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DEVICE MIGRATION
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ISSUE DATE:15-Aug-2014
NOTIFICATION:16365
TITLE:MPC8533/8544 Device Migration from Leaded Wafer Bumps to Lead-Free Wafer Bumps
LAST BUY DATE:15-Aug-2015
LAST SHIP DATE:14-Aug-2016


DEVICE(S)
MPNREPLACEMENT MPNREPLACEMENT TYPEREPLACEMENT REASON
MPC8533EVTALFAMPC8533EVTALFA Replaced BY MPC8533EVJALFASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8533EVTANGAMPC8533EVTANGA Replaced BY MPC8533EVJANGASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8533EVTAQGAMPC8533EVTAQGA Replaced BY MPC8533EVJAQGASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8533EVTARJAMPC8533EVTARJA Replaced BY MPC8533EVJAQGASame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process
MPC8533VTALFAMPC8533VTALFA Replaced BY MPC8533VJALFASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8533VTANGAMPC8533VTANGA Replaced BY MPC8533VJAQGASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8533VTAQGAMPC8533VTAQGA Replaced BY MPC8533VJAQGASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8533VTARJAMPC8533VTARJA Replaced BY MPC8533VJAQGASame Form & Fit, Different Function, Pin-for-Pin EquivalentAssembly Process
MPC8544CVTALFAMPC8544CVTALFA Replaced BY MPC8544CVJALFASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8544CVTANGAMPC8544CVTANGA Replaced BY MPC8544CVJANGASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8544CVTAQGAMPC8544CVTAQGA Replaced BY MPC8544CVJAQGASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8544ECVTALFAMPC8544ECVTALFA Replaced BY MPC8544ECVJALFASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8544ECVTANGAMPC8544ECVTANGA Replaced BY MPC8544ECVJANGASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8544ECVTAQGAMPC8544ECVTAQGA Replaced BY MPC8544ECVJAQGASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8544EVTALFAMPC8544EVTALFA Replaced BY MPC8544EVJALFASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8544EVTANGAMPC8544EVTANGA Replaced BY MPC8544EVJANGASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8544EVTAQGAMPC8544EVTAQGA Replaced BY MPC8544EVJAQGASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8544EVTARJAMPC8544EVTARJA Replaced BY MPC8544EVJARJASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8544VTALFAMPC8544VTALFA Replaced BY MPC8544VJALFASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8544VTANGAMPC8544VTANGA Replaced BY MPC8544VJANGASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8544VTAQGAMPC8544VTAQGA Replaced BY MPC8544VJAQGASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process
MPC8544VTARJAMPC8544VTARJA Replaced BY MPC8544VJARJASame Form, Fit & Function, Pin-for-Pin EquivalentAssembly Process




DESCRIPTION OF CHANGE

Freescale is pleased to announce the MPC8533/8544 products are now available in the Pb-free FCPBGA package (VJ).  The leaded package options, "VT" and "PX"  being replaced with the "VJ" package.   

 

 

VT: Leaded wafer bumps   /  lead free solder spheres

PX: Leaded wafer bumps  /  leaded solder spheres

VJ: Lead free wafer bumps / lead free solder spheres



REASON FOR CHANGE

The MPC8533/8544 product family has been qualified with lead-free wafer bumps and lead-free solder spheres to satisfy the 2016 RoHS directive.

 



ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

No change to Fit, Function, or Reliability.  Change in Form, from leaded wafer bumps to lead-free wafer bumps, and lead free solder spheres was announced in PB16034.




Freescale will consider specific conditions of acceptance of this change submitted within 30 days of receipt of this notice on a case by case basis. To request further data or inquire about the notification, please enter a Service Request.

For sample inquiries - please go to www.freescale.com


RELATED NOTIFICATION(S):
16034 - Availability of RoHS Compliant Package for MPC8572, MPC8548, MPC8535/36, MPC8533/44 & MC8640/41 Families

TO VIEW the GENERIC copy, click on the notification number above.

QUAL DATA AVAILABILITY DATE:     20-Dec-2013

QUALIFICATION STATUS:     COMPLETED

QUALIFICATION PLAN:

    N/A

RELIABILITY DATA SUMMARY:

    N/A

ELECTRICAL CHARACTERISTIC SUMMARY:

    N/A


CHANGED PART IDENTIFICATION:

The characters impacted are the packaging designation "VT" in the current leaded wafer bump part numbers which changes to "VJ" to reflect lead free wafer bumps.  Customer may now order production samples for MPC8533/MPC8544 devices.  Please contact customer support if you have any questions about how to order the lead free versions of the parts your company is currently ordering.

 

Example for Ordering Customer Samples

 

 

Leaded Wafer Bumps

Part Number

Qualified Lead Free Wafer Bumps

Part Number

 

MPC8544EVTAQGA

MPC8544EVJAQGA

 



SAMPLE AVAILABILITY DATE: 29-Jul-2014



ATTACHMENT(S):
External attachment(s) FOR this notification can be viewed AT:
16365_MPC8533_Qual_Report_Rev_2_022614_DH.pdf
16365_MPC8544_Qual_Report_Rev_1_022614_DH.pdf