PSMN012-100YS

N-channel 100V 12mΩ standard level MOSFET in LFPAK


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Standard level N-channel MOSFET in LFPAK package qualified to 175 °C. This product is designed and qualified for use in a wide range of industrial, communications and domestic equipment.

Features and benefits

  • Advanced TrenchMOS provides low RDSon and low gate charge
  • High efficiency gains in switching power converters
  • Improved mechanical and thermal characteristics
  • LFPAK provides maximum power density in a Power SO8 package

Applications

  • DC-to-DC converters
  • Lithium-ion battery protection
  • Load switching
  • Motor control
  • Server power supplies
All information on this product information page is subject to the subsequent disclaimers:

Parametrics of this product

SymbolParameterConditionsMinTyp/NomMaxUnit
VDSdrain-source voltageTj ≤ 175 °C; Tj ≥ 25 °C100V
IDdrain currentTmb = 25 °C60A
Ptottotal power dissipationTmb = 25 °C130W
Tjjunction temperature-55175°C
Static characteristics
RDSondrain-source on-state resistanceVGS = 10 V; ID = 15 A; Tj = 100 °C23
RDSondrain-source on-state resistanceVGS = 10 V; ID = 15 A; Tj = 25 °C1012
Dynamic characteristics
QGDgate-drain chargeVGS = 10 V; ID = 45 A; VDS = 50 V19nC
QG(tot)total gate chargeVGS = 10 V; ID = 45 A; VDS = 50 V64nC
Avalanche ruggedness
EDS(AL)Snon-repetitive drain-source avalanche energyVGS = 10 V; Tj(init) = 25 °C; ID = 60 A; Vsup ≤ 100 V; RGS = 50 Ω; unclamped170mJ

Package

Type numberPackageOutline versionReflow-/Wave solderingPackingProduct statusMarkingOrderable part number, (Ordering code (12NC))
PSMN012-100YSLFPAK56; Power-SO8
(SOT669)
sot669_posot669_fr
Tape reel smdVolume production12100PSMN012-100YS,115
( 9340 643 95115 )

Pinning information

PinSymbolDescriptionSimplified outlineGraphic symbol
1SsourceSOT669 (LFPAK; Power-SO8)Graphic symbol
2Ssource
3Ssource
4Ggate
mbDmounting base; connected to drain

Quality, reliability & chemical content

Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateEFRIFR (FIT)MTBF (hour)MSLMSL LF
PSMN012-100YSPSMN012-100YS,115PSMN012-100YS11
Quality and reliability disclaimer

Quality and reliability disclaimer

Important Legal Notice on the product/generic quality information, No Warranty

NXP Semiconductors is providing this data for your convenience only. Please note however that NO WARRANTY, REPRESENTATION, GUARANTEE OR LEGALLY BINDING PRODUCT DESCRIPTION is provided by publishing this informational data, nor does NXP Semiconductors acknowledge or accept any liability related thereto. The documentation and data on NXP Semiconductors products can be found in the data sheets as officially published by NXP Semiconductors. For all purchase of products from NXP Semiconductors the NXP Semiconductors' General Terms and Conditions of Commercial Sale will apply.

NXP SEMICONDUCTORS PROVIDES THE DATA HEREUNDER “AS IS” WITHOUT WARRANTY WHATSOEVER. NXP SEMICONDUCTORS DOES NOT WARRANT OR REPRESENT THAT ANY DATA PROVIDED ON THIS WEBSITE IS CORRECT OR FIT FOR A PARTICULAR PURPOSE WHATSOEVER. IT IS PROVIDED WITHOUT ANY WARRANTY WHATSOEVER, WHETHER EXPRESS, IMPLIED OR OTHERWISE, REGARDING ITS ACCURACY, COMPLETENESS NONINFRINGEMENT OF INTELLECTUAL PROPERTY OR OTHERWISE AND MAY BE CHANGED, MODIFIED OR DELETED BY NXP SEMICONDUCTORS AT ANY TIME.

Any use of the data provided hereunder is at your own risk.

IN NO EVENT SHALL NXP SEMICONDUCTORS, BE LIABLE FOR ANY DIRECT, SPECIAL, INDIRECT, CONSEQUENTIAL, PUNITIVE, OR INCIDENTAL DAMAGES (INCLUDING WITHOUT LIMITATION DAMAGES FOR LOSS OF BUSINESS, BUSINESS INTERRUPTION, LOSS OF USE, LOSS OF DATA OR INFORMATION, AND THE LIKE) ARISING OUT OF THE USE OF THE DATA, WHETHER OR NOT BASED ON TORT (INCLUDING NEGLIGENCE), STRICT LIABILITY, BREACH OF CONTRACT, BREACH OF WARRANTY OR ANY OTHER THEORY, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. NOTWITHSTANDING ANY DAMAGES THAT YOU MIGHT INCUR FOR ANY REASON WHATSOEVER (INCLUDING, WITHOUT LIMITATION, ALL DAMAGES REFERENCED ABOVE AND ALL GENERAL DAMAGES), THE ENTIRE LIABILITY OF NXP SEMICONDUCTORS, AND YOUR EXCLUSIVE REMEDY FOR ALL OF THE FOREGOING SHALL BE LIMITED TO ACTUAL DAMAGES INCURRED BY YOU BASED ON REASONABLE RELIANCE UP TO ONE DOLLARS (US$1.00). THE FOREGOING LIMITATIONS, EXCLUSIONS AND DISCLAIMERS SHALL APPLY TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, EVEN IF ANY REMEDY FAILS OF ITS ESSENTIAL PURPOSE.

