BUK6607-55C

N-channel TrenchMOS logic and standard level FET


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Logic and standard level gate drive N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using advanced TrenchMOS technology. This product has been designed and qualified to the appropriate AEC Q101 standard for use in high performance automotive applications.

Features and benefits

  • AEC Q101 compliant
  • Suitable for standard and logic level gate drives
  • Suitable for thermally demanding environments due to 175 °C rating

Applications

  • 12 V and 24 V automotive systems
  • Electric and electro-hydraulic power steering
  • Motors, lamps and solenoid control
  • Start-Stop micro-hybrid applications
  • Transmission control
  • Ultra high performance power switching
All information on this product information page is subject to the subsequent disclaimers:

Parametrics of this product

SymbolParameterConditionsMinTyp/NomMaxUnit
VDSdrain-source voltageTj ≤ 175 °C; Tj ≥ 25 °C55V
IDdrain currentVGS = 10 V; Tmb = 25 °C [0]100A
Ptottotal power dissipationTmb = 25 °C158W
Static characteristics
RDSondrain-source on-state resistanceVGS = 10 V; ID = 25 A; Tj = 25 °C5.56.5
Dynamic characteristics
QGDgate-drain chargeID = 25 A; VDS = 44 V; VGS = 10 V19nC
Avalanche ruggedness
EDS(AL)Snon-repetitive drain-source avalanche energyID = 100 A; Vsup ≤ 55 V; RGS = 50 Ω; VGS = 10 V; Tj(init) = 25 °C; unclamped128mJ

Similar products

Package

Type numberPackageOutline versionReflow-/Wave solderingPackingProduct statusMarkingOrderable part number, (Ordering code (12NC))
BUK6607-55CD2PAK
(SOT404)
sot404_posot404_fr
Reel Pack, SMD, 13" Q1/T1ActiveBUK6607-55CBUK6607-55C,118
( 9340 642 36118 )

Pinning information

PinSymbolDescriptionSimplified outlineGraphic symbol
1GgateSOT404 (D2PAK)Graphic symbol
2Ddrain
3Ssource
mbDmounting base; connected to drain

Quality, reliability & chemical content

Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateMSLMSL LF
BUK6607-55CBUK6607-55C,118BUK6607-55C11
Quality and reliability disclaimer

Quality and reliability disclaimer

Important Legal Notice on the product/generic quality information, No Warranty

NXP Semiconductors is providing this data for your convenience only. Please note however that NO WARRANTY, REPRESENTATION, GUARANTEE OR LEGALLY BINDING PRODUCT DESCRIPTION is provided by publishing this informational data, nor does NXP Semiconductors acknowledge or accept any liability related thereto. The documentation and data on NXP Semiconductors products can be found in the data sheets as officially published by NXP Semiconductors. For all purchase of products from NXP Semiconductors the NXP Semiconductors' General Terms and Conditions of Commercial Sale will apply.

NXP SEMICONDUCTORS PROVIDES THE DATA HEREUNDER “AS IS” WITHOUT WARRANTY WHATSOEVER. NXP SEMICONDUCTORS DOES NOT WARRANT OR REPRESENT THAT ANY DATA PROVIDED ON THIS WEBSITE IS CORRECT OR FIT FOR A PARTICULAR PURPOSE WHATSOEVER. IT IS PROVIDED WITHOUT ANY WARRANTY WHATSOEVER, WHETHER EXPRESS, IMPLIED OR OTHERWISE, REGARDING ITS ACCURACY, COMPLETENESS NONINFRINGEMENT OF INTELLECTUAL PROPERTY OR OTHERWISE AND MAY BE CHANGED, MODIFIED OR DELETED BY NXP SEMICONDUCTORS AT ANY TIME.

Any use of the data provided hereunder is at your own risk.

