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DEVICE MIGRATION
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ISSUE DATE:30-May-2014
NOTIFICATION:15835
TITLE:P5040 Rev. 2.1 Family Pb-free Wafer Bump for RoHS Compliance
LAST BUY DATE:30-May-2015
LAST SHIP DATE:29-May-2016


DEVICE(S)
MPNREPLACEMENT MPNREPLACEMENT TYPEREPLACEMENT REASON
P5021NSE12QBP5021NSE12QB Replaced BY P5021NSE72QCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process
P5021NSE1TMBP5021NSE1TMB Replaced BY P5021NSE7TMCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process
P5021NSE1VNBP5021NSE1VNB Replaced BY P5021NSE7VNCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process
P5021NSN12QBP5021NSN12QB Replaced BY P5021NSN72QCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process
P5021NSN1TMBP5021NSN1TMB Replaced BY P5021NSN7TMCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process
P5021NSN1VNBP5021NSN1VNB Replaced BY P5021NSN7VNCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process
P5021NXE1TMBP5021NXE1TMB Replaced BY P5021NXE7TMCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process
P5021NXN1TMBP5021NXN1TMB Replaced BY P5021NXN7TMCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process
P5040NSE12QBP5040NSE12QB Replaced BY P5040NSE72QCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process
P5040NSE1TMBP5040NSE1TMB Replaced BY P5040NSE7TMCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process
P5040NSE1VNBP5040NSE1VNB Replaced BY P5040NSE7VNCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process
P5040NSN12QBP5040NSN12QB Replaced BY P5040NSN72QCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process
P5040NSN1TMBP5040NSN1TMB Replaced BY P5040NSN7TMCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process
P5040NSN1VNBP5040NSN1VNB Replaced BY P5040NSN7VNCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process
P5040NXE1TMBP5040NXE1TMB Replaced BY P5040NXE7TMCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process
P5040NXN1TMBP5040NXN1TMB Replaced BY P5040NXN7TMCSame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process,Bill of Material Change (same assembly site),Mask Set Revision (same fabrication site),Wafer Process



AFFECTED CHANGE CATEGORIES
  • ASSEMBLY PROCESS

  • BILL OF MATERIAL CHANGE (SAME ASSEMBLY SITE)

  • MASK SET REV (SAME FAB SITE)

  • WAFER PROCESS


  • DESCRIPTION OF CHANGE

    P5040 has been qualified with lead free (Pb-free) C4 wafer bumps to make this product RoHS compliant. P5040 revision 2.0 was used to qualify Pb-free C4. Pb-free C4 will only be available on revision 2.1 silicon.

    Customers may now order qualified samples for P5040 Rev. 2.1 devices with Pb-free wafer bumps by replacing the "B" suffix for revision 2.0 with a "C" suffix for revision 2.1. 

    The numeric change from a "1" to a "7" designates a part with  Pb-free C4 wafer bumps.

      Example for Ordering Customer Samples     
      Standard Rev. 2.0 Pb C4 Part Number Rev. 2.1 Pb-free C4 Part Number  
      P5040NSE1TMB P5040NSE7TMC  
           

    Please note that we are changing the C4 wafer bumps to lead free, not the C5 package sphere interconnect.  

    The C5 lead free spheres are already in production. There is no reflow process change.

     

     



    REASON FOR CHANGE

    P5040 lead free (Pb-free) C4 wafer bump has been qualified to satisfy the 2016 RoHS directive. Rev. 2.1 addresses Rev. 2.0 errata.

     

     



    ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

    There is no change of fit, form, or reliability.  Functional changes address Rev. 2.0 errata.




    Freescale will consider specific conditions of acceptance of this change submitted within 30 days of receipt of this notice on a case by case basis. To request further data or inquire about the notification, please enter a Service Request.

    For sample inquiries - please go to www.freescale.com

    QUAL DATA AVAILABILITY DATE:     27-Oct-2013

    QUALIFICATION STATUS:     COMPLETED

    QUALIFICATION PLAN:

    P5040 Rev 2.1 silicon has achieved Freescale’s industrial qualification criteria.   The Qualification Report is attached to this notification.



    RELIABILITY DATA SUMMARY:

    The Qualification Report for P5040 Rev. 2.1 is attached to this notification. The Qualification Report also shows the reliability stress data for the lead-free wafer bump qualification where Rev. 2.0 silicon was used.



    ELECTRICAL CHARACTERISTIC SUMMARY:

    An electrical characterization report is not required.





    CHANGED PART IDENTIFICATION:

    Customers may now order qualified samples for P5040 Rev. 2.1 devices with Pb-free wafer bumps by replacing the "B" suffix for revision 2.0 with a "C" suffix for revision 2.1.  The numeric change from a "1" to a "7" designates a part with Pb-free C4 wafer bumps.

      Example for Ordering Customer Samples     
      Standard Rev. 2.0 Pb C4 Part Number Rev. 2.1 Pb-free C4 Part Number  
      P5040NSE1TMB P5040NSE7TMC  
           



    SAMPLE AVAILABILITY DATE: 15-May-2014



    ATTACHMENT(S):
    External attachment(s) FOR this notification can be viewed AT:
    15835_P5040_Qual_Report.pdf