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Design end products that are flatter, thinner, and smaller!

The trend towards smaller end products with more functionality presents a huge challenge to system designers. NXP helps you simplify system design and reduce costs by offering the largest portfolio of multimarket semiconductors in the broadest offering of space-saving SMD leadless package options.

Advantages

Choice of 23 low-profile packages
Selection from 2 up to 24 pins
Largest range of functionality available
Extremely high silicon to footprint ratios
Industry leading power dissipation
Board space reduction
Easy to route footprints
RoHS compliant

NXP announces world’s smallest high-performance MOSFET in leadless SOT883 package. Read the press release