|TITLE:||Q-Family Shipping/Packaging Materials and MPQ Change|
Freescale Semiconductor issues this Product Bulletin to clarify the shipping and packaging materials, and Minimum Packaging Quantity (MPQ), for the Freescale Tianjin, China SOIC54 package devices associated with this notification. Previously Freescale announced the final test and burn-in site capacity expansions for these devices from STATS ChipPAC Malaysia test site and KES Malaysia burn-in site to Freescale Tianjin, China test facility, and KES China and TRIO-TECH TJN China burn-in facilities.
As a result of the final test expansion to Freescale Tianjin China facility, the following shipping/packaging materials and MPQ will change:
1. Carrier tape width change from 32mm to 24mm
2. Cover tape width change from 25.5mm to 21.3mm
3. Lockreel width change from 32mm to 24mm
4. Retainer tape change to 24mm ring foam
5. MPQ=POQ (Preferred Order Quantity) =1000 units/reel for T&R, MPQ=26 and POQ=2080 for Tube packing
Shipping/Packaging materials and MPQ change as a result of the test site expansion to Freescale Tianjin, China facility, which will improve manufacturing flexibility and customer support.
No impact to device form, fit, function or reliability, however shipping/packaging materials dimensions change as captured in Description of Change section.
RELIABILITY DATA SUMMARY:
ELECTRICAL CHARACTERISTIC SUMMARY: