LPC8N04 combines NFC and Microcontrollers (MCU) technology enabling energy harvesting and wireless communication for a diverse range of tagging and provisioning applications
SANTA CLARA, Calif., Oct. 24, 2017 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ:NXPI), the leader in mass market microcontrollers, today announced the new LPC8N04 MCU, the latest addition to the rapidly expanding LPC800 series of 32-bit ARM® Cortex®-M0+ based MCUs. Offering an integrated Near Field Communications (NFC) interface with energy-harvesting capability, the LPC8N04 MCU is optimized to address the growing need for cost-effective, short-range two-way wireless communication.
With the proliferation of NFC reader technology and rich graphical displays in today’s smartphones, combined with the open developer ecosystem of iOS and Android-based applications, the use of NFC technology has stretched beyond its original tap-to-pay intention. The LPC8N04 MCU enables developers to quickly implement broad-based solutions that leverage system diagnostics or environmental conditions for a smarter tagging experience. With the added benefit of flexible communication modes, solutions now also enable the ability to push data to an LPC8N04 MCU-based edge-node, for example in device provisioning, configuration or customization.
“NXP’s LPC8N04 MCU with integrated NFC extends our history of market disruption by bringing unique technology and innovation to the global microcontroller landscape,” said Geoff Lees, senior vice president and general manager of the microcontroller business at NXP. “We are excited to be able to democratize NFC technology – ushering a new wave of consumer and industrial IoT applications.”
Key features of the LPC8N04 MCU include:
- ARM Cortex-M0+ core with four flexible power modes
- Integrated 32 KB Flash, 8 KB SRAM and 4 KB EEPROM
- NFC/RFID ISO 14443 type A communication with energy harvesting supporting a diverse range of tagging and provisioning applications
- Integrated temperature sensor with +/- 1.5°C accuracy
- Two serial interfaces and 12 GPIOs
- 1.72 to 3.6 V operation and -40 to +85°C temperature range (ambient)
- Low cost, small footprint QFN24 package
Learn more at www.nxp.com/LPC8N04.
Enablement and Availability
This new MCU is supported by the LPC8N04 development board (OM40002) with easy-to-use code examples that are compatible with MCUXpresso, Keil and IAR IDEs.
The LPC8N04 MCU is sampling now. NXP is partnering with its distributors who will demonstrate the capabilities and offer full channel availability of this MCU in January 2018 with a full ecosystem, including tools, technical support, and a complete reference design to get to market quickly.
Experience LPC and how we are reimagining our world together at www.nxp.com/LPC.
See the LPC8N04 MCU in action at ARM TechCon 2017
The LPC8N04 development board (OM40002), along with the iOS and Android-based demo applications, will be demonstrated at NXP’s Booth #500 at the ARM TechCon technology showcase October 24-26, 2017 at the Santa Clara Convention Center in Santa Clara, California.
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ:NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 31,000 employees in more than 33 countries and posted revenue of $9.5 billion in 2016. Find out more at www.nxp.com.
NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. ARM and Cortex are trademarks or registered trademarks of ARM Ltd or its subsidiaries in the EU and/or elsewhere. All rights reserved. © 2017 NXP B.V.
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