The potential health hazard posed by lead (Pb) contamination is a major concern to everyone. Part of our commitment to sustainability, NXP's Pb-free initiative ensures the complete removal of lead from our entire device portfolio, without adversely affecting technical specifications or your own manufacturing processes. We are dedicated to offering you safe, non-toxic solutions that help your own products satisfy the very highest environmental standards.
Discrete and IC packages, particularly their solder pins, balls or bumps, are the main culprits of lead content, together with the solderpaste used to affix them to the board. Over the years, we have sought to reduce environmental impact of packaging, either through innovative new designs such as LQF (plastic) packages or by substituting pure-tin for existing SnPb plating. With the majority of NXP products already qualifying as Pb-free, we expect to reach full conversion well before new legislation comes into effect in 2006. You'll also discover that, as well as setting and meeting environmental targets, NXP makes the move to Pb-free an easy path for customers to follow.