SPC5645SF1VLU (Active)

NXP 32-bit MCU, Power Arch core, 2MB Flash, 125MHz, -40/+105degC, Automotive Grade, QFP 176

  • 封装类型和焊端数
  • plastic, low profile quad; flat leaded package; 176 terminals; 0.50 mm pitch; 24 mm x 24 mm x 1.4 mm body

购买选项

  • SPC5645SF1VLU
    935313103557
  • Active
  • TRAY-Tray, Bakeable, Multiple in Drypack
    最小封装数量: 40
    Lead Time: 12 weeks
  • 10K @ US $12.40
  • SPC5645SF1VLUR
    935313103528
  • Active
  • REEL-Reel 13" Q2/T3 in Drypack
    最小封装数量: 500
    Lead Time: 12 weeks
  • 10K @ US $12.40

工作特性

参数
Flash (kB)
RAM (kB)
Operating Frequency [Max (MHz)]
I2C
CAN
SCI
DSPI
Ambient Operating Temperature (Min to Max) (℃)

质量信息

材料声明 安全保障/功能安全 Moisture Sensitivity Level (MSL) 封装体峰值温度 (PPT) (C°) Maximum Time at Peak Temperatures (s)
无铅焊接 无铅焊接 无铅焊接
40
40