SPC5645SF1VLT (Active)

NXP 32-bit MCU, Power Arch core, 2MB Flash, 125MHz, -40/+105degC, Automotive Grade, QFP 208

  • 封装类型和焊端数
  • LQFP208, plastic, low profile quad flat package; 208 terminals; 0.5 mm pitch; 28 mm x 28 mm x 1.4 mm body

购买选项

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    935314839557
  • Active
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    Lead Time: 12 weeks
    • 代理商
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    935314839528
  • Active
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    最小封装数量: 180
    Lead Time: 12 weeks
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工作特性

参数
Flash (kB)
RAM (kB)
Operating Frequency [Max (MHz)]
I2C
CAN
SCI
DSPI
Ambient Operating Temperature (Min to Max) (℃)

质量信息

材料声明 安全保障/功能安全 Moisture Sensitivity Level (MSL) 封装体峰值温度 (PPT) (C°) Maximum Time at Peak Temperatures (s)
无铅焊接 无铅焊接 无铅焊接
40
40