MOTOROLA

Semiconductor Products Sector
Issuing Division: SPS

PRODUCT BULLETIN
Generic Copy

01-JUL-2002

NAME:                  GPCN-SPS DISTRIBUTION-LIST
EMAIL ADDRESS:         GPCNDIS1@email.sps.mot.com
Subject:               MOTOROLA PRODUCT BULLETIN 7703
TITLE:
LQFP 7X7 ASSY MOVE FROM SHC TO BAT3

EFFECTIVE DATE:        02-Jul-2002


AFFECTED CHANGE CATEGORIES
  • MOTOROLA ASSEMBLY SITE


  • AFFECTED PRODUCT DIVISIONS
  • WIRELESS COMMUNICATIONS DIV (VC)
  • ADVANCED VEHICLE SYS DIV (JB)
  • WIRELESS INFRASTRCT SYS DIV (NH
  • BODY ELECT, OCCUPANT SAFETY (JD
  • RF/IF DIV (VW)
  • CPD- COMPUTING PLATFORM DIVISION (NR)
  • SMARTMOS PROD TECH CTR (JS
  • DRIVER INFORMATION DIVISION (JI)
  • NETWORK & COMM SYS DIV (NB)
  • BRD. AND ENT. DIVISION BESD (VE)

  • ADDITIONAL RELIABILITY DATA: None
    REFERENCE: Contact Sales Office ()

    SAMPLES: Contact Local Sales Office
    REFERENCE: Contact Sales Office ()
    Contact your local Motorola Sales Office.

    For any questions concerning this notification:
    REFERENCE: Contact Sales Office (ALLISON ADCOCK)

    DISCLAIMER
          DISCLAIMER:
         
          MOTOROLA CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS
          OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL
          MOTOROLA SALES OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          This notification is an update to the Final Manufacturing Assembly
          Consolidations Product Change Notifications that announced the
          qualification plan for all products that will be moved out of their
          current site, Silicon Harbor (Hong Kong- SHC) or Sendai (Japan-
          SDI), into a Motorola qualified assembly site in Kuala Lumpur,
          Malaysia (KLM) or Tianjin, China (BAT3) or subcontractor. All
          assembly qualification exercises met all Motorola internal
          requirements and specifications and were performed by package
          family.
         
          This Product Bulletin provides the reliability results and announces
          the completion of the assembly package qualification for the LQFP
          7x7 32LD,48LD Transfer from Silicon Harbor (Hong Kong- SHC)to
          Tianjin, China (BAT3) .
         
          Motorola continues to make substantial investments in both new
          technologies and improved manufacturing capabilities to provide you
         
          the highest quality and most reliable semiconductors in the
          industry. We believe that these actions will improve our ability to
          serve you in the future. We will strive to manage this transition to
          our mutual benefits.
         
          Please note: The Tianjin, China BAT3 Facility will be capable for
          full production of the LQFP 7x7 32LD,48LD parts from Silicon Harbor
          (Hong Kong- SHC)by the end of November 2002.
         
          Please be aware that during the production ramp up of the 7x7 LQFP
          parts, you could receive a mix of parts from both Hong Kong SHC and
          Tianjin, China BAT3 until the ramp up is fully completed in the
          newly qualified site, BAT3.
         
          Related Product Notifications are as follow below:
         
          PN # 7283 FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN # 7285 FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN # 7348 FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN # 7416 FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN # 7419 FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN # 7420 FINAL MANUFACTURING ASSY CONSOLIDATIONS

    QUALIFICATION PLAN

          The qualification exercise was performed by package family. The
          qualification met all Motorola internal requirements and
          specifications.

    RELIABILITY DATA SUMMARY

          Qualification of 7x7 LQFP (48,32ld)
         
         
          Technology & Package: 7X7 LQFP (48, 32ld)
          Qual Vehicle A: Q1 (CTCTZA0214 Lot TJ3061849A)
          Device: MC68HC908SR12CFA
          Fab/Assy/Test: TSC6/BAT3/BAT3
          Maskset: L06H
          Die Size: 116x179
          Hot: 125C Room: 25C Cold: -40C
         
          Qual Vehicle B: Q2 (CTCTZB0214A Lot BS1382147A)
          Q3 (CTCTZB0214B Lot BS1382147B)
          Device: MC68HC908SR12CFA
          Fab/Assy/Test: TSMC2/BAT3/BAT3
          Maskset: K39K
          Die Size: 116x179
          Hot: 125C Room: 25C Cold: -40C
         
