Introduces integration technology, V-Link, expanding the possibilities for customers
NXP Semiconductors today introduced an innovative new vertical integration technology called V-Link and will be demonstrating at the NXP Technology Forum the first product in the line-up which is based on the i.MX 6SoloX single chip module (SCM). The V-Link bus allows customers to customize their own system adding connectivity, sensing, and other innovative off-the-shelf solutions on top of the base SCM device through package-on-package assembly technology. This addresses applications where customers need to rapidly prototype and create their own unique product offerings in a very limited space.
The single chip system module portfolio is a highly featured, software-enabled, plug-and-play solution in an extremely small footprint, and it’s completely designed and tested, enabling customers to develop products within six months of sampling. V-Link technology allows customers to use the design acceleration that SCM provides along with the customization capabilities of the V-link bus. Integrated within the base SCM-i.MX 6SoloX V-Link device is low-power memory and a full Power Management IC (PMIC). The SCM-i.MX 6SoloX V-Link is recommended for consumer and industrial customers building compact and low-power portable products in need of connectivity, security, sensing, and graphical user interfaces. Customers can realize up to 68 percent PCB area savings using the SCM plus V-Link technology.
The SCM portfolio continues to expand with new offerings at the lower-end of the portfolio through the SCM-i.MX 6SoloX, supporting low-power memory via standard package-on-package assembly technology, at a new, lower cost offering access to samples and development boards for customers, as well as releasing the first set of industrial parts for SCMs – the SCM-i.MX 6Dual and SCM-i.MX 6Quad. Continuing to reduce the PCB area footprint, SCM devices are now also available with the option to assemble ePoP – eMMC plus LPDDR2 – on top of the base SCM device.
SCM products are engineered to dramatically reduce time-to-market, allowing an estimated 25 percent reduction in hardware development time – as well as greater than 50 percent reduction in size versus current discrete solutions. The module’s exceptional performance and connectivity allow customers targeting IoT markets to incorporate sophisticated predictive data analytics capabilities into their products, allowing for highly compelling and potentially disruptive end-products.
Availability and supporting information
- Alpha samples for SCM-i.MX 6SoloX V-Link are available now with general availability scheduled for Q3 2016. Technical specs can be found here. Technology demonstrations are available from NXP partners CODE-ing Technologies, Boundary Devices and FirstView.
- Beta samples for the SCM-i.MX 6SoloX are available now with general availability scheduled for Q3 2016. Technical specs can be found here.
- The SCM-i.MX 6Dual/6Quad ePoP and industrial solutions are available now. Technical specs can be found here and here respectively.
– End –