PSMN4R0-30YLD

N-channel 30 V, 4.0 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology


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Logic level gate drive N-channel enhancement mode MOSFET in LFPAK56 package. NextPowerS3 portfolio utilising NXP’s unique “SchottkyPlus” technology delivers high efficiency, low spiking performance usually associated with MOSFETs with an integrated Schottky or Schottky-like diode but without problematic high leakage current. NextPowerS3 is particularly suited to high efficiency applications at high switching frequencies.

Features and benefits

  • Ultra low QG, QGD and QOSS for high system efficiency, especially at higher switching frequencies
  • Superfast switching with soft-recovery; s-factor > 1
  • Low spiking and ringing for low EMI designs
  • Unique “SchottkyPlus” technology; Schottky-like performance with < 1 µA leakage at 25 °C
  • Optimised for 4.5 V gate drive
  • Low parasitic inductance and resistance
  • High reliability clip bonded and solder die attach Power SO8 package; no glue, no wire bonds, qualified to 175 °C
  • Wave solderable; exposed leads for optimal visual solder inspection

Applications

  • On-board DC-to-DC solutions for server and telecommunications
  • Secondary-side synchronous rectification in telecommunication applications
  • Voltage regulator modules (VRM)
  • Point-of-Load (POL) modules
  • Power delivery for V-core, ASIC, DDR, GPU, VGA and system components
  • Brushed and brushless motor control
All information on this product information page is subject to the subsequent disclaimers:

Parametrics of this product

SymbolParameterConditionsMinTyp/NomMaxUnit
VDSdrain-source voltage25 °C ≤ Tj ≤ 175 °C30V
IDdrain currentTmb = 25 °C; VGS = 10 V95A
Ptottotal power dissipationTmb = 25 °C64W
Tjjunction temperature-55175°C
Static characteristics
RDSondrain-source on-state resistanceVGS = 4.5 V; ID = 25 A; Tj = 25 °C4.45.5
RDSondrain-source on-state resistanceVGS = 10 V; ID = 25 A; Tj = 25 °C3.44
Source-drain diode
Ssoftness factorIS = 25 A; VGS = 0 V; dIS/dt = -100 A/µs; VDS = 15 V1.1
Dynamic characteristics
QGDgate-drain chargeVGS = 4.5 V; ID = 25 A; VDS = 15 V2.94.35nC
QG(tot)total gate chargeVGS = 4.5 V; ID = 25 A; VDS = 15 V9.614.4nC

Package

Type numberPackageOutline versionReflow-/Wave solderingPackingProduct statusMarkingOrderable part number, (Ordering code (12NC))
PSMN4R0-30YLDLFPAK56; Power-SO8
(SOT669)
sot669_posot669_fr
Reel Pack, SMD 7" Q1/T1Active4D030LPSMN4R0-30YLDX
( 9340 677 96115 )

Pinning information

PinSymbolDescriptionSimplified outlineGraphic symbol
1SsourceSOT669 (LFPAK)
2Ssource
3Ssource
4Ggate
mbDmounting base; connected to drain

Quality, reliability & chemical content

Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateMSLMSL LF
PSMN4R0-30YLDPSMN4R0-30YLDXPSMN4R0-30YLD11
Quality and reliability disclaimer

Quality and reliability disclaimer

Important Legal Notice on the product/generic quality information, No Warranty

NXP Semiconductors is providing this data for your convenience only. Please note however that NO WARRANTY, REPRESENTATION, GUARANTEE OR LEGALLY BINDING PRODUCT DESCRIPTION is provided by publishing this informational data, nor does NXP Semiconductors acknowledge or accept any liability related thereto. The documentation and data on NXP Semiconductors products can be found in the data sheets as officially published by NXP Semiconductors. For all purchase of products from NXP Semiconductors the NXP Semiconductors' General Terms and Conditions of Commercial Sale will apply.

NXP SEMICONDUCTORS PROVIDES THE DATA HEREUNDER “AS IS” WITHOUT WARRANTY WHATSOEVER. NXP SEMICONDUCTORS DOES NOT WARRANT OR REPRESENT THAT ANY DATA PROVIDED ON THIS WEBSITE IS CORRECT OR FIT FOR A PARTICULAR PURPOSE WHATSOEVER. IT IS PROVIDED WITHOUT ANY WARRANTY WHATSOEVER, WHETHER EXPRESS, IMPLIED OR OTHERWISE, REGARDING ITS ACCURACY, COMPLETENESS NONINFRINGEMENT OF INTELLECTUAL PROPERTY OR OTHERWISE AND MAY BE CHANGED, MODIFIED OR DELETED BY NXP SEMICONDUCTORS AT ANY TIME.

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NXP Semiconductors' products are specifically designed and manufactured to be used within the electrical, thermal, mechanical and other parameters set forth in NXP Semiconductors' data sheets. Quality and reliability data provided by NXP Semiconductors, such as MTBF, MSL and FIT, is intended to be a non-binding estimate of product performance based upon diffusion process, history only. It does not imply that any performance levels reflected in such data can be met if the product is operated outside the conditions expressly stated in the latest published data sheet for a device or in your application.

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NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage nor for any other use that is not explicitly agreed between the parties. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk.

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Documentation for this product

File nameTitleTypeFormatDate
PSMN4R0-30YLDN-channel 30 V, 4.0 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 TechnologyData sheetpdf2013-10-10
PSMN4R0-30YLDPSMN4R0-30YLD Spice modelSPICE modellib2013-09-18
PSMN4R0-30YLDPSMN4R0-30YLD Thermal modelThermal modelpdml2013-09-18
SOT669_115LFPAK; Tape reel SMD; standard product orientation 12NC ending 115Packingpdf2012-11-29
sot669_poplastic single-ended surface-mounted package (LFPAK56; Power-SO8); 4 leadsOutline drawingpdf2011-03-28
sot669_frFootprint for reflow soldering SOT669Reflow solderingpdf2009-12-16

Ordering & availability

Type numberOrdering code (12NC)Orderable part numberRegionDistributorIn stockOrder quantityInventory dateBuy onlineSamples
PSMN4R0-30YLD9340 677 96115PSMN4R0-30YLDXNADigiKey5,942110/20/2014Buy online 
   ASIAWPI1,500150010/19/2014Buy online 
   NAMouser Electronics16110/19/14Buy online 

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Find answers to your design questions on this page. If available you can find information in our NXP Support Community or you can find NXP models, Demo boards and Design tools.

Models

TitleTypeDate
PSMN4R0-30YLD Spice modelSPICE model2013-09-18
PSMN4R0-30YLD Thermal modelThermal model2013-09-18

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