Home
About NXP
News
In Focus
Careers
Investors
Tech support
Contact
my.NXP
Select site:
English
Global site
English
日本語
简体中文
繁體中文
Русский
한국어
Country site
Austria
France
Germany
Netherlands
Search
Advanced search
Home
Products
Applications
Lead Free Release Documents
Program
Environment
Substances of concern
Lead free & halogen free
FAQ
Understanding Lead Free
Lead Free Release Documents
Lead Free Package Matrix
Documentation
ISO 14001
Our targets for EcoVision
Society & People
Sustainability report 2007
Please find below links to the documents released with the lead-free CPCNs.
CPCN documents (leadframe based SMD packages)
Advance CPCN document (May 2003)
Final CPCN document (November 2003)
Supplement 1 to Final CPCN (December 2003)
Supplement 2 to Final CPCN (February 2004)
Supplement 3 to Final CPCN (June 2004)
Supplement 4 to Final CPCN (October 2004)
Correction to Final CPCN (November 2004)
Supplement 5 to Final CPCN (November 2004)
Supplement 6 to Final CPCN (December 2004)
Supplement 7 to Final CPCN (March 2005)
Supplement 8 to Final CPCN (April 2005)
Supplement 9 to Final CPCN (May 2005)
2nd correction to Final CPCN (June 2005)
Supplement 10 to Final CPCN (August 2005)
Supplement 11 to Final CPCN (February 2006)
Label CIN 200603018 (March 2006)
Qualification (leadframe based SMD packages)
Qualification Results 1st Phase (November 2003)
Qualification Results 2nd Phase (December 2003)
Qualification Results 3rd Phase (February 2004)
Qualification Results 4th Phase PPF (June 2004)
Qualification Results 4th Phase matte Sn (June 2004)
Qualification Results 5th Phase (October 2004)
Qualification Plan Correction (November 2004)
Qualification Results 6th Phase PPF (November 2004)
Qualification Results 6th Phase matte Sn (Nov 2004)
Qualification Results 7th Phase (December 2004)
Qualification Results 8th Phase SSOP (March 2005)
Qualification Results 8th Phase TSSOP48 (March 05)
Qualification Results 9th Phase (April 05)
Qualification Results 10th Phase (May 2005)
Qualification Plan 2nd correction (June 2005)
Qualification Results 2nd correction (June 2005)
Qualification Results 11th phase TSSOP56 (August 2005)
Type lists (leadframe based SMD packages)
Type list 1st Phase (November 2003)
Type list 2nd Phase (December 2003)
Type list 3rd Phase (February 2004 corr. May 2005)
Type list 4th Phase (June 2004 corr. May 2005)
Type list 5th Phase (October 2004)
Type list Correction (November 2004)
Type list 6th Phase (November 2004 corr. May 2005)
Type list 7th Phase (December 2004)
Type list 8th Phase (March 2005)
Type list 9th Phase (April 2005)
Type list 10th Phase (May 2005)
Type list correction part of Phases 3,4,6 (May 2005)
Type list 2nd correction (June 2005)
Type list 11th Phase (August 2005)
Type list 12th Phase (February 2006)
Supporting Technical Documents
E4 (Infineon, STM, Freescale, Philips) presentation (March, 2005)
Attachments to the E4 presentation (October, 2004)
Updated logo's for packing labels of leadfree products (attachment to CIN 200603018, March 2006)