Your use of this data, and all consequences of such use, is solely your responsibility. You must perform sufficient engineering and additional qualification testing in order to properly evaluate your application and determine whether a candidate NXP Semiconductors device is suitable for use in that application.

NXP Semiconductors' products are specifically designed and manufactured to be used within the electrical, thermal, mechanical and other parameters set forth in NXP Semiconductors' data sheets. Quality and reliability data provided by NXP Semiconductors, such as MTBF, MSL and FIT, is intended to be a non-binding estimate of product performance based upon diffusion process, history only. It does not imply that any performance levels reflected in such data can be met if the product is operated outside the conditions expressly stated in the latest published data sheet for a device or in your application.

The RoHS data provided hereunder is preliminary and non binding for NXP Semiconductors. NXP Semiconductors does not accept any liability related to this data.

NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage nor for any other use that is not explicitly agreed between the parties. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk.

Any use of NXP Semiconductors' products beyond the scope defined in the current NXP Semiconductors' data sheet voids all warranty responsibility of NXP Semiconductors with respect to such devices, and also voids all responsibility of NXP Semiconductors with respect to any applications assistance, product design, software performance or services of any kind that were or may have been performed in connection with the sale of any such devices.

Further, resale of NXP Semiconductors' products or services with statements different from or beyond the parameters stated by NXP Semiconductors for that product in official NXP Semiconductors data sheets, or without the warnings or instructions provided by NXP Semiconductors, voids all express and any implied warranties for the associated NXP Semiconductors product or service, and is an unfair and deceptive business practice.

Documentation for this product

File nameTitleTypeFormatDate
PSMN012-100YSN-channel 100V 12mΩ standard level MOSFET in LFPAKData sheetpdf2010-02-23
AN10273Power MOSFET single-shot and repetitive avalanche ruggedness ratingApplication notepdf2010-03-17
AN10874LFPAK MOSFET thermal design guideApplication notepdf2011-01-27
AN11113LFPAK MOSFET thermal design guide - Part 2Application notepdf2011-11-16
AN11158Understanding power MOSFET data sheet parametersApplication notepdf2014-02-04
AN11160Designing RC SnubbersApplication notepdf2012-10-01
AN11156Using Power MOSFET Zth CurvesApplication notepdf2012-10-10
AN11243Failure signature of Electrical Overstress on Power MOSFETsApplication notepdf2012-10-29
AN11113_ZHLFPAK MOSFET thermal design guide - Part 2Application notepdf2013-11-01
AN11158_ZHUnderstanding power MOSFET data sheet parametersApplication notepdf2013-11-08
75017277Ultra-reliable LFPAK56 and LFPAK33Brochurepdf2012-10-23
939775016838_LRLFPAK - The Toughest Power SO8Leafletpdf2010-03-17
939775016849_LR25 V to 100 V MOSFETs in Power-SO8Leafletpdf2010-01-13
PSMN012-100YSSpice model PSMN012-100YSSPICE modellib2011-11-30
PSMN012-100YSPSMN012-100YS Thermal modelThermal modelpdml2010-01-18
SOT669_115LFPAK; Tape reel SMD; standard product orientation 12NC ending 115Packingpdf2012-11-29
sot669_poplastic single-ended surface-mounted package (LFPAK56; Power-SO8); 4 leadsOutline drawingpdf2011-03-28
sot669_frFootprint for reflow soldering SOT669Reflow solderingpdf2009-12-16

Ordering & availability

Type numberOrdering code (12NC)Orderable part numberRegionDistributorIn stockOrder quantityInventory dateBuy onlineSamples
PSMN012-100YS9340 643 95115PSMN012-100YS,115NADigiKey11,02714/17/2014Buy online 
   NAMOUSER ELECTRONICS7304/17/2014Buy online 
   ASIAChip One Stop3004/17/2014Buy online 

Sample

Sample orders normally take 2-4 days for delivery.
If you do not have a direct account with NXP our network of global and regional distributors is available and equipped to support you with NXP samples. As a NXP customer you also have the option to order samples via our sales organisation.

Design support

File nameTitleTypeFormatDate
PSMN012-100YSSpice model PSMN012-100YSSPICE modellib2011-11-30
PSMN012-100YSPSMN012-100YS Thermal modelThermal modelpdml2010-01-18

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