NXP's microwave portfolio covers L-band, S-band, and avionics applications, and meets the very high demands of today's most advanced equipment. We combine the latest LDMOS technology with leading-edge packaging solutions, creating transistors and pallets that deliver superior quality, performance, and reliability. Also, our extensive technical support enables more effective design-in and faster time-to-market.
Microwave product portfolio (June 2008)
Air cavity, ceramic, and plastic overmould packages
Gen7 LDMOS technology
Gallium Nitride (GaN) technology for RF Power
Bolt down Recommendations
Fatigue in aluminum bond wires
Soldering Recommendations ACP
To access our support resources, please go to our support page.