NXP Expands i.MX Single Chip Module Technology

Introduces  integration technology, V-Link, expanding the possibilities for customers

NXP Semiconductors today introduced an innovative new  vertical integration technology called V-Link and will be demonstrating at the  NXP Technology Forum the first product in the line-up which is based on the  i.MX 6SoloX single chip module (SCM). The V-Link bus allows customers to  customize their own system adding connectivity, sensing, and other  innovative off-the-shelf solutions on top of the base SCM device through  package-on-package assembly technology. This addresses applications where  customers need to rapidly prototype and create their own unique product  offerings in a very limited space.
  The single chip system module  portfolio is a highly featured, software-enabled, plug-and-play solution in an  extremely small footprint, and it’s completely designed and tested, enabling  customers to develop products within six months of sampling. V-Link technology  allows customers to use the design acceleration that SCM provides along with  the customization capabilities of the V-link bus. Integrated within the base SCM-i.MX  6SoloX V-Link device is low-power memory and a full Power Management IC (PMIC).  The SCM-i.MX 6SoloX V-Link is  recommended for consumer and industrial customers building compact and  low-power portable products in need of connectivity, security, sensing, and  graphical user interfaces. Customers can realize up to 68 percent PCB area  savings using the SCM plus V-Link technology.
  The SCM  portfolio continues to expand with new offerings at the lower-end of the  portfolio through the SCM-i.MX 6SoloX, supporting low-power memory via standard  package-on-package assembly technology, at a new, lower cost offering access to  samples and development boards for customers, as well as releasing the first  set of industrial parts for SCMs – the SCM-i.MX 6Dual and SCM-i.MX 6Quad. Continuing  to reduce the PCB area footprint, SCM devices are now also available with the  option to assemble ePoP – eMMC plus LPDDR2 – on top of the base SCM device.
  SCM products are engineered to  dramatically reduce time-to-market, allowing an estimated 25 percent reduction  in hardware development time – as well as greater than 50 percent reduction in  size versus current discrete solutions. The module’s exceptional performance  and connectivity allow customers targeting IoT markets to incorporate  sophisticated predictive data analytics capabilities into their products,  allowing for highly compelling and potentially disruptive end-products.

Availability and supporting  information

 
• Alpha samples for SCM-i.MX 6SoloX V-Link are available now  with general availability scheduled for Q3 2016. Technical specs can be found here. Technology  demonstrations are available from NXP partners CODE-ing Technologies, Boundary Devices and FirstView.
 
• Beta samples for the SCM-i.MX 6SoloX are available now with  general availability scheduled for Q3 2016. Technical specs can be found here.
 
• The SCM-i.MX 6Dual/6Quad ePoP and industrial solutions are  available now. Technical specs can be found here and here respectively.

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