MOTOROLA

Semiconductor Products Sector
Issuing Division: SPS

PRODUCT BULLETIN
Generic Copy

05-AUG-2002


Subject:               MOTOROLA PRODUCT BULLETIN 7855
TITLE:
14X14 QFP ASSY MOVE FROM SHC TO KLM, PT 1 OF 2

EFFECTIVE DATE:        06-Aug-2002


AFFECTED CHANGE CATEGORIES
  • MOTOROLA ASSEMBLY SITE


  • AFFECTED PRODUCT DIVISIONS
  • WIRELESS COMMUNICATIONS DIV (VC)
  • ADVANCED VEHICLE SYS DIV (JB)
  • WIRELESS INFRASTRCT SYS DIV (NH
  • BODY ELECT, OCCUPANT SAFETY (JD
  • RF/IF DIV (VW)
  • CPD- COMPUTING PLATFORM DIVISION (NR)
  • SMARTMOS PROD TECH CTR (JS
  • DRIVER INFORMATION DIVISION (JI)
  • NETWORK & COMM SYS DIV (NB)
  • BRD. AND ENT. DIVISION BESD (VE)
  • MULTIMEDIA SYSTEMS (ND)

  • ADDITIONAL RELIABILITY DATA: None
    REFERENCE: Contact Sales Office ()

    SAMPLES: Contact Local Sales Office
    REFERENCE: Contact Sales Office ()
    Contact your local Motorola Sales Office.

    For any questions concerning this notification:
    REFERENCE: Contact Sales Office (ALLISON ADCOCK)

    DISCLAIMER
          DISCLAIMER:
         
          MOTOROLA CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS
          OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL
          MOTOROLA SALES OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          This notification is an update to the Final Manufacturing Assembly
          Consolidations Product Change Notifications that announced the
          qualification plan for all products that will be moved out of their
          current site, Silicon Harbor (Hong Kong- SHC) or Sendai (Japan-
          SDI), into a Motorola qualified assembly site in Kuala Lumpur,
          Malaysia (KLM) or Tianjin, China (BAT3) or subcontractor. All
          assembly qualification exercises met all Motorola internal
          requirements and specifications and were performed by package
          family.
         
          This Product Bulletin provides the reliability results and announces
          the completion of the assembly package qualification for the 14x14
          QFP (64, 80, 100ld) Transfer from Silicon Harbor (Hong Kong- SHC) to
          Kuala Lumpur, Malaysia (KLM).
         
          Motorola continues to make substantial investments in both new
          technologies and improved manufacturing capabilities to provide you
          the highest quality and most reliable semiconductors in the
          industry. We believe that these actions will improve our ability to
          serve you in the future. We will strive to manage this transition
          to our mutual benefits.
         
          Please note: The Kuala Lumpur, Malaysia KLM Facility will be
          capable of starting the production ramp up of the 14x14 QFP parts
          from Silicon Harbor (Hong Kong- SHC) by September 2002, contingent
          on customer approval.
         
          Please be aware that during the production ramp up of the 14x14 QFP
          parts, you could receive a mix of parts from both Hong Kong SHC and
          Kuala Lumpur, Malaysia KLM until the ramp up is fully completed in
          the newly qualified site, KLM.
         
          BECAUSE OF THE LARGE QUANTITY OF DEVICE NUMBERS LISTED ON THIS
          NOTIFICATION, PRODUCT BULLETIN NUMBERS 7855 AND 7856 HAVE BEEN
          ASSIGNED.
         
          REFERENCE PREVIOUS PCN NUMBERS:
          7856 - 14X14 QFP ASSY MOVE FROM SHC TO KLM, PT 2 OF 2
          7278 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7281 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7283 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7285 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7345 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7347 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7348 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7416 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7418 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7420 - FINAL MANUFACTURING ASSY CONSOLIDATIONS

    QUALIFICATION PLAN

          Perform one full AEC Qualification by package technology family.
          Supplemental qualification data collected for specific differences
          across packages. The qualification met all Motorola internal
          requirements and specifications.

    RELIABILITY DATA SUMMARY

          Qualification of 14x14 QFP (64,80,100ld)
         
          Technology & Package: 14x14 QFP (64,80,100ld)
         
          (Full 3 lot AEC Qual):
          Qual Vehicle A: 912D60
          _______Q1- H14QFPD101
          _______Q2- H14QFPD102
          _______Q3- H14QFPD103
          _____Fab/Assy/Test: TSC8/KLM/KLM
          _____Die Size: 349 x 346
          _____Hot: 125C_____Cold: -40C
          -Note: (AEC)
         
          (Additional 1-lot quals = packaging variations):
          Qual Vehicle B: 9S12DP256, Q4-PC9SDQ256MFU25
          _____Fab/Assy/Test: TSMC3/KLM/KLM
          _____Die Size: 228x259
          _____Hot: 125C_____Cold: -40C
          -Note:(1 lot Fab/polyimide)= TSMC: Asashi PI, 0.25um
         
