FREESCALE

Freescale Semiconductor, Inc.
Issuing Division: 8/16 BIT DIVISION ( JD )

PRODUCT BULLETIN
Generic Copy

04-FEB-2005


Subject:               FREESCALE PRODUCT BULLETIN 10604
TITLE:
TSPG 8/16BIT 812A4 COLD TEST ELIMINATION

EFFECTIVE DATE:        05-Feb-2005


AFFECTED CHANGE CATEGORIES
  • TEST PROCESS


  • AFFECTED PRODUCT DIVISIONS
  • COMPUTING PLATFORM DIVISION - CPD ( NR )
  • NETWORK & COMM SYS DIV - NCSD ( NB / NC / ND / NI / NM )
  • DIGITAL AUDIO, RADIO & TELEMATICS DIVISION - DART ( JI )
  • 8/16 BIT DIVISION ( JD )
  • 32 BIT EMBEDDED CONTROLLER DIVISION - TECD ( JB )
  • RADIO PRODUCTS DIVISION - RPD ( VW )
  • WIRELESS SOLUTIONS DIVISION - WSD ( VC )
  • RADIO FREQUENCY DIVISION - RFD ( NH )

  • ADDITIONAL RELIABILITY DATA: Available
    REFERENCE: Contact Sales Office (RJAD80)
    Contact your local Sales Office.

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    REFERENCE: Contact Sales Office (KY NGUYEN)

    DISCLAIMER
          DISCLAIMER:
         
          FREESCALE CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS
          OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL
          SALES OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          As part of the continuous improvement process, Freescale would like
          to announce the successful completion of the cold test (-40
          Celsius) elimination from the final test flow for the HC812A4
          family.
         
          The evaluation process has been successfully completed according to
          Freescale specification 12MRE10539D, with all criteria met.
         
          The test flow will be changed to remove 100 percent cold test. The
          production final test flow will now be:
         
          100 percent Burn-In
         
          100 percent Ambient Test
         
          100 percent Hot Test
         
          Sample QA Gate at hot, ambient and cold per sampling plan.
         
         

    QUALIFICATION PLAN

          1. Analyze failures from a minimum of 10,000 parts from 5 different
          wafer lots.
         
          2. Ensure all cold test failures from existing test flow are
          captured as failures in either Ambient or Hot test flow.
         
         

    RELIABILITY DATA SUMMARY

          Qualification was carried out successfully for a total of 10K units
          tested, representing 5 different wafer lots processed in the same
          fabrication facility with 0 failures at cold.
         
         

    ELECTRICAL CHARACTERISTIC SUMMARY

          Not required.
         
         
         

    CHANGED PART IDENTIFICATION

          N/A
         
         
         


    AFFECTED DEVICE LIST

    PART
    MC68HC812A4CPV8
    XC68C812A4PV5
    =======================================================================