Semiconductor manufacturing generates hazardous, nonhazardous, office, and one-time waste. Most of the waste generated from our operations is tied to the manufacturing of our products. We have waste reduction programs in place at our sites to handle and manage hazardous and nonhazardous waste in an environmentally responsible manner, and increase the percentage of waste recycled. To continue progress toward our goal to increase our recycling rate we continue to identify innovative ways to recycle or recover waste streams for reuse, or even convert them into sources of revenue
For waste that requires specialized handling, we only ship to vendors equipped with the knowledge and expertise to properly reclaim, recycle, or destroy. All handling of our waste is done according to global and local rules and regulations. We audit the waste management vendors to ensure they are responsibly handling, meeting all regulatory requirements and ultimately managing the disposition of the waste with minimal impact on the environment.
Increase the recycle rate of both hazardous and nonhazardous waste to 90% by 2020 from a 2010 baseline.
NXP’s strategy is to continuously look for opportunities to reduce the amount of waste generated by improving yield and quality programs and increase our recycling initiatives by improving site recycling programs and expand material reclamation efforts.
- Continue to recycle/reuse spent materials
- Identify new opportunities to recycle
- Establish more recycling vendor possibilities in local regions
- Remove single use plastic from our cafeterias, café, and pantries with sustainable and reusable alternatives
Our total waste is calculated for our fabs and assembly operations and includes onetime disposal. We consider onetime waste as those waste streams that are generated not part of normal operations but rather generated as a result of unique one-off project. Examples include: construction debris from site demolition and roofing debris. In 2010, our recycling rate was 65% and in 2018 the recycling rate increased to 75%. Taking out the one-time disposal, 62.3% of waste comes from wafer fabs and 37.7% from assembly operations. Waste generated from operations was 74.9% recycled, 19.2% goes to landfill, and 6.3% is incinerated. The recycling slightly increased when compared to 2017. In 2018, we continued our work to better understand the process for each site and how to optimize our recycling opportunities across the globe. Our investigations concluded that there was inconsistency in calculating the rate, which has been corrected from 2018 and onwards. In addition, we have experienced recycling vendors serving some locations either do not have options for specific streams or due to demand, no longer able to recycle. Our biggest opportunity to increase recycling is to be able to manage our waste water sludge. In some locations, there are opportunities to recycle the sludge material and in other locations there are not. We continue to search for alternative recycling vendors to increase our 2019 recycling opportunities.
NXP has a very proactive “reclaim” program and uses the best available technology to manage e-scrap. E-scrap is collected from factories, test centers, and subcontractors around the world. The materials collected include process metallic scrap pieces, parts and fixtures, failed test devices and ICs, engineering materials, test architecture boards, chemicals, silicon in all forms and manufacturing process byproducts containing metallic components. NXP processes these materials not only to recover the value of metals and silicon, but to do so in an environmentally sound method available with minimal waste going to the landfill. The smelter captures nearly 100% of the material available for recovery.
While our products are not typically subject to recycling or e-waste laws, we work with others to identify shared solutions for our used products. We also take steps to integrate environmental considerations into the design phase of our products to minimize environmental impacts of our products at their end of life.
In 2018, NXP conducted an audit of our back-end facilities e-scrap program and our e-waste vendors, which provided additional opportunities to increase reclaim effectiveness. The audit’s purpose was to review and ensure security controls were in place for asset, IP, and anti-counterfeit protection. Proper EHS methods were used in the entire e-scrap disposal process. Checks and balances were in place to make sure the material was properly crushed; split and all material were accounted for. For additional assurance, comparative analysis and internal benchmark was conducted.
Overall, there were no significant issues observed, additional improvements have been documented for program improvements. Corporate and site teams have action plans in place and will continue monitoring the program.
To make sure our products reach our customers undamaged, we use special packaging materials to protect them during shipment. We are committed to using sustainable pack-and-ship methods and using specially designed packaging tubes and shipping trays that occupy minimum space, are light in weight for shipping purposes and are easy to recycle.
We work with our packaging suppliers to drive changes in the materials that we use to ship products between our sites and our customers. Our long-term vision is to have a sustainable and closed-loop packaging program for all inbound, outbound, and return shipments.
We advise our customers on the possibilities for recycling, and know that most of our larger customers already have recycling programs in place, but we don't have accurate figures on how much of our packaging is recycled by our customers.
As discussed in other chapters of the report, during 2018, our internal wafer fab manufacturing produced slightly less product than in 2017. At the same time, NXP did an increased level of manufacturing with our external partners and produced 19% more individual devices in 2018. This was primarily due to the specific product mix that was in demand and sold in 2018. Due to this reason, the total packaging tonnage increased to 4,560 tons, an increase of 4.7% of packaging from 2017.
Our packaging uses mainly paper & cardboard (1,560 tons) and plastic (2,985 tons) in 2018. While the 2018 packaging data includes a majority of NXP sites, it does not include all. We intend to include all NXP sites in future reports.