          Qual Vehicle C: Q4 (CTCTHZ0214C Lot TC25571H7C)
          Device: XC510164CFAR2
          Fab/Assy/Test: TSC8/MOS16/BAT3/BAT3
          Maskset: K20W
          Die Size: 129x171
          Hot: 95C Room: 25C Cold: -40C
         
          Qual Vehicle D: Q5 (CTCTHZD0214D Lot TJ31499H7D)
          Device: SC428492FA (SGF05L25)
          Fab/Assy/Test: TSC6/BAT3/BAT3
          Maskset: E84R
          Die Size: 167x183
          Hot: 80C Room: 25C Cold: 0C
         
         
          HTOL (High Temperature Op Life 408 hrs at Room Temp):
          Results: PASS
          Q1: 0/77
          Q2: 0/77
          Q3: 0/77
         
          PC (Preconditioning):
          Results: PASS
          Conditions: MSL1 (Moisture Sensitivity Level), 220C
          Q1: 0/231
          Q2: 0/231
          Q3: 0/231
          Conditions: MSL1,(Moisture Sensitivity Level), 240C
          Q4: 0/231
          Conditions: MSL3,(Moisture Sensitivity Level), 240C
          Q5: 0/231
         
         
          HAST (Highly Accelerated Stress Test):
          Results: PASS
          Q1: 0/77
          Q2: 0/77
          Q3: 0/77
         
          AC (Autoclave): 96 hrs
          Results: PASS
          Q1: 0/77
          Q2: 0/77
          Q3: 0/77
          Q4: 0/77
          Q5: 0/77
         
          TC (Temp Cycle):
          Results: PASS
          Conditions: -65C to +150C for 100, 500 cycles
          Q1: 0/77
          Q2: 0/77
          Q3: 0/77
          Q4: 0/77
          Q5: 0/77
         
          EV (External Visual Inspection):
          Results: PASS (ALL UNITS, ALL LOTS)
         
          PD (Physical Dimensions)
          Qual Point Requirements: Cpk greater than 1.33
          Results: PASS
          Q1: Cpk = 2.97
         
          BPS (Bond Pull Strength):
          Qual Point Requirements: Cpk greater than 1.33
          Results: PASS
          Q1: Cpk = 2.68
          Q2: Cpk = 2.82
          Q4: Cpk = 2.04
          Q5: Cpk = 3.03
         
          BS (Bond Shear Test):
          Qual Point Requirements: Cpk greater than 1.33
          Results: PASS
          Q1: Cpk = 2.70
          Q2: Cpk = 2.31
          Q4: Cpk = 2.55
          Q5: Cpk = 2.54
         
          SD (Solderability):
          Results: PASS
          Q1: 0/15
          Q2: 0/15
          Q3: 0/15
         
          ELFR (Early Life Failure Rate, 150C for 24hrs):
          Results: PASS
          Q1: 0/800
          Q2: 0/800
          Q3: 0/800
         
          GL (Gate Leakage 155C, 4.0 min, +400/-400 V)
          Results: PASS
          Q1: 0/6
         
          ED (Electrical Distribution):
          Results: PASS - COMPLETE

    ELECTRICAL CHARACTERISTIC SUMMARY

          Passed, meets all electrical parametric requirements.

    CHANGED PART IDENTIFICATION

          The traceability codes for all parts included on this notification
          will reflect the BAT3 assembly site with "CT" as opposed to "H"
          which represents SHC.


    RELATED NOTIFICATIONS:
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    AFFECTED DEVICE LIST
    PART
    KMC908MR8VFA
    MC44722AVFU
    MC44723AVFU
    MC68HC08SR12FA
    MC68HC908GR4CFA
    MC68HC908GR8CFA
    MC68HC908JB16FA
    MC68HC908JL3CFA
    MC68HC908MR8CFA
    MC68HC908MR8MFA
    MC68HC908MR8VFA
    MC68HC908RF2CFA
    MC68HC908SR12CFA
    MC68HC908SR12MFA
    MC68HRC908JL3CFA
    MC908MR8CFAR2
    MC908MR8MFAR2
    MC908MR8VFAR2
    MCVVQ111FB
    PC68C908CT16CFA
    PC68HC908AP64CFA
    PC68HC908EY16FA
    PC68HC908GR8MFA
    PC68HC908JB16FA
    PC68HC908JL8CFA
    PC68HC908JL8MFA
    PCVVQ111AFB
    SC433681FA
    SRFIC1521
    XC510164CFAR2
    XC68HC908RF2CFA
    XC68HC908SR12CFA
    XC908RF2CFAR2