NXP will continue to push the boundaries of secure, intelligent technologies that transform everyday experiences. At CES, the company will present forward-looking solutions designed to shape a more connected and resilient world.
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reenter your passwordJanuary 6 - 9, 2026, Las Vegas, Booth CP 134
NXP will continue to push the boundaries of secure, intelligent technologies that transform everyday experiences. At CES, the company will present forward-looking solutions designed to shape a more connected and resilient world.
January 6, 2:00 PM Las Vegas Convention Center North (LVCC) N257
Panelist: Sujata Neidig, Marketing Director, IoT Product Marketing, NXP
Immerse yourself in how smart cities rely on seamless IoT communication. Explore the challenges of interoperability and keeping pace with fast-evolving connected technologies.
January 8, 11:00 AM, Las Vegas Convention Center North (LVCC) N257
Panelist: Naomi Smit, GM and VP Drivers and Energy Systems, NXP
Explore the diverse technologies, big challenges and the partnership that will drive scalable, sustainable power for a rapidly evolving world.
Experience vehicles that act as intelligent companions — thinking ahead and evolving over time. Learn how scalable, software-defined architectures simplify development. Discover imaging radar and AI-enabled sensing for enhanced safety. And see smart electrification solutions that drive cleaner mobility.
Enter a future where factories and energy systems respond autonomously. With edge AI, ML and real-time control, discover how operations can run smarter and safer. Explore modular, portable software that optimizes energy use, driving efficiency across industries.
Step into a world where intelligent edge systems anticipate life's rhythms and adapt in real time. Using edge AI, UWB and Wi-Fi CSI, homes can respond intuitively — adjusting lighting, climate and security. In healthcare, see how edge AI enables faster diagnostics and precision during critical surgeries.
Contact your NXP sales representative for a personal tour or meet us at the Collaboration Plaza—an open-air demo experience where ideas meet innovation.
| Title | Focus | Featured NXP Products |
|---|---|---|
| Advancing Multimodal GenAI at the Edge | Industrial | i.MX 95, Kinara Ara-2, i.MX 8M Plus, NXP Voice UI, Vision Pipeline, qIQ Neutron |
| Automotive Wall - Driving Success Togetder | Automotive | Does not feature any NXP products |
| Autonomous Home Experience | Smart Home | MCX W72 (launching Dec 2025), SR150, PN76AC, i.MX93, PCA9451C, SR250 IW612, i.MX RT700, RW612 + Matter (in development), SE051H+ (in development) |
| Autonomous Robot with Gen AI and Agentic Support | Industrial | i.MX95, Kinara (Ara-2) |
| CabinIQ: Context-Aware AI | Automotive | SAF9100, OrangeBox, i.MX 95, microphones, amps, Etdernet, NCJ29D6 |
| ADAS & Vehicle Compute Core | Automotive | S32N, S32J Ethernet PHY, Radar, S32K, ASA ML |
| Energy Management for Secure Connected Autonomy | Industrial | SR250 UWB mesh network (fleets) Scalable ML/AI to manage on site real-time energy automation complexity Secure universal matter communications. eIQ (Kinara Phase 2), i.MX 93 FRDM, RW612 Wi-Fi 6 MCU, SR150, MicroEJ NPA SW |
| Hands-Free Secure Home & Building Access | Smart Home | MCX W72, SR150, PN76AC |
| Industrial Battery Energy Storage System | Industrial | S32K3: microcontrollers for Automotive general purpose. MC33772C: 6-channel Li-Ion battery cell controller IC, MC33774: 18 channel Li-Ion battery cell controller IC ASIL DMC33665A: General purpose BMS communication TPL transceiver and CAN FD gateway. XS2410: Quad 100 mΩ / Dual 50 mΩ, 3.0 V to 60 V high-side switch. FS26: Safety system basis chip with low power, for ASIL D systems. HB2000: SPI programmable 10 A H-bridge brushed DC motor driver. TJA1463: CAN signal improvement capability transceiver with sleep mode. TEA1721AT: HV start-up flyback controller with integrated MOSFET for 5 W applications, F~burst = 430 HZ. PCF2131: Nano-power highly accurate RTC with integrated quartz crystal. NCJ37x: Automotive secure element with passive NFC, I2C and SPI interfaces. FXPS7xx0A4: Analog absolute pressure sensor (20 to 550 kPa). |
| Intelligent Doorbell | Smart Home | i.MX RT700, SR250, IW612 |
| Intelligent Home Control Panel | Smart Home | i.MX93, PCA9451C, SR250, IW612 |
| Intelligent Vehicle Architectures | Automotive | CoreRide, S32N7, S32K5, TTTech Auto; Aviva Links -> IVN portfolio PD28 DC/DC, eF100 eFuse/sw/ctrl, FS29, S32K5 S32N79 with AI “engine”, S32K5 with NPU, eIQ Auto |
| NXP CoreRide Platform Gen. 1.0 | Automotive | S32K358, S32K344, S32G399, S32N55, SJA1110 |
| Post Quantum-Secure, AI-Ready & TSN-Safe Robotics Toolkit | Industrial | i.MX8M Plus (i.MX94 future), i.MX RT1176 |
| Radar Edge Intelligence | Automotive | SAF8xxx (Radar SoC), TJA1462 (CAN) |
| Simplified Matter Experience with NFC | Smart Home | RW612 + Matter V1.5, SE051H+, Android Mobile |
| Software-defined Factory with Edge AI and Secure Cloud | Industrial | i.MX 8 (will move to 943), Analog Front End + AI |
| Wireless GenZ BMS with UWB, EIS and 26-ch AFE | Automotive | BCC26, UWB, EIS BMA6060/BMA6061 - UWB Gateways BMA7426 - EIS BCC device BMA8420 - EIS BJB device BMA6402 - EIS TPL Gateway |
| X-in-1 Solution for EVs: Electrification Systems Optimization | Automotive | S32K39 MB; S32K5; FS27; IVN: CAN & Etdernet inverter gate driver; DC/DC; OBC; EVBMA7118W1 (BMS CMU wireless); EVCC; Thermal management board; HV GD316x; half-bridge HB200x |
Experience the excitement of NXP's cutting-edge technology and innovation showcased at CES 2025, including an exclusive tour inside the NXP Pavilion.