Product Change Notice

ADDITIONAL ASSEMBLY SITE FOR XCF5206E

Motorola considers this change approved unless specific conditions of acceptance are provided in writing. To do so, contact your local Motorola Sales Office.

Issue Date Effective Date Notification #
18-Nov-1999 18-Feb-2000
5291

Affected Change Categories
    
Affected Product Divisions
Motorola Assembly Site   Networking Systems
Additional Reliability Data
    
Samples
None
    
Contact your local
Motorola sales office

For any questions concerning this notification:

Contact: Khoi Mai
Phone: (512) 895-4652

Description and Purpose

In order to utilize one of our preferred Centers of Excellence for 160 QFP assembly and to gradually consolidate assembly and final test into the same location, Motorola is pleased to introduce its Kuala Lumpur, Malaysia (KLM) facility as an additional assembly site for the XCF5206e devices.

Although this PCN stipulates a 100 day moratorium before shipments may begin, customers may authorize earlier deliveries by providing written approvals to their Motorola sales contacts.

Customer samples will be available in SPAK part numbers. Please contact your local Motorola sales office and SPECIFICALLY ask for KLM-assembled samples.

Qualification Plan

The actual qualification for the XCF5206e devices will be performed using the guideline shown below. Once the qualification is complete, a report will be made available for the customer. The KLM 5206e assembly XC Qualification data would be available in January timeframe.

Package Components:
Mold compound: Hitachi CEL9002N
Die Attach: Sumitomo CRM1078
Wire: 1 mil Gold Sumitomo NL3

Reliability Stresses:
  Conditions Readpoint
1) THB (3 lots) 85C, 85%RH 68 hours
2) Tempcyles (3 lots) 65/150C 100 cycles
3) Autoclave 121C/100%RH 144 hours
4) Moisture Characterization JDEC Level 3  

Reliability Data Summary

Data from the Sphinx(SXF23003CI) device is being used in support of this move. This device is assembled in KLM and uses the same 160 QFP package with the same material sets.

Test sample/Mask Set: SXF23003CI (W50J98G)
Die size: 200 x 200 mils
Mold compound: Hitachi CEL9002N
Die Attach: Sumitomo CRM1078
Wire: 1 mil Gold Sumitomo NL3

The following reliability stresses were performed with no failures:

1) Temperature Cycle (3 lots)      -65/150C
 
100 cycles
500 cycles
Lot 1
0/77
0/77
Lot 2
0/77
0/77
Lot 3
0/77
0/77

2) Autoclave (3 lots)
 
48 hrs
96 hrs
Lot 1
0/77
0/77
Lot 2
0/75
0/75
Lot 3
0/77
0/77

3) Moisture Level Char (3 lots) Level 3
 
CSAM
TEST
Lot 1
0/5
0/5
Lot 2
0/5
0/5
Lot 3
0/5
0/5

Electrical Characteristic Summary

N/A

Changed Part Identification

A change will be noted in the device trace code.

Parts assembled at Shinko have an "AM" trace code identifier. Parts assembled at KLM have a "Q" trace code identifier.

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Affected Device List (without specials)

SPAK5206ECFT40 SPAK5206EFT40 SPAK5206EFT54
XCF5206ECFT40 XCF5206EFT40 XCF5206EFT54

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