
BLF7G22LS-130
Power LDMOS transistor
130 W LDMOS power transistor for base station applications at frequencies from 2000 MHz to 2200 MHz.
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| Test signal: 2-c WCDMA | ||||||
| PL(AV) | average output power | 30 | W | |||
| Gp | power gain | VDS = 28 V; PL(AV) = 30 W | 17 | 18.5 | dB | |
| ηD | drain efficiency | VDS = 28 V; IDq = 950 mA; PL(AV) = 30 W | 29 | 32 | % | |
| ACPR | adjacent channel power ratio | PL(AV) = 30 W; VDS = 28 V; IDq = 950 mA; 2110 MHz ≤ f ≤ 2170 MHz | -31 | -28 | dBc | |
| RLin | input return loss | VDS = 28 V; IDq = 950 mA; PL(AV) = 30 W | -15 | -9 | dB | |
| frange | frequency range | 2000 | 2200 | MHz | ||
| PL(1dB) | nominal output power at 1 dB gain compression | 130 | W | |||
| Type number | Orderable part number | Ordering code (12NC) | Product status | Package | Packing | Marking |
|---|---|---|---|---|---|---|
| BLF7G22LS-130 | BLF7G22LS-130,112 | 9340 635 01112 | Volume production | SOT502B (SOT502B) | Blister pack | Standard Marking |
| BLF7G22LS-130 | BLF7G22LS-130,118 | 9340 635 01118 | Volume production | SOT502B (SOT502B) | Reel Pack, SMD, 13" | Standard Marking |
| Pin | Symbol | Description | Simplified outline | Graphic symbol |
|---|---|---|---|---|
| 1 | D | drain | ![]() | ![]() |
| 2 | G | gate | ||
| 3 | S | source |
| Type number | Orderable part number | Chemical content | RoHS | Leadfree conversion date | RHF | IFR (FIT) | MTBF (hours) | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|
| BLF7G22LS-130 | BLF7G22LS-130,112 | BLF7G22LS-130 | Always Pb-free | NA | NA | ||||
| BLF7G22LS-130 | BLF7G22LS-130,118 | BLF7G22LS-130 | Always Pb-free | NA | NA |
| Type | Format | Title | Date |
|---|---|---|---|
| Data sheet | Power LDMOS transistor (v.4.0) | 2011-01-20 | |
| Application note | Doherty RF performance analysis using the BLF7G22LS-130 (v.2.0) | 2010-02-25 | |
| Application note | Mounting and Soldering of RF transistors (v.1.0) | 2010-06-02 | |
| Brochure | Your partner in Mobile Communication Infrastructure design; High Performance RF for wireless infrastructure (v.1.0) | 2011-05-23 | |
| Mounting and soldering | Fatigue in aluminum bond wires (v.1.0) | 2009-10-08 | |
| Other type | zip | PCB Design BLF7G22L(S)-130 (AN10885) (v.2.2) | 2011-02-22 |
| Selection guide | NXP's RF Manual 15th edition (v.1.0) | 2011-05-19 | |
| Simulation model | zip | BLF7G22-130 ADS Model (v.2.2) | 2010-06-17 |
| Simulation model | zip | RF Power Model Library for MicroWave Office (v.2.1) | 2012-05-22 |
| Simulation model | RF Power Model Library Manual and Installation Instructions for MicroWave Office (v.3.2) | 2012-05-22 |
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