NXP Semiconductor



RoHS Certificate of Analysis

Part Number:    MC56F82743VLC
Package Description:    FREE 1.0F CU JEDEC
Tracking Number:   K00010D088


Subcomponent Description Homogeneous Material Identification RoHS CoA
Bonding Wire, PdCu    RoHS CoA
Copper Lead Frame    RoHS CoA
Die Encapsulant, Halogen-free    RoHS CoA
Epoxy Die Attach    RoHS CoA
Silicon Semiconductor Die    RoHS CoA


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