This page contains information on a product that is no longer manufactured (discontinued). Specifications and information herein are available for historical reference only.
Click image to open expanded view
Surface Mount to DIP Evaluation Board OM13496
The OM13496 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13496 supports the following packages: QSOP16 (SOT519-1), XFBGA16 (SOT1354-1), XQFN16 (SOT1161-1), TSSOP28 (SOT361-1).