The new i.MX RT1180 includes a Gb Time Sensitive Networking (TSN) Switch
enabling real-time rich networking integration handling both time-sensitive
and industrial real-time communication, includes a state-of-the-art
secure enclave, and an extensive developer ecosystem for a simplified
microcontroller design experience.
Manufacturers worldwide are already leveraging Industrial IoT (IIoT)
technologies to radically improve operations, streamline production and
optimize manufacturability. Instead of tearing down existing factories and
rebuilding from scratch, manufacturers are adding more efficient equipment,
advanced robotics and faster networks.
Communication gaps between legacy protocols like PROFINET make it a challenge
for these new technologies to work harmoniously with existing systems.
Time-sensitive data needs to transmit in real-time across the network. This
fully synchronized operation requires technologies that support a complex mix
of protocols and provide backward compatibility.
To achieve this, a combination of optimized processing power, low power
consumption, hardware security and flexible architectures while time-sensitive
network traffic capabilities are required.
NXP has expanded our crossover MCU portfolio to address this growing
industrial application need. The newly announced
i.MX RT1180 crossover MCU, the first with an integrated Gb time-sensitive networking (TSN) switch,
supports real-time communications and multiple communications protocols,
bridging the gap between existing industrial systems and Industry 4.0
platforms. The i.MX RT1180 is also the first NXP crossover MCU to include an
EdgeLock® secure enclave, a preconfigured, self-managed and autonomous on-die security subsystem that
eases the complexity of implementing robust, system-wide security intelligence
for industrial IoT and smart manufacturing.
Check out the multiprotocol i.MX RT1180 crossover MCU with an integrated TSN switch that unifies industrial IoT communications.
By using an all-in-one MCU solution with an integrated TSN switch and secure
enclave, developers can address a wide range of IIoT applications, handling
both time-sensitive traffic and best-effort traffic to enable secure automated
systems with real-time communication capabilities.
Advancing a New Era of Industrial Multiprotocol Connectivity
Using an MCU with a built-in TSN switch and multiprotocol capability offers
significant application benefits. Data can be transferred to and from the
switch, enabling real-time data transfers to interrupt non-real-time data
transfers without delay. These queues are managed by the switch driver and
interface to the protocol stack to achieve the most efficient data transfers
possible. This frees the application software from the tasks of managing the
switch, setting low-level registers or keeping track of intricate time
management processes, enabling time-sensitive applications to be up and
running all the time.
The i.MX RT1180 is among the smallest real-time industrial networking-capable
MCUs, making it easier to integrate application-critical multiprotocol and TSN
capabilities into a wider variety of industrial use cases. It provides an
optimized solution for automation tasks that require high-precision,
low-latency and real-time control over factory equipment and the entire plant.
Industrial IoT use cases include factory automation, compact motion control,
motor control industrial gateways, network companions, AC/servo drives, remote
I/O management and IO-link controllers.
The i.MX RT1180 crossover MCU supports the latest TSN standards compliant with
the EC/IEEE 60802 industrial TSN profile, as well as multiple industrial
real-time network protocols including EtherCAT, PROFINET, Ethernet/IP, CC-Link
IE and HSR. It also provides up to 5 Gb ports including 4x ports on a Layer 2
TSN switch and one port on an end-point TSN controller.
i.MX RT1180’s TSN switch supports all the above latest revisions of TSN
In addition to providing an integrated TSN solution, the i.MX RT1180 crossover
MCU can serve as a companion chip in industrial designs, offering seamless 1
Gb direct communication between a host device and the companion without
requiring an on-board PHY, providing additional power and cost savings.
Securing the Industrial IoT
While smart factories deliver the undeniable benefits of increased production
and distribution efficiencies and cost savings, IIoT connectivity also brings
new security risks. As factories boost their levels of connected devices,
potential cybersecurity threats also increase. Inadequately protected
industrial processes, operations and networks pose vulnerable attack surfaces
for corporate data and intellectual property theft, disruption or denial of
process controls, network security breaches and nation-state attacks on
critical infrastructure and supply chains.
To protect factories, equipment and networks against cyberattacks,
manufacturers must implement and continuously maintain holistic,
state-of-the-art industrial security platforms. Advanced security through
on-device and system-level protection is essential to secure today’s smart,
connected factories. Even system-level components such as MCUs must provide
advanced security features. NXP’s EdgeLock secure enclave—a fully integrated,
on-die security subsystem—does just that.
The EdgeLock secure enclave functions like a “security HQ” inside the i.MX
RT1180 crossover MCU, overseeing all security functions to protect devices
against physical and network attacks. It eases the complexity of implementing
robust, device-wide security intelligence for IoT applications through
autonomous management of critical security functions, such as root of trust,
run-time attestation, trust provisioning, secure boot, key management and
EdgeLock secure enclave also provides a component-level foundation for IEC
62443 system compliance. IEC 62443 is a set of security standards defining the
secure development of industrial automation and control systems (IACS). These
standards provide an essential foundation for requirements addressing
cybersecurity threats to industrial plants, equipment, networks and
infrastructure. IEC 62443 compliance helps manufacturers avoid the
proliferation of partial and/or conflicting requirements for addressing the
cybersecurity needs of operational technology across multiple industry sectors
and operating sites.
Designed for Efficiency
Aiming to provide performance, power efficiency as well as design flexibility,
the i.MX RT1180 crossover MCU’s efficient SoC design includes a dual-core
architecture featuring 800 MHz Arm® Cortex®-M7
and Cortex®-M33 cores that keep both real-time and applications
processing tasks in harmony. It easily communicates with host chips such as
NXP i.MX processors. This compatibility simplifies industrial design and eases
implementation. Scalable and seamless host/companion chip communication going
up to 1Gbps without an on-board PHY helps reduce power and cost in industrial
i.MX RT1180 Block Diagram
To better experience download the
Designed for power efficiency with use cases starting from 250 mW, the MCU’s
integrated power management IC (PMIC) helps enable the exceptional energy
efficiency that’s critical for many industrial applications while helping to
reduce board complexity and BOM cost.
Available in a 10 mm x 10 mm or 14 mm x 14 mm BGA package, the i.MX RT1180
crossover MCU operates in a robust extended temperature range (-40 ⁰C to +125
⁰C), providing industrial qualification and high reliability for factory
equipment running 24/7 and 365 days a year, as well as automotive AEC-Q100
An extensive developer ecosystem simplifies the embedded design experience for
systems built around the i.MX RT1180 SoC. The
MCUXpresso Suite of Software and Tools
for NXP MCUs based on Arm Cortex-M technology includes device configuration
tools, drivers and middleware, a fully featured IDE, SDK examples and a secure
The i.MX RT1180 crossover MCU provides a bridge to the future for smart
factories, closing the gap between legacy and current protocol standards with
an integrated TSN switch. Learn more about the multiprotocol capabilities,
advanced security and design efficiency of the