| ISSUE DATE: | 23-Jan-2015 |
| NOTIFICATION: | 16614 |
| TITLE: | Copper Wire Qualification and Mold Compound Conversion S908SG32/EL32/SG8/QD4, HC908QC16/QY4, TSSOP/SOIC (ATP1) |
| EFFECTIVE DATE: | 22-Jul-2015 |
| MPN |
|---|
| S908QC16E0CDSE |
| S908QC16E0CDSER |
| S908QC16E0VDSE |
| S908QC8E0CDSE |
| S908QC8E0CDSER |
| S908QY1H0CDTE |
| S908QY1H0CDTER |
| S908QY1H0VDTE |
| S908QY1H0VDTER |
| S908QY2H0CDTE |
| S908QY2H0CDTER |
| S908QY2H0CDWE |
| S908QY4H0MDTE |
| S908QY4H0MDTER |
| S9S08EL16F1CTJ |
| S9S08EL16F1CTJR |
| S9S08EL16F1MTL |
| S9S08EL16F1MTLR |
| S9S08EL16F1VTJ |
| S9S08EL16F1VTJR |
| S9S08EL32F1CTJ |
| S9S08EL32F1CTJR |
| S9S08EL32F1CTL |
| S9S08EL32F1CTLR |
| S9S08EL32F1MTJ |
| S9S08EL32F1MTJR |
| S9S08EL32F1MTL |
| S9S08EL32F1MTLR |
| S9S08EL32F1VTL |
| S9S08EL32F1VTLR |
| S9S08QD2J1CSC |
| S9S08QD2J1CSCR |
| S9S08QD2J1MSC |
| S9S08QD2J1MSCR |
| S9S08QD2J1VSC |
| S9S08QD2J1VSCR |
| S9S08QD4J1CSC |
| S9S08QD4J1CSCR |
| S9S08QD4J1MSC |
| S9S08QD4J1MSCR |
| S9S08QD4J1VSC |
| S9S08QD4J1VSCR |
| S9S08QD4J2MSC |
| S9S08QD4J2MSCR |
| S9S08SG16E1CTJ |
| S9S08SG16E1CTJR |
| S9S08SG16E1CTL |
| S9S08SG16E1CTLR |
| S9S08SG16E1MTJ |
| S9S08SG16E1MTJR |
| S9S08SG16E1MTL |
| S9S08SG16E1MTLR |
| S9S08SG16E1VTJ |
| S9S08SG16E1VTJR |
| S9S08SG16E1VTL |
| S9S08SG16E1VTLR |
| S9S08SG16E1WTL |
| S9S08SG16E1WTLR |
| S9S08SG32E1CTJ |
| S9S08SG32E1CTJR |
| S9S08SG32E1CTL |
| S9S08SG32E1CTLR |
| S9S08SG32E1MTJ |
| S9S08SG32E1MTJR |
| S9S08SG32E1MTL |
| S9S08SG32E1VTJ |
| S9S08SG32E1VTJR |
| S9S08SG32E1VTL |
| S9S08SG32E1VTLR |
| S9S08SG32E1WTL |
| S9S08SG32E1WTLR |
| S9S08SG4E2CTJ |
| S9S08SG4E2CTJR |
| S9S08SG4E2MTJ |
| S9S08SG4E2MTJR |
| S9S08SG4E2VTJ |
| S9S08SG4E2VTJR |
| S9S08SG8E2CTJ |
| S9S08SG8E2CTJR |
| S9S08SG8E2MTJ |
| S9S08SG8E2MTJR |
| S9S08SG8E2VTJ |
| S9S08SG8E2VTJR |
| S9S08SL16F1CTJ |
| S9S08SL16F1CTJR |
| S9S08SL16F1CTL |
| S9S08SL16F1CTLR |
| S9S08SL16F1MTJ |
| S9S08SL16F1MTJR |
| S9S08SL16F1MTL |
| S9S08SL16F1MTLR |
| S9S08SL16F1VTL |
| S9S08SL16F1VTLR |
| S9S08SL8F1CTJ |
| S9S08SL8F1CTJR |
| S9S08SL8F1MTJ |
| S9S08SL8F1MTJR |
| S9S08SL8F1MTL |
| S9S08SL8F1VTJ |
| S9S08SL8F1VTJR |
| S9S08SL8F1VTL |
Freescale Semiconductor announces the addition of Cu Wire as a wirebond material for the following products:
HC908QC16, S908EL32, S908SG32 (TSSOP 28), S908SG32, S908SG8, S908EL32, HC908QC16 (TSSOP 20), HC908QY4 (TSSOP 16), HC908QY4 (SOIC 16W), S908QD4 (SOICN 8) currently assembled with Au wire at Amkor Technology Philippines (ATP1), Philippines.
The mold compound part number will be changing from G700K and G600 to G700LS. The part number of the material will be updated per the table below.
