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[PDF] 9.5 V boosted audio system with adaptive sound maximizer and speaker protect ... (REV 1.0)

1. General description The TFA9891 is a high efficiency class-D audio amplifier  with a sophisticated speaker boost and protection algorithm. ...

[PDF] Boosted audio system with adaptive sound maximizer and speaker protection (REV 1.0)

27 Nov 2014 1. General description The TFA9897 is a high efficiency class-D audio amplifier  with a sophisticated speaker-boost protection algorithm. ...

[PDF] Vertical deflection booster (REV 1.0)

17 Aug 2000 DATA SHEET Product specification File under Integrated Circuits, IC02  2000 Aug 17 INTEGRATED CIRCUITS TDA4863J ...

[PDF] I2C-bus controlled 4 x 45 W best efficiency amplifier (REV 8.0)

04 May 2015 1. General description The TDF8546 is one of a new generation of  complementary quad Bridge-Tied Load (BTL) audio ...

[PDF] plastic thermal enhanced ball grid array package; 432 balls; heatsink (REV 1.0)

08 Feb 2016 HBGA432 SOT1119-1 plastic thermal enhanced ball grid array package;  432 balls; heatsink 8 February 2016 Package information ...

[PDF] Audio amplifier for portable applications; NXP® 3-W Class AB ... (REV 1.0)

01 Sep 2006 Audio amplifier for portable applications This single-channel audio amplifier  provides a power output of 3 W with an 8-Ω load using a 9-V supply. ...

[PDF] Stereo full-bridge audio amplifier 2 x 17 W (REV 1.0)

16 Dec 2008 1. General description The TFA9815 is a 2-channel power comparator  for high-efficiency class D audio amplifier systems. ...

[PDF] plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm) (REV 1.0)

08 Feb 2016 SO24 SOT411-1 plastic DIL-bent-SIL power package; 23 leads (straight lead  length 3.2 mm) 8 February 2016 Package information ...

[PDF] plastic shrink small outline package; 20 leads; body width 4.4 mm (REV 1.0)

08 Feb 2016 SSOP20 SOT266-1 plastic shrink small outline package; 20 leads; body width  4.4 mm 8 February 2016 Package information 1. Package summary ...

[PDF] Plastic thin shrink small outline package; 8 leads; body width 3 mm (REV 1.0)

Outline and soldering footprint for TSSOP8 package

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