MOTOROLA Issued: 27-MAR-2000 Semiconductor Products Sector Issuing Division: SESG (A) TO: NAME: GPCN-SPS DISTRIBUTION-LIST EMAIL ADDRESS: GPCNDIS1@email.sps.mot.com Subject: MOTOROLA PRODUCT BULLETIN 5522 TITLE: NEW 68EC060 & 68LC060 TBGA SUBSTRATE EFFECTIVE DATE: 28-MAR-00 AFFECTED CHANGE CATEGORIES Package Change AFFECTED PRODUCT DIVISIONS NETWORKING SYSTEMS DIV (NN) WIRELESS COMMUNICATIONS DIV (VC) WIRELESS INFRASTRUCTURE SYS DIV ( SESG (A) ADDITIONAL RELIABILITY DATA: None Ref: RXA150 SAMPLES: Contact Local Sales Contact your local Motorola Sales Office. For any questions concerning this notification: REFERENCE:MARTY ALKIS PHONE: 512-895-8921 DISCLAIMER: MOTOROLA CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL MOTOROLA SALES OFFICE. ********************************************************************** PRODUCT BULLETIN ********************************************************************** ISSUE DATE: 27-Mar-2000 NOTIFICATION #:5522 EFFECTIVE DATE: 28-Mar-2000 ISSUING DIVISION:SESG (A) DESCRIPTION AND PURPOSE ----------------------- Motorola is pleased to announce that our 68EC060ZU and 68LC060ZU TBGA devices are converting to a new substrate. The new substrate will improve the package quality and reliability of the TBGA product line. The design of the new substrate prevents solder from migrating from the solder balls to under the solder mask during re-flow processes. In addition, a new die attach material has been applied for reliability improvement. There are no changes in form, fit, or function as a result of these improvements. There are no changes in wafer processing or test methodology for this product line. QUALIFICATION PLAN ------------------ Please see Reliability Data Summary RELIABILITY DATA SUMMARY ------------------------ 68EC060 & 68LC060 304 TBGA XC QUAL RESULTS DEVICE: XPC060 ASSEMBLY SITE: ASAT, Hong Kong MASK SET: G59Y PACKAGE: 304 TBGA DIE SIZE: 438.7 X 366.9 mils # OF LOTS: 3 PC = Preconditioning to MSL 4 MOISTURE CHARACTERIZATION REL JOB Level 4 858107-R1 0/10 858111-R1 0/10 858109B 0/10 TOTAL 0/30 TEMPERATURE CYCLING (-65!C/+150!C) REL JOB PC 100 Cyc 858107-R1 0/77 0/77 858111-R1 0/77 0/76 858109B 0/77 0/77 TOTALS 0/231 0/230 THB (+85!C/85%RH/5.0V) REL JOB PC 168 Hr 504 Hr 858111-R1 0/77 0/77 0/77 858109B 0/77 0/77 0/77 858107-R1 0/77 0/77 In Process TOTALS 0/231 0/231 0/154 AUTOCLAVE (+121!C/15PSIG) REL JOB PC 48 Hr 144 Hr 858111-R1 0/130 0/130 In Process 858109B 0/94 0/94 In Process TOTALS 0/224 0/224 BALL SHEAR/SCAN DATA Segment Segment REL JOB Error Fallout d20548993 1/1670 0.06% d20943992 0/1885 0.00% d212499913 0/1505 0.00% ELECTRICAL CHARACTERISTIC SUMMARY --------------------------------- na CHANGED PART IDENTIFICATION --------------------------- There are no Motorola part number changes. AFFECTED DEVICE LIST (WITHOUT SPECIALS) --------------------------------------- PC68LC060ZU50E , SC414418ZU50E , SC414419ZU66E , SC414420ZU75E SPAKEC060ZU50E , SPAKEC060ZU66E , SPAKEC060ZU75E , SPAKLC060ZU50E SPAKLC060ZU66E , SPAKLC060ZU75E , XC68EC060ZU50E , XC68EC060ZU66E XC68EC060ZU75E , XC68EC060ZUE , XC68LC060ZU50E , XC68LC060ZU66E XC68LC060ZU75E , XC68LC060ZUE ======================================================================= =======================================================================