NXP Semiconductor
RoHS Certificate of Analysis
Part Number:
MCF54417CMJ250
Package Description:
16*16 GRID STD
Tracking Number:
K00022D087
Subcomponent Description
Homogeneous Material Identification
RoHS CoA
Bonding Wire, PdCu
RoHS CoA
Die Encapsulant, Halogen-free
RoHS CoA
Non-Conductive Epoxy/Adhesive
RoHS CoA
RoHS CoA
Silicon Semiconductor Die
RoHS CoA
Solder Balls - Pb Free, Sn/Ag
RoHS CoA
Substrate
E679FGB
RoHS CoA
AUS 308
RoHS CoA
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