********************************************************************** PRODUCT AND PROCESS CHANGE NOTIFICATION ********************************************************************** ISSUE DATE: 05-Feb-1997 NOTIFICATION #:2488 EFFECTIVE DATE: 16-May-1997 ISSUING DIVISION:APG-ANALOG TITLE: QUALIFICATION OF MCEL(TIANJIN) ASSEMBLY SITE AND TEST SITE FOR 28 SOIC WIDE BODY ANALOG PRODUCTS AFFECTED CHANGE CATEGORIES Motorola Assembly Site Motorola Test Site AFFECTED PRODUCT DIVISIONS ANALOG IC DIV -------------------------------------- ADDITIONAL RELIABILITY DATA: Available CONTACT: Contact your local Motorola Sales Office. SAMPLES: Contact Local S CONTACT: Contact your local Motorola Sales Office. For any questions concerning this notification: CONTACT: PHONE: -------------------------------------- MOTOROLA WILL CONSIDER THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS OF ACCEPTANCE ARE PROVIDED IN WRITING WITHIN 30 DAYS OF RECEIPT OF THIS NOTICE. TO DO SO, CONTACT YOUR LOCAL MOTOROLA SALES OFFICE. 1 Motorola Page:2 Semiconductor Products Sector ********************************************************************** PRODUCT AND PROCESS CHANGE NOTIFICATION ********************************************************************** ISSUE DATE: 05-Feb-1997 NOTIFICATION #:2488 EFFECTIVE DATE: 16-May-1997 ISSUING DIVISION:APG-ANALOG DESCRIPTION AND PURPOSE ----------------------- MOTOROLA SEMICONDUCTORS HK IS PLEASED TO ANNOUNCE THE INCLUSION OF ANALOG PRODUCTS INTO THE EXISTING AND QUALIFIED ASSEMBLY LINE AND TEST LINES IN MCEL (TIANJIN) FOR 28 SOIC WIDE BODY PACKAGE MCU PRODUCTS. AFTERWARDS THE OVERALL ASSEMBLY AND TEST CAPACITY OF MOTOROLA SEMICONDUCTORS CAN BE ENHANCED TO PROVIDE BETTER SERVICE TO THE CUSTOMERS. THE QUALIFICATION FOR 28 SOIC (WIDE BODY) ASSEMBLY LINE FOR MCU PRODUCTS IN MCEL(TIANJIN) HAS BEEN INTRODUCED IN PREVIOUS PROCESS CHANGE NOTIFICATION. (REF: HK1-PCN-95-R00574). IN THIS 28 SOIC ASSEMBLY LINE, THE FOLLOWING DIRECT MATERIALS ARE USED: MOLD COMPOUND : NITTO MP8000 GOLD WIRE : 1.0 MIL FA TYPE DIE ATTACH EPOXY : SUMITOMO CRM-1033B LEADFRAME : 63MM MULTISTRAND ALL RELIABILITY REQUIREMENTS AND ASSEMBLY PROCESS CAPABILITIES DEFINED PER MOTOROLA STANDARD HAVE BEEN SUCCESSULLY COMPLETED. ALL QUANTITATIVE PROCESS PARAMETERS CAN EXCEED PPK 1.66 AS SHOWN IN THE FOLLOWING SECTION. FOR THE CLASSIFICATION OF MOISTURE SENSITIVITY, BASED ON THE PRECONDITIONING TESTS PERFORMED USING VAPOUR PHASE REFLOW (VPR) AND INFRA-RED REFLOW (IR) IN THIS QUALIFICATION, THIS PACKAGE ASSEMBLED IN MCEL CAN DEMONSTRATE MOISTURE SENSITIVITY CLASS I. (REFER TO RELIABILITY DATA SUMMARY) DEVICE LIST AFFECTED: MC44301DW MC10319DW MC10319DWR2 MC34018DW MC34018DWR2 MC34018DWR3 MC34118DW MC34118DWR2 MC34118DWR3 1 Motorola Page:3 Semiconductor Products Sector ********************************************************************** PRODUCT AND PROCESS CHANGE NOTIFICATION ********************************************************************** ISSUE DATE: 05-Feb-1997 NOTIFICATION #:2488 EFFECTIVE DATE: 16-May-1997 ISSUING DIVISION:APG-ANALOG MC3363DW MC3363DWR2 MC3367DW MC3367DWR3 MC13022ADW MC13022ADWR3 MC13022DW MC13022DWR3 QUALIFICATION PLAN ------------------ REFER TO RELIABILITY DATA SUMMARY RELIABILITY DATA SUMMARY ------------------------ EXTRACTED FROM THE PREVIOUS PROCESS CHANGE NOTIFICATION. (REF: HK1-PCN-95-R00756): QUALIFICATION VEHICLE : MC68HC705P6 MASK SET : E20Y DIE SIZE : 173.5 MIL X 298 MIL RELIABILITY STRESS TEST PERFORMANCE SUMMARY TEST QUAL LOT# TEST RESULTS ================== ========= =================================== HTOL <168HRS> 140C Q1 0/77 Q2 0/77 Q3 0/77 168HRS <504HRS> DATA RETENTION Q1 0/77 0/77 175C Q2 0/77 0/77 Q3 0/77 0/77 AFTER IR 100CYC <500CYC> ELECT. X40 IR PRECONIDITON + Q1 0/77 0/77 0/77 0/77 TEMP CYCLE Q2 0/77 0/77 0/77 0/77 1 Motorola Page:4 Semiconductor Products Sector ********************************************************************** PRODUCT AND PROCESS CHANGE NOTIFICATION ********************************************************************** ISSUE DATE: 05-Feb-1997 NOTIFICATION #:2488 EFFECTIVE DATE: 16-May-1997 ISSUING DIVISION:APG-ANALOG -65C / +150C Q3 0/77 0/77 0/77 0/77 AFTER IR 96HRS <144HRS> 240HRS ELECT. X40 IR PRECONDITION + Q1 0/77 0/77 0/77 0/77 0/77 AUTOCLAVE Q2 0/77 0/77 0/77 0/77 0/77 121C, 15PSI, 100%RH Q3 0/77 0/77 0/77 0/77 0/77 AFTER IR 48 HRS <96HRS> ELECT. X40 IR PRECONDITION + Q1 0/77 0/77 0/77 0/77 HAST Q2 0/77 0/77 0/77 0/77 130C, 33.5PSIA, 85%RH Q3 0/77 0/77 0/77 0/77 AFTER VPR 96HRS <144HRS> 240HRS ELECT. X40 VPR PRECONDITION + Q1 0/77 0/20 0/77 0/77 0/77 AUTOCLAVE Q2 0/77 0/20 0/77 0/77 0/77 121C, 15PSI, 100%RH Q3 0/77 1/20* 0/77 0/77 0/77 Q4 0/77 0/20 - - - Q5 0/77 0/20 - - - Q6 0/77 0/20 - - - REMARKS: 1) READPOINTS IN < > INDICATE QUAL POINTS 2) X40 MEANS X40 VISUAL INSPECTION 3) ELECT. MEANS ELECTRICAL VERIFICATION 4) CONDITIONS OF CLASS I PRECONDITIONING TEST IS DEFINED AS: 168HRS SOAKING AT 85C/85%RH, 10 CYCLES OF TEMP CYCLING AND THEN FOLLOWED BY 3 CYCLES OF VPR OR IR 5) * 1 UNIT WAS FOUND FINE CRACK AT BOTTOM EDGE AFTER PRECONDITION TEST. TOTAL 40 UNITS IN THE SAME LOT WERE INSPECTED BUT NO OTHER UNITS SHOWED ANY DELAMINATION AND VISUAL CRACK PROBLEM. IN ORDER TO FURTHER VERIFY THE PACKAGE INTEGRITY, THREE EXTRA LOTS (Q4-Q6) USING MP8000 MOLD COMPOUND WERE PERFORMED CLASS I VPR PRECONDITION TEST AGAIN. RESULTS PASSED THE DELAMINATION AND VISUAL INSPECTION CRITERIA. ASSEMBLY LINE TEST PERFORMANCE SUMMARY 1 Motorola Page:5 Semiconductor Products Sector ********************************************************************** PRODUCT AND PROCESS CHANGE NOTIFICATION ********************************************************************** ISSUE DATE: 05-Feb-1997 NOTIFICATION #:2488 EFFECTIVE DATE: 16-May-1997 ISSUING DIVISION:APG-ANALOG TEST QUAL LOT# TEST RESULTS ================== ========= ========================= SOLDERABILITY Q1 0/22 AFTER 24HRS BURN-IN Q2 0/22 Q3 0/22 EXTERNAL VISUAL Q1 0/22 INSPECTION Q2 0/22 Q3 0/22 INTERNAL VISUAL Q1 0/22 INSPECTION Q2 0/22 Q3 0/22 PHYSICAL DIMENSIONS Q1 0/22 PPK > 1.66 Q2 0/22 PPK > 1.66 Q3 0/22 PPK > 1.66 LEAD FATIGUE Q1 0/22 Q2 0/22 Q3 0/22 DIE SHEAR Q1 0/22 Q2 0/22 Q3 0/22 BALL SHEAR Q1 0/22 PPK > 1.66 10 BALLS PER UNIT Q2 0/22 PPK > 1.66 Q3 0/22 PPK > 1.66 WIRE PULL Q1 0/22 PPK > 1.66 10 WIRES PER UNIT Q2 0/22 PPK > 1.66 Q3 0/22 PPK > 1.66 PLATING ANALYSIS Q1 0/22 PPK > 1.66 Q2 0/22 PPK > 1.66 Q3 0/22 PPK > 1.66 MARKING LEGIBILITY Q1 0/22 Q2 0/22 1 Motorola Page:6 Semiconductor Products Sector ********************************************************************** PRODUCT AND PROCESS CHANGE NOTIFICATION ********************************************************************** ISSUE DATE: 05-Feb-1997 NOTIFICATION #:2488 EFFECTIVE DATE: 16-May-1997 ISSUING DIVISION:APG-ANALOG Q3 0/22 ELECTRICAL CHARACTERISTIC SUMMARY --------------------------------- NO DIFFERENCE IN ELECTRICAL CHARACTERISTICS IS ANTICIPATED. CHANGED PART IDENTIFICATION --------------------------- IDENTIFIED BY ASSEMBLY SITE CODE (CT) ======================================================================