BLM6G22-30

W-CDMA 2100 MHz to 2200 MHz power MMIC


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30 W LDMOS 2-stage power MMIC for base station applications at frequencies from 2100 MHz to 2200 MHz. Available in gull wing for surface mount (SOT822-1) or flat lead (SOT834-1).

Features and benefits

  • Integrated ESD protection
  • Designed for broadband operation (2100 MHz to 2200 MHz)
  • Biasing of individual stages is externally accessible
  • High power gain
  • On-chip matching (input matched to 50 Ohm, output partially matched)
  • Integrated temperature compensated bias
  • Excellent thermal stability
  • Compliant to Directive 2002/95/EC, regarding RoHS
  • Small component size, very suitable for PA size reduction

Applications

  • base station applications
All information on this product information page is subject to the subsequent disclaimers:
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Parametrics of this product

SymbolParameterConditionsMinTyp/NomMaxUnit
Test signal: 2-c WCDMA
PL(AV)average output power2W
Gppower gainVDS = 28 V; PL(AV) = 2 W27.529.532.5dB
RLininput return lossVDS = 28 V; IDq = 270 mA; PL(AV) = 2 W-14-10dB
ηDdrain efficiencyVDS = 28 V; 2100 MHz < f < 2200 MHz; IDq = 270 mA; PL(AV) = 2 W7.59%
ACPRadjacent channel power ratioPL(AV) = 2 W; VDS = 28 V; IDq = 270 mA; 2100 MHz < f < 2200 MHz-50-47dB
IMD3third-order intermodulation distortionVDS = 28 V; PL(AV) = 2 W-48-44.5dBc
frangefrequency range21002200MHz
PL(1dB)nominal output power at 1 dB gain compression30W

Similar products

Products / Packages

Type numberOrderable part numberOrdering code (12NC)Product statusPackagePackingMarking
BLM6G22-30BLM6G22-30,1279340 603 03127DevelopmentSOT834-1
(HSOP16F) 		Horizontal, Rail PackStandard Marking
BLM6G22-30BLM6G22-30,1359340 603 03135Volume productionSOT834-1
(HSOP16F) 		Reel Pack, SMD, LargeStandard Marking
BLM6G22-30BLM6G22-30,1189340 603 03118Volume productionSOT834-1
(HSOP16F) 		Reel Pack, SMD, 13"Standard Marking

Pinning information

PinSymbolDescriptionSimplified outlineGraphic symbol
1GNDgroundPin configurationBlock diagram of BLM6G22-30 and BLM6G22-30G
2VDS1first stage drain-source voltage
3n.c.not connected
4n.c.not connected
5n.c.not connected
6RF_INPUTRF input
7n.c.not connected
8n.c.not connected
9VGS1first stage gate-source voltage
10VGS2second stage gate-source voltage
11GNDground
12GNDground
13n.c.not connected
14RF_OUT/VDS2RF output or second stage drain-source voltage
15n.c.not connected
16GNDground
flangeRF_GNDRF ground

Quality, reliability & chemical content

Type numberOrderable part numberChemical contentRoHSLeadfree conversion dateRHFIFR (FIT)MTBF (hours)MSLMSL LF
BLM6G22-30BLM6G22-30,127BLM6G22-3033
BLM6G22-30BLM6G22-30,135BLM6G22-3033
BLM6G22-30BLM6G22-30,118BLM6G22-3033
Quality and reliability disclaimer

Quality and reliability disclaimer

Important Legal Notice on the product/generic quality information, No Warranty

NXP Semiconductors is providing this data for your convenience only. Please note however that NO WARRANTY, REPRESENTATION, GUARANTEE OR LEGALLY BINDING PRODUCT DESCRIPTION is provided by publishing this informational data, nor does NXP Semiconductors acknowledge or accept any liability related thereto. The documentation and data on NXP Semiconductors products can be found in the data sheets as officially published by NXP Semiconductors. For all purchase of products from NXP Semiconductors the NXP Semiconductors' General Terms and Conditions of Commercial Sale will apply.

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Your use of this data, and all consequences of such use, is solely your responsibility. You must perform sufficient engineering and additional qualification testing in order to properly evaluate your application and determine whether a candidate NXP Semiconductors device is suitable for use in that application.

NXP Semiconductors' products are specifically designed and manufactured to be used within the electrical, thermal, mechanical and other parameters set forth in NXP Semiconductors' data sheets. Quality and reliability data provided by NXP Semiconductors, such as MTBF, MSL and FIT, is intended to be a non-binding estimate of product performance based upon diffusion process, history only. It does not imply that any performance levels reflected in such data can be met if the product is operated outside the conditions expressly stated in the latest published data sheet for a device or in your application.

The RoHS data provided hereunder is preliminary and non binding for NXP Semiconductors. NXP Semiconductors does not accept any liability related to this data.

NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage nor for any other use that is not explicitly agreed between the parties. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk.

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Documentation for this product

TypeFormatTitleDate
Data sheetpdfW-CDMA 2100 MHz to 2200 MHz power MMIC (v.4.0)2011-03-07
Application notepdfMounting and Soldering of RF transistors (v.1.0)2010-06-02
BrochurepdfYour partner in Mobile Communication Infrastructure design; High Performance RF for wireless infrastructure (v.1.0)2011-05-23
Mounting and solderingpdfFatigue in aluminum bond wires (v.1.0)2009-10-08
Other typezipPCB Design BLM6G22-30(G) 2110-2170 MHz 2-c-WCDMA (Data sheet) (v.1.0)2012-01-23
Selection guidepdfNXP's RF Manual 15th edition (v.1.0)2011-05-19
Simulation modelzipBLM6G22-30 ADS Model (v.1.0)2010-03-19

Ordering & availability

Type numberOrdering code(12NC)Orderable part numberRegionDistributorIn stockOrder quantityInventory dateBuy onlineSamples
BLM6G22-309340 603 03127BLM6G22-30,127      not available
BLM6G22-309340 603 03135BLM6G22-30,135JAPANCHIP ONE STOPno05/14/2012Buy online 
BLM6G22-309340 603 03118BLM6G22-30,118      not available

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