Package Description
Part#
Wire
Leadframe
Mold Compound
Die Attach
Original
New
Original
New
Original
New
Original
New
TSSOP 20 4.4*6.5*1.P.65
S908SG32
Au 25um
PdCu 25um
Solid-Flag
No change
Sumitomo G700K
Sumitomo G700LS
AB8290
No change
TSSOP 28 4.4*9.7*0.9P.65
S908SG32
Au 25um
PdCu 25um
Solid-Flag
No change
Sumitomo G700K
Sumitomo G700LS
AB8290
No change
TSSOP 20 4.4*6.5*1.P.65
S908SG8
Au 25um
PdCu 25um
Solid-Flag
No change
Sumitomo G700K
Sumitomo G700LS
AB8290
No change
TSSOP 20 4.4*6.5*1.P.65
HC908QC16
Au 25um
PdCu 25um
Solid-Flag
No change
Sumitomo G700K
Sumitomo G700LS
AB8290
No change
TSSOP 28 4.4*9.7*0.9P.65
HC908QC16
Au 25um
PdCu 25um
Solid-Flag
No change
Sumitomo G700K
Sumitomo G700LS
AB8290
No change
TSSOP 16 4.4*5*1.0P0.65
HC908QY4
Au 25um
PdCu 25um
Solid-Flag
No change
Sumitomo G700K
Sumitomo G700LS
AB8290
No change
TSSOP 20 4.4*6.5*1.P.65
S908EL32
Au 25um
PdCu 25um
Solid-Flag
No change
Sumitomo G700K
Sumitomo G700LS
AB8290
No change
TSSOP 28 4.4*9.7*0.9P.65
S908EL32
Au 25um
PdCu 25um
Solid-Flag
No change
Sumitomo G700K
Sumitomo G700LS
AB8290
No change
SOIC 16W
HC908QY4
Au 25um
PdCu 25um
Solid-Flag
No change
Sumitomo G600
Sumitomo G700LS
AB8290
No change
SOICN 8 3.9*4.9*1.75
S908QD4
Au 25um
PdCu 25um
Solid-Flag
No change
Sumitomo G600
Sumitomo G700LS
AB8290
No change
The transfer from Au to Cu wire is required to mitigate against raw material cost increases for supply assurance.
The mold compound change enable a robust Cu wire bond process.
Wire composition and mold compound are the only changes to form. No impact to fit or function. Reliability is equivalent or improved.
See attached qualification results.
See attached qualification results.
No change to datasheet. Electrical Distribution comparison, Au wire versus Cu wire is included in this notification. Result shows no difference in Electrical Distributions.
There is no change to orderable part number. The tracecode marking on the device includes assembly site and datecode. Freescale will have traceability by assembly site and datecode.
The table below provides sample part numbers, the other samples are available upon request.
| LPN | Au Part Number | Cu Sample Part Number | Package Description |
| S908SG32 | S9S08SG32E1MTJ | K9S08SG32E1MTJ | TSSOP 20 4.4*6.5*1.P.65 |
| S9S08SG32E1MTL | K9S08SG32E1MTL | TSSOP 28 4.4*9.7*0.9P.65 | |
| S9S08SG32E1WTL | K9S08SG32E1WTL | TSSOP 28 4.4*9.7*0.9P.65 | |
| S908SG8 | S9S08SG4E2MTJ | K9S08SG4E2MTJ | TSSOP 20 4.4*6.5*1.P.65 |
| S9S08SG4E2VTJ | K9S08SG4E2VTJ | TSSOP 20 4.4*6.5*1.P.65 | |
| S9S08SG8E2MTJ | K9S08SG8E2MTJ | TSSOP 20 4.4*6.5*1.P.65 | |
| S9S08SG8E2VTJ | K9S08SG8E2VTJ | TSSOP 20 4.4*6.5*1.P.65 | |
| HC908QC16 | S908QC16E0VDSE | K908QC16E0VDSE | TSSOP 20 4.4*6.5*1.P.65 |
| HC908QY4 | S908QY4H0MDTE | K908QY4H0MDTE/R | TSSOP 16 4.4*5*1.0P0.65 |
| S908QY2H0CDWE | K908QY2H0CDWE | SOIC 16W | |
| S908QD4 | S9S08QD4J2MSC | K9S08QD4J2MSC | SOICN 8 3.9*4.9*1.75 |
| S9S08QD4J1MSC | K9S08QD4J1MSC | SOICN 8 3.9*4.9*1.75 | |
| S908EL32 | S9S08EL32F1MTJ | K9S08EL32F1MTJ | TSSOP 20 4.4*6.5*1.P.65 |
| S9S08SL16F1MTJ | K9S08SL16F1MTJ | TSSOP 20 4.4*6.5*1.P.65 | |
| S9S08EL32F1MTL | K9S08EL32F1MTL | TSSOP 28 4.4*9.7*0.9P.65 | |
| S9S08SL16F1MTL | K9S08SL16F1MTL | TSSOP 28 4.4*9.7*0.9P.65 |