SiC EV Power Inverter Control Reference Platform

Engineered for enabling SiC MOSFET in high-voltage traction motors.


Power PCB top view
Motor Control PCB top view
Power PCB bottom view
Motor Control PCB bottom view


Technical and Functional Specifications


  • Contains two PCB boards described below and software to drive a three-phase motor to enable quick development of your in-house inverter design using a complete NXP solution.
  • For each of the boards included in the EV-INVERTERHD enablement kit hardware schematics, PCB layout and gerber files are available for download from a secured site.

MCU Control Board

  • This board contains four key NXP integrated circuits, interface connector and current sensors. The MPC5775E is a 32-bit Power Architecture© dual-core ASIL D MCU targeted for motor control, offering performance up to 264 MHz/core, CSE security, eTPU timers, software resolver and a highly scalable solution. The FS65xx system basis chip (SBC) provides power to the MCU, optimizing energy consumption and providing low voltage side monitoring and protection. The TJA1051 transceiver for high-speed CAN applications in the automotive industry provides the differential transmit and receive capability to the MPC5775E and a CAN protocol controller. As an alternative communication protocol, the TJA1100HNZ is an automotive Ethernet PHY chip with 100BASE-TI single-port PHY optimized for automotive use cases.
  • Interface connector is a 23-pin connector for motor control inputs.
  • Three LEM current sensors are incorporated on the board providing +/- 900 amp measurement range.

Driver Control Board for HD Module

  • This board features the GD3160 advanced single-channel gate driver for IGBTs and SiC MOSFETs. The GD3160 capabilities include enhanced short circuit detection < 1.2 μs, integrated 15 A gate current, AMC, HV galvanic isolation, temperature sensing, optimized segmented drive, two-level turn-off, soft-shutdown and SPI configurability. This device is ASIL D certified and autonomously manages severe faults and offers two reporting channels via INTA and INTB pins and SPI output. In the inverter, this board drives the StarPower P6 (HybridPACKTM Drive) module footprint populated with Cree 1200 V/600 A 13 mΩ SiC MOSFET die.

Basic Software Featuring:

  • Software will be provided to allow for system configuration and basic control of a three-phase inverter for driving a permanent magnetic synchronous motor (PMSM) or induction motor.
    • Low-level SDK device drivers and inverter services middleware with function calls for controlling platform motor operations.
    • Advanced AMMCLib optimized software libraries for precise motor drive control.
    • FreeMASTER graphical user interface for operating and monitoring the inverter platform.

Functional Safety

  • ASIL C/D compliance with small, compact 10 IC system footprint
  • Robust fail-silent SBC with grade 0 capability
  • Functional safety case and enablement software with API

Inverter Specifications

  • Peak output power > 180 kW continuous
  • Operating input voltage range 350-600 VDC
  • Nominal operating voltage 600 VDC
  • Continuous current > 220 A, rms / peak current > 450 A, rms
  • Motor operating speed: Maximum speed 12 k RPM for 30 sec, nominal speed 6.4 k RPM
  • PWM switching frequency: 3–12 kHz
  • Maximum inverter electrical efficiency may perform > 99%

System Control

  • Efficiently drives 180 kW 3-phase motor from a 400 V supply
  • Redundant CAN bus interface with low power standby
  • Integrated galvanic signal isolation in SiC/IGBT gate drivers


  • Small footprint ASIL D 180 kW power inverter enablement
  • Inverter mechanical envelope: 28 x 28 x 14 cm
  • Inverter mass < 10 Kg

Motor Configuration

  • 3 Phase PMSM

Voltage / Power

  • Operating voltage: 250-600 VDC, nominal 600 VDC
  • Peak current: 450 A rms
  • Peak output power: 180 kW for 30 sec

Torque / Speed

  • Continuous 135 Nm, peak 300 Nm
  • Maximum speed 12 k RPM for 30 sec, nominal speed 6.4 k RPM

Motor sensors

  • Resolver mechanical position sensor

Motor size

  • 250 mm OD X 275 mm L
  • Weight: 59 kg dry


  • EV-INVERTERHD   Qualification

  • SiC EV Power Inverter Control Reference Platform

Design Resources

Enablement Kit Development Support

The EV-INVERTERHD enablement kit comes with:

  • MCU control board and driver control board for HybridPACKTM module
  • Registration ID for entitlement to download the development suite (downloadable upon activation)

Access to development suite include:

  • NXP device collateral

    MPC5775E, GD3160, FS6500, TJA1051, TJA1100 - Datasheets, errata’s, functional safety document and software drivers

  • Enablement kit hardware design collateral

    Reference design schematics (PDF), Gerber files, BOM, user manual

  • Software

    Basic software with service level SDK drivers and software user manual outlining installation

    Advanced AMMCLIB optimized software libraries for precise motor drive control

    FreeMaster graphical user interface for operating and monitoring the inverter platform

  • System safety package (in development 2021)

Get Help

Training and Events

This NXP webinar provides a technical deep dive of a complete traction inverter system solution (hardware, software, functional safety) for electric vehicles and addresses the transition from using IGBTs to SiC MOSFETs. Includes functional safety and the xEV inverter.


Vepco Technologies Inc is an engineering service company with more than 30 years of combined experience in the EV and electric machine industry.