Toradex Expands Portfolio with OSM Form Factors

About This Video

In this interview, NXP and Toradex® discuss their long-standing collaboration and the introduction of new OSM and Lino modules powered by the i.MX 93 and i.MX 91 applications processors.

The conversation explores the design rationale behind the new form factors, how they address customer needs for high-volume manufacturing and flexible deployment, and why Toradex chose to offer both solderable and connector-based module options for embedded system developers.

Explore how Toradex OSM  modules accelerate embedded product development.

Highlights

• NXP and Toradex discuss a collaboration spanning more than a decade
• New OSM and Lino modules bring flexibility to designs using the i.MX 93 and i.MX 91 applications processors
• OSM modules target compact designs and high-volume manufacturing applications
• Lino modules provide a connector-based approach that simplifies assembly, replacement and scaling
• Customers can choose between solderable and connector-based modules based on manufacturing capabilities and production volume requirements

Resources

• i.MX 95 Applications Processor
• Toradex Platinum Partner
• Toradex OSM Arm Family