1	05/22/2013
			NA	DIGI-KEY CORPORATION	103		5/22/2013
			ASIA	Element 14	15	1	22/05/2013
LPC1316FBD48	9352 974 87551	LPC1316FBD48,551	JAPAN	CHIP ONE STOP	250		05/22/2013
			NA	NEWARK/ELEMENT14	63		5/22/2013
			EU	Farnell Europe	63	1	05/22/2013
			NA	DIGI-KEY CORPORATION	50		5/22/2013
			ASIA	Element 14	15	1	22/05/2013
LPC1345FBD48	9352 974 89151	LPC1345FBD48,151	NA	DIGI-KEY CORPORATION	244		5/22/2013
			JAPAN	CHIP ONE STOP	243		05/22/2013
			EU	Farnell Europe	226	1	05/22/2013
			NA	NEWARK/ELEMENT14	146		5/22/2013
			ASIA	Element 14	14	1	22/05/2013
LPC1347FHN33	9352 975 17551	LPC1347FHN33,551	NA	AVNET EXPRESS AMERICAS	260		5/22/2013
			JAPAN	CHIP ONE STOP	253		05/22/2013
			NA	NEWARK/ELEMENT14	165		5/22/2013
			EU	Farnell Europe	165	1	05/22/2013
			NA	DIGI-KEY CORPORATION	164		5/22/2013
			ASIA	Element 14	30	1	22/05/2013

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