          Qual Vehicle C: 68EC000, Q5- MC68EC000FU12(J94M)
          _____Fab/Assy/Test: TSC8/KLM/KLM
          _____Die Size: 134x124
          _____Hot: 85C_____Cold: -40C
          -Note:(Moisture Sensitivity Level)MSL1 ,(Leadframe Design)X-flag
         
          Qual Vehicle D: 912B32: Q6- 68HC912B32 (J54E), LOT (H14QFPD401)
          _____Fab/Assy/Test: MOS12/KLM/KLM
          _____Die Size: 299 x 240
          _____Hot: 125C_____Cold: -40C
          -Note: (Large Die, UVO, MSL1)
         
          Qual Vehicle E: 912D60A Q7- MC912D60ACPV8, LOT (H14QFPD501)
          _____Fab/Assy/Test: TSC6/KLM/KLM
          _____Die Size: 281x264
          _____Hot: 125C_____Cold: -40C
          -Note: (Cu L/F-Lead finish, Bosch Qual)
         
          Qual Vehicle F: XF2013CV, Q8- XCF20013CV3
          _____Fab/Assy/Test: MOS11/KLM/KLM
          _____Die Size: 177x177
          _____Hot: 125C_____Cold: -40C
          -Note: (Fine pitch, Full-flag)
         
          TESTS:
          HTOL (High Temperature Op Life), 125C:
          ___Results: PASS
          HTOL 168 hr-
          _______Q1: 0/78
          _______Q2: 0/78
          _______Q3: 0/77 (Note 2)
          HTOL 504 hr
          _______Q1: 0/78
          _______Q2: 0/78
          _______Q3: 0/77
          HTOL 1008 hr
          _______Q1: 0/78
          _______Q2: 0/78
          _______Q3: 0/77
         
          PC (Preconditioning):
          ___Results: PASS
          Conditions: MSL3 (Moisture Sensitivity Level), 240C
          _______Q1, Q2, Q3: 0/699
          _______Q4: 0/231
          _______Q6: 0/234
          Conditions: MSL1 (Moisture Sensitivity Level), 220C
          _______Q5: 0/154
          Conditions: MSL3, 240C + 100 T/C (-40,150)
          _______Q7: 0/261
          Conditions: MSL3, 220C
          _______Q8: 0/154
         
          HAST (Highly Accelerated Stress Test), 96hrs:
          ___Results: PASS
          _______Q1: 0/78
          _______Q2: 0/78
          _______Q3: 1/78 (NOTE 3)
          _______Q4: 0/77
          _______Q6: 0/78
          _______Q7: (THB, 240hrs) = 0/30
          _______(HAST,96hrs) = 1/77 (Note 4)
         
         
          AC (Autoclave): 96 hrs
          ___Results: PASS
          _______Q1: 0/78
          _______Q2: 0/78
          _______Q3: 0/78
          _______Q4: 0/77
          _______Q5: 0/77
          _______Q6: 0/78
          _______Q7: 0/78
          _______Q8: 0/77
         
         
          TC (Temp Cycle):
          ___Results: PASS
          Conditions: -65C to +150C for 100, 500 cycles
          500 Cycles-
          _______Q1: 0/78
          _______Q2: 0/78
          _______Q3: 0/78,(Post stress wire pull: 7.6 - 9.4gm)
          _______Q4: 0/77
          _______Q5: 0/77,(Post stress wire pull: 6.7 - 8.6gm)
          _______Q6: 0/78,(Post stress wire pull: 7.8 - 9.0gm)
          _______Q8: 0/77,(Post stress wire pull: 7.1 - 9.8 gm)
          400 Cycles-
          _______Q7: 0/78, (Post stress wire pull: 7.6 - 9.4gm)
         
          EV (External Visual Inspection):
          ___Results: PASS (ALL UNITS, ALL LOTS)
         
          PD (Physical Dimensions)
          Qual Point Requirements: Ppk greater than 1.66
          or Cpk greater than 1.33
          ___Results: PASS
          _______Q1: 7.62
          _______Q2: 8.44
          _______Q3: 1.83
         
          BPS (Bond Pull Strength):
          Qual Point Requirements: Ppk greater than 1.66
          or Cpk greater than 1.33
          ___Results: PASS
          _______Q1: 3.8
          _______Q2: 5.8
          _______Q3: 4.2
          _______Q4: 3
          _______Q5: 3.77
          _______Q6: 3.46
          _______Q7: 4.83
          _______Q8: 3.65
         
          BS (Bond Shear Test):
          Qual Point Requirements: Ppk greater than 1.66
          or Cpk greater than 1.33
          ___Results: PASS
          _______Q1: 2.1
          _______Q2: 2.5
          _______Q3: 2.3
          _______Q4: 2
          _______Q5: 2.15
          _______Q6: 3.9
          _______Q7: 3.06
          _______Q8: 3.1
         
          SD (Solderability):
          ___Results: PASS
          _______Q1: 0/15
          _______Q2: 0/15
          _______Q3: 0/15
          _______Q4: 0/15
          _______Q5: 0/15
          _______Q6: 0/15
         
          ELFR (Early Life Failure Rate), 125C for 48 hrs
          ___Results: PASS
          _______Q1: 0/797 (NOTE 1)
          _______Q2: 0/799 (NOTE 1)
          _______Q3: 0/800
         
          GL (Gate Leakage 155C, 4.0 min, +400/-400 V)
          ___Results: PASS
          _______Q1: 0/6
         
          ED (Electrical Distribution):
          ___Results: PASS - COMPLETE
         
          ---------------------------------------------------
          (NOTE 1) - 4 pc Various FModes: 1 pc ESD, 3 pc Gate oxide defects.
          Not assembly related.
          (NOTE 2) - 1 pc misprocessed - EE test issue resolved.
          (NOTE 3) - 1 pc Open. Lifted ball bonds. See FA/CQI 303870 and 8D.
          (NOTE 4) - 1 pc Sidd - ESD damage.

