|TITLE:||End of Life for MSC8122/26 Products|
|LAST BUY DATE:||29-May-2015|
|LAST SHIP DATE:||30-Nov-2016|
Freescale Semiconductor is announcing the discontinuance of the device(s) listed in this notification. All orders for the discontinued product must be received by the last buy date. After the last buy date, no accepted order may be cancelled or changed and no returns of delivered products will be accepted. This Product Discontinuance is the final notice for customer to place an order for the discontinued product. Derivative devices of a discontinued product family will have the same Last Buy Date and Last Ship Date as this Product Discontinuance even if the derivative is first produced after the date of this Product Discontinuance notice. Products requiring failure analysis, additional testing or other service after the last ship may be subject to additional fees and availability of equipment, materials, or other hardware and software.
Our bump supplier has issued an end-of-life for the high lead C4 bump process that is used on the MSC8122/26. We have been unable to find an alternative source for the bump.
Our bump supplier is phasing out their bump process by the end of 2015. Due to this EOL date we need to process final orders through bump, probe, and reflow before the end of 2015. This is the reason for shortened "Last Order Date".