|TITLE:||MC33926PNB H-Bridge Copper Wire and Die Revision Qualification|
Freescale Semiconductor announces the addition of Copper (Cu) wire as a wirebond material and silicon die revision for the MC33926PNB H-Bridge devices associated with this notification. Previously, these devices were qualified at Freescale-Tianjin Final Manufacturing site (TJNFM) using Gold (Au) wire bonding and a previous silicon die revision. These devices are now qualified at Freescale-Tianjin (TJN) using Cu (Copper) wire bond and new die revision.
Samples are available for KC33926PNB.
The transfer from Gold to Copper wire is required to mitigate against raw material cost increases and for supply assurance.
Update silicon revision for better product performance. Increasing the gate stress voltage allows for improved stressing of the power outputs during ATE testing.
No change to form, fit or function. Reliability is equivalent or improved.
There is no change to orderable part number. The tracecode marking on the device includes assembly site and datecode. Freescale will have traceability by assembly site and datecode.