    ELECTRICAL CHARACTERISTIC SUMMARY

          Passed, meets all electrical parametric requirements.

    CHANGED PART IDENTIFICATION

          The traceability codes for all parts included on this notification
          will reflect the KLM assembly site with Q as opposed to H which
          represents SHC.


    RELATED NOTIFICATIONS:
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    14X14 QFP ASSY MOVE FROM SHC TO KLM, PT 2 OF 2
    AFFECTED DEVICE LIST
    PART
    08AB24A-.5-TSC-0
    08AB24A-.5-TSC-1
    08AB24A-.5-TSC-2
    08AB24A-0.5U-0
    08AB24A-0.5U-1
    08AB32A-.5-TSC-0
    08AB32A-.5-TSC-1
    08AB32A-0.5U-0
    08AZ16A-.5-TSC-0
    08AZ16A-0.5U-0
    08AZ16A-0.5U-1
    08AZ24A-0.5U-0
    08AZ24A-0.5U-1
    08AZ24A-0.5U-2
    08AZ32A-.5-TSC-0
    08AZ32A-.5-TSC-2
    08AZ32A-.5-TSC-3
    08AZ32A-.5-TSC-4
    08AZ32A-.5-TSC-5
    08AZ32A-0.5U-0
    08AZ32A-0.5U-1
    08AZ32A-0.5U-2
    08AZ32A-0.5U-3
    08AZ32A-0.5U-4
    08AZ32A-0.5U-5
    08AZ32A-0.5U-6
    08AZ32A-0.5U-7
    08AZ32A-0.5U-8
    08AZ48A-TSC6-1
    LSC414105FU10B
    MC68EC000CFU10
    MC68EC000CFU16
    MC68EC000CFU16B1
    MC68EC000CFU20
    MC68EC000FU10
    MC68EC000FU10B1
    MC68EC000FU12
    MC68EC000FU16
    MC68EC000FU16B1
    MC68EC000FU16R2
    MC68EC000FU20
    MC68EC000FU8
    MC68HC08AS32FU
    MC68HC08AZ48FU
    MC68HC08AZ60FU
    MC68HC705X32CFU
    MC68HC705X32CFU4
    MC68HC705X32FU
    MC68HC705X32MFU
    MC68HC705X32MFU4
    MC68HC705X32VFU
    MC68HC705X32VFU4
    MC68HC908AB32CFU
    MC68HC908AB32MFU
    MC68HC912B32CFU8
    MC68HC912B32MFU8
    MC68SEC000CFU10
    MC68SEC000CFU16
    MC68SEC000CFU20
    MC68SEC000FU10
    MC68SEC000FU10R2
    MC68SEC000FU16
    MC68SEC000FU16B1
    MC68SEC000FU20
    MC68SEC000FU20B1
    MC68SEC000FU20R2
    MC68SECCFU20B1
    MC908AS60AMFU
    MC908AS60AVFU
    MC908AZ32ACFU
    MC908AZ32AMFU
    MC908AZ60ACFU
    MC908AZ60ACFUR2
    MC908AZ60AMFU
    MC908AZ60AMFUR2
    MC908AZ60AVFU
    MC908AZ60AVFUR2
    MC912B32CFU8R2
    PC512969CFU
    PC541704CFU
    PC541708CFU
    PART
    PC68HC08AZ32AFU
    SC401667CFU4R2
    SC504084VFUR2
    SC507544CFU
    SC510709CFU
    SC510753ASCFU
    SC510753ASCFUR2
    SC510753ASMFU
    SC510753ASVFU
    SC510753ASVFUR2
    SC510753AZCFU
    SC510753AZMFU
    SC510753AZMFUR2
    SC510753AZVFU
    SC510753AZVFUR2
    SC510764VFU
    SC510768CFU
    SC510768VFU
    SC510775CFU
    SC527362MFU
    SC527365CFUB
    SC527366MFU
    SC527367MFU
    SPAKEC000CFU20
    SPAKEC000FU12
    SPAKSEC000CFU20
    SPAKSEC000FU16
    XC510709CFU
    XC510709MFU
    XC510709VFU
    XC511062CFUR2
    XC527142CFU
    XC68HC08AZ32FU
    XC68HC705B32CFU
    XC68HC912BD32CFU
    XC908AZ60ACFU
    XC908AZ60ACFUR2
    XC908AZ60AMFU
    XC908AZ60AVFU
    XC908AZ60AVFUR2
    XCHC912BD32CFUR2