MOTOROLA

Semiconductor Products Sector
Issuing Division: SPS

PRODUCT BULLETIN
Generic Copy

09-JUL-2002

NAME:                  GPCN-SPS DISTRIBUTION-LIST
EMAIL ADDRESS:         GPCNDIS1@email.sps.mot.com
Subject:               MOTOROLA PRODUCT BULLETIN 7701
TITLE:
QFP 10X10 ASSY MOVE FROM SHC TO BAT3

EFFECTIVE DATE:        10-Jul-2002


AFFECTED CHANGE CATEGORIES
  • MOTOROLA ASSEMBLY SITE


  • AFFECTED PRODUCT DIVISIONS
  • WIRELESS COMMUNICATIONS DIV (VC)
  • ADVANCED VEHICLE SYS DIV (JB)
  • WIRELESS INFRASTRCT SYS DIV (NH
  • BODY ELECT, OCCUPANT SAFETY (JD
  • RF/IF DIV (VW)
  • CPD- COMPUTING PLATFORM DIVISION (NR)
  • SMARTMOS PROD TECH CTR (JS
  • DRIVER INFORMATION DIVISION (JI)
  • NETWORK & COMM SYS DIV (NB)
  • BRD. AND ENT. DIVISION BESD (VE)
  • MULTIMEDIA SYSTEMS (ND)

  • ADDITIONAL RELIABILITY DATA: None
    REFERENCE: Contact Sales Office ()

    SAMPLES: Contact Local Sales Office
    REFERENCE: Contact Sales Office ()
    Contact your local Motorola Sales Office.

    For any questions concerning this notification:
    REFERENCE: Contact Sales Office (ALLISON ADCOCK)

    DISCLAIMER
          DISCLAIMER:
         
          MOTOROLA CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS
          OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL
          MOTOROLA SALES OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          This notification is an update to the Final Manufacturing Assembly
          Consolidations Product Change Notifications that announced the
          qualification plan for all products that will be moved out of their
          current site, Silicon Harbor (Hong Kong- SHC) or Sendai (Japan-
          SDI), into a Motorola qualified assembly site in Kuala Lumpur,
          Malaysia (KLM) or Tianjin, China (BAT3) or subcontractor. All
          assembly qualification exercises met all Motorola internal
          requirements and specifications and were performed by package
          family.
         
          This Product Bulletin provides the reliability results and announces
          the completion of the assembly package qualification for the 10x10
          QFP (44,52 ld) Transfer from Silicon Harbor (Hong Kong- SHC)to
          Tianjin, China (BAT3).
         
          Motorola continues to make substantial investments in both new
          technologies and improved manufacturing capabilities to provide you
         
          the highest quality and most reliable semiconductors in the
          industry. We believe that these actions will improve our ability to
          serve you in the future. We will strive to manage this transition to
          our mutual benefits.
         
          Please note: The Tianjin, China BAT3 Facility will be capable of
          starting the production ramp up of the 10x10 QFP parts from Silicon
          Harbor (Hong Kong- SHC)by the end of June, beginning of July 2002,
          contigent on customer approval.
         
          Please be aware that during the production ramp up of the 10x10 QFP
          parts, you could receive a mix of parts from both Hong Kong SHC and
          Tianjin, China BAT3 until the ramp up is fully completed in the
          newly qualified site, BAT3.
         
          Related Product Notifications are as follow:
         
          PN # 7278 FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN # 7283 FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN # 7285 FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN # 7345 FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN # 7346 FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN # 7348 FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN # 7419 FINAL MANUFACTURING ASSY CONSOLIDATIONS

    QUALIFICATION PLAN

          The qualification exercise was performed by package family. The
          qualification met all Motorola internal requirements and
          specifications.

    RELIABILITY DATA SUMMARY

          Qualification of 10x10 QFP (44,52ld)
         
         
          Technology & Package: 10X10 QFP (44,52ld)
          Qual Vehicle A: Q1 (CTCTZD0213D Lot TJ3130048D)
          Q2 (CTCTZD0213E Lot TJ3130048E)
          Q3 (CTCTZD0213F Lot TJ3130048F)
          Device: MC68HC705C9ACFB (705C9A)
          Fab/Assy/Test: TSC6/BAT3/BAT3
          Maskset: K03B
          Die Size: 233X253
          Hot: 95C Room: 25C Cold: -40C
         
          Qual Vehicle B: Q4 (CTCTZG0212G Lot BD2844149G)
          Device: MC33215FB
          Fab/Assy/Test: MOS20/BAT3/BAT3
          Maskset: N/A
          Die Size: 121 x 160
          Room: 25C
         
          Qual Vehicle C: Q5 (CTCTZA0214A Lot CF8006048A)
          Device: SC513722FB (SGG8JB8)
          Fab/Assy/Test: TSMC3/BAT3/BAT3
          Maskset: K54X
          Die Size: 81x81
          Hot: 80C Room: 25C Cold:0C
         
