NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MC9RS08KA1CPC
Package Description:
PDIP 8
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, PdCu
RoHS CoA
Copper Lead Frame
RoHS CoA
Die Encapsulant, Halogen-free
RoHS CoA
Lead Frame Plating
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
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