|TITLE:||33907x and 33908x Power System Chip Device Migration with Copper Wire and Design Change|
|LAST BUY DATE:||30-Dec-2015|
|LAST SHIP DATE:||30-Dec-2016|
|MPN||REPLACEMENT MPN||REPLACEMENT TYPE||REPLACEMENT REASON|
|MC33907AE||MC33907AE Replaced BY MC33907NAE||Same Form, Fit & Function, Pin-for-Pin Equivalent||Design Change|
|MC33907AER2||MC33907AER2 Replaced BY MC33907NAER2||Same Form, Fit & Function, Pin-for-Pin Equivalent||Design Change|
|MC33908AE||MC33908AE Replaced BY MC33908NAE||Same Form, Fit & Function, Pin-for-Pin Equivalent||Design Change|
|MC33908AER2||MC33908AER2 Replaced BY MC33908NAER2||Same Form, Fit & Function, Pin-for-Pin Equivalent||Design Change|
Freescale Semiconductor announces the device migration of 33907x and 33908x Power System Basis Chip with High Speed CAN family associated with this notification. The replacement parts introduce Copper (Cu) wire as a wirebond material, along with Hitachi CEL 9240HF16FL mold compound and incorporates new functionalities like LIN transceiver and enhanced I/O monitoring for safety compliance.
These products are now qualified for assembly at Freescale Tianjin Final Manufacturing (TJNFM) site, Tianjin China. These products were previously assembled with Gold (Au) wire and Hitachi CEL9220HF10MK1 mold compound at Freescale Tianjin Final Manufacturing (TJNFM) site, Tianjin China.
These new parts are backward compatible to the original parts and do not impact the form, fit, or reliability of the device. Function is improved and device is fully compatible. Customers should begin planning for conversion based on the last order date and last ship date listed above. The replacement devices listed in this notification are the recommended replacement parts in all applications.
The transfer from Gold to Copper wire and new die design are required to mitigate against raw material cost increases and performance enhancements.
There is no impact on device form, fit or reliability. Function is improved with the addition of LIN and I/O monitoring. The device is software and hardware compatible.
RELIABILITY DATA SUMMARY:
ELECTRICAL CHARACTERISTIC SUMMARY:
SAMPLE AVAILABILITY DATE: 01-Dec-2014