FREESCALE

 

Freescale Semiconductor, Inc.

Issuing Division: NETWORK & COMM SYS DIV - NCSD ( NB / NC / ND / NI / N M )


PRODUCT AND PROCESS CHANGE NOTIFICATION

Generic Copy


28-SEP-2004



Subject:               FREESCALE PRODUCT AND PROCESS CHANGE NOTIFICATION 10332
TITLE:

C-5E/C-3E SPEC CHANGE FROM MSL1 TO MSL5


EFFECTIVE DATE:        27-Dec-2004


AFFECTED CHANGE CATEGORIES

LABELING CHANGE ON SHIPPING PACKAGE

DEVICE SPECIFICATION / ERRATA

SHIPPING/PACKAGING MATERIALS



AFFECTED PRODUCT DIVISIONS

COMPUTING PLATFORM DIVISION - CPD ( NR )

NETWORK & COMM SYS DIV - NCSD ( NB / NC / ND / NI / NM )

DIGITAL AUDIO, RADIO & TELEMATICS DIVISION - DART ( JI )

8/16 BIT DIVISION ( JD )

RADIO FREQUENCY DIVISION - RFD ( NH )


ADDITIONAL RELIABILITY DATA: Available
REFERENCE: Contact Sales Office (RVML40)

Contact your local Sales Office.


SAMPLES: Contact Local Sales Office
REFERENCE: Contact Sales Office ()

Contact your local Sales Office.


For any questions concerning this notification:
REFERENCE: Contact Sales Office (ALEXANDRA DOPPLINGER)

DISCLAIMER
      DISCLAIMER:
     
      FREESCALE WILL CONSIDER THIS CHANGE APPROVED UNLESS SPECIFIC
      CONDITIONS OF ACCEPTANCE ARE PROVIDED IN WRITING WITHIN 30 DAYS OF
      RECEIPT OF THIS NOTICE. TO DO SO, CONTACT YOUR LOCAL SALES OFFICE.

DO NOT REPLY TO THIS MESSAGE.
GPCN FORMAT:           CUSTOMER

DESCRIPTION AND PURPOSE

      Please note that the C-5e/C-3e Network Processors Product Family
      have been downgraded to MSL5 with a maximum peak reflow temperature
      of 225C. This has occurred as a result of non-adhesion observed
      during an inline monitor performed at the current MSL level and
      rated peak reflow temperature of MSL1/240C.
     
      The MSL downgrade was caused by wafer fab process variation which in
      turn led to non-adhesion between the die and package underfill
      material at MSL1/240C. A qualification has been successfully
      performed at MSL5/225C to establish and document the reliability of
      the product with no adhesion issues observed.
     
      An MSL5/225C inline monitor will be performed to confirm reliable
      adhesion on future lots.
     
      In summary, as of 16-August-2004, C-5e/C-3e network processors
      (i) will be downgraded from MSL1 to MSL5 and their package will be
      marked accordingly,
      (ii) will be shipped according to MSL5 recommendations in dry pack
      with desiccant, and
      (iii) will undergo an MSL5/225C inline monitor to detect if this
      condition affects future lots.
     
      Customers must handle C-5e/C-3e using the following process:
      (i) After C-5e/C-3e is removed from dry pack, it must be stored
      under MSL5 conditions for less than 48 hours before solder reflow,
      i.e. stored at temperatures less than 30 degrees Celsius and
      relative humidity levels less than 60 percent.
      (ii) If MSL5 storage conditions are not met, or if C-5e/C-3e must be
      removed from a board, they should be baked at 125 degrees Celsius
      for 24 hours and stored under MSL5 conditions for less than 48 hours
      before solder reflow.
      (iii) C-5e/C-3e should be soldered using Jedec 020B standard
      recommended reflow temperatures below 225 +0/-5 degrees Celsius for
      less than 5 to 10 seconds.

QUALIFICATION PLAN

      Please see Reliability Summary

RELIABILITY DATA SUMMARY

      Pre Conditioning MSL5 / 225C Reflow:
     
      Electrical Results
      FC31211 - 0/98
      FC71891 - 0/99
      FF10681 - 0/99
     
      CSAM Results
      FC31211 - 0/21
      FC71891 - 0/22
      FF10681 - 0/22
     
      -55/125C Temp Cycle w/MSL5 / 225C Reflow:
      400 Cycles
      FC31211 - 0/91
      FC71891 - 0/100
      FF10681 - 0/95
      800 Cycles
      FC31211 - 0/88
      FC71891 - 0/99
      FF10681 - 0/92
     
      Pre Conditioning MSL5 / 225C Reflow:
      Electrical Results
      FC31211 - 0/78
      FC71891 - 0/79
      FF10681 - 0/76
     
      85%RH/85C Temp Humidity w/MSL5 / 225C Reflow:
      504 Hours
      FC31211 - 0/76
      FC71891 - 0/76
      FF10681 - 0/75
     
      * Units were discounted due to damage as a result of handling.
      Other units were discounted after confirmation that they were not
      related to non-adhesion or other package issues.

ELECTRICAL CHARACTERISTIC SUMMARY

      No changes were made which could affect product electrical
      performance.

CHANGED PART IDENTIFICATION

      N/A


AFFECTED DEVICE LIST

 

PART

MCC3E0RX180WB0B

MCC5E0RX233WB0B

MCC5E0RX266WB0B

MCC5E0RX300WB0B