          Qual Vehicle D: Q6 (CTCTZA0213A Lot NA9159749A)
          Device: XC68HC705BE12CFB
          Fab/Assy/Test: MOS9/BAT3/BAT3
          Maskset: D41V
          Die Size: 121 x 160
          Hot: 95C Room: 25C Cold: -40C
         
         
          HTOL (High Temperature Op Life 408 hrs at Room Temp):
          Results: PASS
          Q1: 0/77
          Q2: 0/77
          Q3: 0/77
          Q6: 0/77
         
          PC (Preconditioning):
          Results: PASS
          Conditions: MSL1 (Moisture Sensitivity Level), 220C
          Q1: 0/231
          Q2: 0/231
          Q3: 0/231
          Q4: 0/231
          Q5: 0/231
          Conditions: MSL2, 220C + 100 T/C (-40/+150)
          Q6: 0/318
         
         
          HAST (Highly Accelerated Stress Test):
          Results: PASS
          Q1: 0/77
          Q2: 0/77
          Q3: 0/77
          Q6: 0/77
         
          AC (Autoclave): 96 hrs
          Results: PASS
          Q1: 0/77
          Q2: 0/77
          Q3: 0/77
          Q4: 0/77
          Q5: 0/77
          Q6: 0/77
         
         
          TC (Temp Cycle):
          Results: PASS
          Conditions: -65C to +150C for 100, 500 cycles
          Q1: 0/77
          Q2: 0/77
          Q3: 0/77
          Q4: 0/77
          Q5: 0/77
          Conditions: -40C/+150C, 400cyc
          Q6: 0/77
         
          EV (External Visual Inspection):
          Results: PASS (ALL UNITS, ALL LOTS)
         
          PD (Physical Dimensions)
          Qual Point Requirements: Cpk greater than 1.33
          Results: PASS
          Q1: Cpk = 1.9
         
          BPS (Bond Pull Strength):
          Qual Point Requirements: Cpk greater than 1.33
          Results: PASS
          Q1: Cpk = 3.81
          Q4: Cpk = 5.58
          Q5: Cpk = 2.03
         
          BS (Bond Shear Test):
          Qual Point Requirements: Cpk greater than 1.33
          Results: PASS
          Q1: Cpk = 1.81
          Q4: Cpk = 2.74
          Q5: Cpk = 2.23
         
          SD (Solderability):
          Results: PASS
          Q1: 0/15
          Q2: 0/15
          Q3: 0/15
         
          ELFR (Early Life Failure Rate, 150C for 24hrs):
          Results: PASS
          Q1: 0/800
          Q2: 0/800
          Q3: 0/800
         
          GL (Gate Leakage 155C, 4.0 min, +400/-400 V)
          Results: PASS
          Q1: 0/6
         
          ED (Electrical Distribution):
          Results: PASS - COMPLETE

    ELECTRICAL CHARACTERISTIC SUMMARY

          Passed, meets all electrical parametric requirements.

    CHANGED PART IDENTIFICATION

          The traceability codes for all parts included on this notification
          will reflect the BAT3 assembly site with "CT" as opposed to "H"
          which represents SHC.


    RELATED NOTIFICATIONS:
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    AFFECTED DEVICE LIST
    PART
    KMC908GP16CFB
    LSC427545FB
    MC100EP221TB
    MC100EP221TBR2
    MC13111AFB
    MC145572PB
    MC145572PBR2
    MC14LC5003AFU
    MC14LC5003AFUR2
    MC33215FB
    MC44722AVFU
    MC68160AFB
    MC68160AFBR2
    MC68160BFBR2
    MC68HC08GP16FB
    MC68HC08GP32FB
    MC68HC08JB8FB
    MC68HC08SR12FA
    MC68HC11D0CFB2
    MC68HC11D0CFB3
    MC68HC705C8ACFB
    MC68HC705C9ACFB
    MC68HC705E6CFB
    MC68HC705E6VFB
    MC68HC705F4FB
    MC68HC705SR3CFB
    MC68HC705SR3FB
    MC68HC711D3CFB2
    MC68HC711D3CFB3
    MC68HC908BD48IFB
    MC68HC908GP32CFB
    MC68HC908GR4CFA
    MC68HC908GR8CFA
    MC68HC908GT16CFB
    MC68HC908GT8CFB
    MC68HC908JB16FA
    MC68HC908JB8FB
    MC68HC908JL3CFA
    MC68HC908LJ12CFB
    MC68HC908LJ12CPB
    MC68HC908MR8CFA
    MC68HC908RF2CFA
    MC68HC908SR12CFA
    MC68HRC908JL3CFA
    MC68HSC705C8ACFB
    MC68L11D0CFB2
    MC68L11D0CFB2R2
    MC68L11D0FB2
    MC68L11E0PB2
    MC68L11E1PB2
    MC68SEC000PB10
    MC68SEC000PB16
    MC908GP32CFBR2
    MCVVQ111FB
    PC100EP223EFA
    PC507906FB
    PC68HC908AP64CFA
    PC68HC908GR8MFA
    PC68HC908GT16CFB
    PC68HC908JB16FA
    SC433748FB
    SRFIC1521
    XC510164CFAR2
    XC68HC708KH12PB