Copenhagen –– NXP Semiconductors N.V. (NASDAQ: NXPI), has announced the RoadLINK Evaluation Kit 2.0. The kit, based on NXP’s SAF5400 single chip modem and its optional SXF 1800 secure element, provides a full featured solution for the development of secure V2X on board units (OBUs). As a high-performance foundation for V2X that is applicable to markets in Japan, Korea and the U.S., the kit aims to make V2X development easier for customers at the frontier of vehicle to everything communications.
In the quest to deliver V2X capabilities to the volume automotive market, developers seek tools that allow them to expand the boundaries of V2X development into emerging application areas such as truck platooning, vehicle to infrastructure and vehicle to vulnerable road user communications. To bring these new applications to market requires development tools that reduce the complexity of on-board unit development.
The RoadLINK V2X Evaluation Kit 2.0 Includes
NXP V2X News
NXP Launches World’s First Scalable, Single-Chip Secure Vehicle-to-X Platform
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ:NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has over 30,000 employees in more than 30 countries and posted revenue of $9.26 billion in 2017. Find out more at www.nxp.com
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Kiyomi Masuda (増田 清美)