FREESCALE

Freescale Semiconductor, Inc.
Issuing Division: 8/16 BIT DIVISION ( JD )

PRODUCT AND PROCESS CHANGE NOTIFICATION
Generic Copy

04-MAR-2005


Subject:               FREESCALE PRODUCT AND PROCESS CHANGE NOTIFICATION 10687
TITLE:
NEW ASSY & TEST SITE FOR PB-FREE 32SDIP

EFFECTIVE DATE:        15-Mar-2005


AFFECTED CHANGE CATEGORIES
  • SUBCONTRACTOR ASSEMBLY SITE
  • SUBCONTRACTOR TEST SITE


  • AFFECTED PRODUCT DIVISIONS
  • DIGITAL AUDIO, RADIO & TELEMATICS DIVISION - DART ( JI )
  • 8/16 BIT DIVISION ( JD )

  • ADDITIONAL RELIABILITY DATA: Available
    REFERENCE: Contact Sales Office (R37287)
    Contact your local Sales Office.

    SAMPLES: Contact Local Sales Office
    REFERENCE: Contact Sales Office ()
    Contact your local Sales Office.

    For any questions concerning this notification:
    REFERENCE: Contact Sales Office (MIKE CHEUNG)

    DISCLAIMER
          DISCLAIMER:
         
          FREESCALE WILL CONSIDER THIS CHANGE APPROVED UNLESS SPECIFIC
          CONDITIONS OF ACCEPTANCE ARE PROVIDED IN WRITING WITHIN 30 DAYS OF
          RECEIPT OF THIS NOTICE. TO DO SO, CONTACT YOUR LOCAL SALES OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          Freescale Semiconductor is announcing the qualification of Nantong
          Fujitsu Microelectronics Co. Ltd. (NFME) located in Jiangsu, China,
          as an assembly and test site for 32 SDIP Lead-free (pure Tin lead
          finish) package for MCU 68HC08JL8. This new HC08JL8 lead-free
          device will only be implemented upon specific customer request for
          lead-free solution. All existing SnPb (non lead-free) parts will
          not be affected. Comprehensive qualification has been completed
          fulfilling Freescale qual requirements.
         
          The package material in NFME 32SDIP will be:
          Mold Compound: Sumitomo EME6300
          Die Attach: Sumitomo CRM-1033BF
          Lead finish: Pure Tin Plating
         
          The test platform in NFME will be:
          Advantest T3326
         
         

    QUALIFICATION PLAN

          Refer to Reliablity Summary.
         
         
         

    RELIABILITY DATA SUMMARY

          Highlights of qual results are tabulated as below:
         
         
          _________________No of
          ___TEST__________LOTS______________Qual Results
          ---------------------------------------------------------
          ___HTOL___________3__________0/231 for 168hrs & 0/231 for 504hrs
          ___ELFR
          (for commercial)__3__________0/930 for 24hrs
          (for industrial)__3__________0/1833 for 24hrs
          ___HTS____________3__________0/231 for 504hrs at 175C
          ___TC_____________3__________0/231 for 500cyc
          ___AC_____________3__________0/231 for 96hrs
          ___HAST___________3__________0/231 for 96hrs
         
          Process characterization per Freescale standard and correlation
          study had also been performed with satisfactory results.
         
          Other assembly process cz tests were completed and fulfilled
          Freescales acceptance criteria, including:
          Pure tin whisker grow measurement
          Solderability
          Physical Dimension measurement
          Wire pull strength test
          Ball shear strength test
          Pure tin composition and plating thickness
         
          For customers who want to get a copy of the above qual report,
          please feel free to contact the Freescale sales people.
         
         

    ELECTRICAL CHARACTERISTIC SUMMARY

          All electrical parameters are confirmed to meet our product
          specification.
         
         

    CHANGED PART IDENTIFICATION

          Traceability code will indicate the site, NFME is XN.
         
         
         


    AFFECTED DEVICE LIST

    PART
    MC68HC08JL8CSP
    MC68HC08JL8MSP
    =======================================================================