IN NO EVENT SHALL NXP SEMICONDUCTORS, BE LIABLE FOR ANY DIRECT, SPECIAL, INDIRECT, CONSEQUENTIAL, PUNITIVE, OR INCIDENTAL DAMAGES (INCLUDING WITHOUT LIMITATION DAMAGES FOR LOSS OF BUSINESS, BUSINESS INTERRUPTION, LOSS OF USE, LOSS OF DATA OR INFORMATION, AND THE LIKE) ARISING OUT OF THE USE OF THE DATA, WHETHER OR NOT BASED ON TORT (INCLUDING NEGLIGENCE), STRICT LIABILITY, BREACH OF CONTRACT, BREACH OF WARRANTY OR ANY OTHER THEORY, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. NOTWITHSTANDING ANY DAMAGES THAT YOU MIGHT INCUR FOR ANY REASON WHATSOEVER (INCLUDING, WITHOUT LIMITATION, ALL DAMAGES REFERENCED ABOVE AND ALL GENERAL DAMAGES), THE ENTIRE LIABILITY OF NXP SEMICONDUCTORS, AND YOUR EXCLUSIVE REMEDY FOR ALL OF THE FOREGOING SHALL BE LIMITED TO ACTUAL DAMAGES INCURRED BY YOU BASED ON REASONABLE RELIANCE UP TO ONE DOLLARS (US$1.00). THE FOREGOING LIMITATIONS, EXCLUSIONS AND DISCLAIMERS SHALL APPLY TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, EVEN IF ANY REMEDY FAILS OF ITS ESSENTIAL PURPOSE.

Your use of this data, and all consequences of such use, is solely your responsibility. You must perform sufficient engineering and additional qualification testing in order to properly evaluate your application and determine whether a candidate NXP Semiconductors device is suitable for use in that application.

NXP Semiconductors' products are specifically designed and manufactured to be used within the electrical, thermal, mechanical and other parameters set forth in NXP Semiconductors' data sheets. Quality and reliability data provided by NXP Semiconductors, such as MTBF, MSL and FIT, is intended to be a non-binding estimate of product performance based upon diffusion process, history only. It does not imply that any performance levels reflected in such data can be met if the product is operated outside the conditions expressly stated in the latest published data sheet for a device or in your application.

The RoHS data provided hereunder is preliminary and non binding for NXP Semiconductors. NXP Semiconductors does not accept any liability related to this data.

NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage nor for any other use that is not explicitly agreed between the parties. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk.

Any use of NXP Semiconductors' products beyond the scope defined in the current NXP Semiconductors' data sheet voids all warranty responsibility of NXP Semiconductors with respect to such devices, and also voids all responsibility of NXP Semiconductors with respect to any applications assistance, product design, software performance or services of any kind that were or may have been performed in connection with the sale of any such devices.

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Documentation for this product

File nameTitleTypeFormatDate
BUK6607-55CN-channel TrenchMOS logic and standard level FETData sheetpdf2010-10-14
AN10273Power MOSFET single-shot and repetitive avalanche ruggedness ratingApplication notepdf2010-03-17
AN11158Understanding power MOSFET data sheet parametersApplication notepdf2014-02-04
AN11160Designing RC SnubbersApplication notepdf2012-10-01
AN11156Using Power MOSFET Zth CurvesApplication notepdf2012-10-10
AN11243Failure signature of Electrical Overstress on Power MOSFETsApplication notepdf2012-10-29
75016982Leading-edge Automotive Power MOSFETsBrochurepdf2010-09-15
75017462Automotive Grade Power MOSFETs: Performance, Quality, ReliabilitySelection guidepdf2014-02-03
75017590NXP's Power MOSFET Selection Guide 2014: Smaller, faster, coolerSelection guidepdf2014-09-11
BUK6607-55CBUK6607-55C SPICE modelSPICE modellib2012-04-12
BUK6607-55C_RC_Thermal_ModelBUK6607-55C RC Thermal ModelThermal designpdf2012-01-02
BUK6607-55CBUK6607-55C Thermal modelThermal modelpdml2010-09-24
sot404_frFootprint for reflow soldering SOT404Reflow solderingpdf2013-07-09
sot404_poplastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped)Outline drawingpdf2009-10-08
SOT404_118D2PAK; reel pack; standard product orientation; 12NC ending 118Packingpdf2012-11-20

Ordering & availability

Type numberOrdering code (12NC)Orderable part numberRegionDistributorIn stockOrder quantityInventory dateBuy onlineSamples
BUK6607-55C9340 642 36118BUK6607-55C,118NADigiKey6,169112/19/2014Buy online 
   ASIAWPI4,00080012/21/2014Buy online 
   EUFarnell Europe248119/12/2014Buy online 

Sample

Sample orders normally take 2-4 days for delivery.
If you do not have a direct account with NXP our network of global and regional distributors is available and equipped to support you with NXP samples. As a NXP customer you also have the option to order samples via our sales organisation.

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Find answers to your design questions on this page. If available you can find information in our NXP Support Community or you can find NXP models, Demo boards and Design tools.

Models

TitleTypeDate
BUK6607-55C SPICE modelSPICE model2012-04-12
BUK6607-55C RC Thermal ModelThermal design2012-01-02
BUK6607-55C Thermal modelThermal model2010-09-24

Frequently asked questions and Community discussions

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