FREESCALE

Freescale Semiconductor, Inc.
Issuing Division: 8/16 BIT DIVISION ( JD )

PRODUCT AND PROCESS CHANGE NOTIFICATION
Generic Copy

09-FEB-2005


Subject:               FREESCALE PRODUCT AND PROCESS CHANGE NOTIFICATION 10611
TITLE:
HC908EY16 COLD TEMP TEST ELIMINATION

EFFECTIVE DATE:        10-May-2005


AFFECTED CHANGE CATEGORIES
  • TEST PROCESS


  • AFFECTED PRODUCT DIVISIONS
  • NETWORK & COMM SYS DIV - NCSD ( NB / NC / ND / NI / NM )
  • ANALOG PRODUCT DIVISION - APD ( JS )
  • DIGITAL AUDIO, RADIO & TELEMATICS DIVISION - DART ( JI )
  • 8/16 BIT DIVISION ( JD )
  • 32 BIT EMBEDDED CONTROLLER DIVISION - TECD ( JB )
  • RADIO PRODUCTS DIVISION - RPD ( VW )

  • ADDITIONAL RELIABILITY DATA: Available
    REFERENCE: Contact Sales Office (R23683)
    Contact your local Sales Office.

    SAMPLES: Contact Local Sales Office
    REFERENCE: Contact Sales Office ()
    Contact your local Sales Office.

    For any questions concerning this notification:
    REFERENCE: Contact Sales Office (COLIN JACKSON)

    DISCLAIMER
          DISCLAIMER:
         
          FREESCALE WILL CONSIDER THIS CHANGE APPROVED UNLESS SPECIFIC
          CONDITIONS OF ACCEPTANCE ARE PROVIDED IN WRITING WITHIN 30 DAYS OF
          RECEIPT OF THIS NOTICE. TO DO SO, CONTACT YOUR LOCAL SALES OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          Freescale Semiconductors would like to announce the successful
          correlation of the elimination of cold test from the final test
          flow on the MC68HC908EY16 (2L31N).
         
          The evaluation process has been successfully completed according to
          Motorola specification 12MRE10539D, with all criteria met. The
          results of this exercise are summarized below.
         
          The test flow will be changed to remove 100 percent cold test. The
          production final Test Flow will now be 100 percent Burn-In, 100
          percent Hot Test, 100 percent Ambient Test and QA Gate Sampling
          Plan.
         
         

    QUALIFICATION PLAN

          1. Analyze failures from a minimum of 46,052 parts from at least 12
          wafer lots taken from MC68HC908EY16.
         
          2. Ensure all cold test failures from existing test flow are
          captured as failures in cold eliminated test flow.
         
          3. Eliminate cold test on MC68HC908EY16 after customer
          notification.
         
         

    RELIABILITY DATA SUMMARY

          Cold test elimination was validated using 50,287 devices from 14
          TSC6 wafer lots.
         
          100% correlation of cold fails was achieved to the revised test
          flow.
         
          All test patterns removed as a result of cold elimination are
          covered at either hot or ambient.
         
          A full report is available on request.
         
         

    ELECTRICAL CHARACTERISTIC SUMMARY

          N/A
         
         
         

    CHANGED PART IDENTIFICATION

          N/A
         
         
         


    AFFECTED DEVICE LIST

    PART
    MC68HC908EY16CFA
    MC68HC908EY16FA
    MC68HC908EY16KFA
    MC68HC908EY16MFA
    MC68HC908EY16VFA
    MC908EY16CFAR2
    MC908EY16FAR2
    MC908EY16KFAR2
    MC908EY16MFAR2
    MC908EY16VFAR2
    =======================================================================