MOTOROLA

Semiconductor Products Sector
Issuing Division: SPS

PRODUCT BULLETIN
Generic Copy

05-AUG-2002


Subject:               MOTOROLA PRODUCT BULLETIN 7856
TITLE:
14X14 QFP ASSY MOVE FROM SHC TO KLM, PT 2 OF 2

EFFECTIVE DATE:        06-Aug-2002


AFFECTED CHANGE CATEGORIES
  • MOTOROLA ASSEMBLY SITE


  • AFFECTED PRODUCT DIVISIONS
  • WIRELESS COMMUNICATIONS DIV (VC)
  • ADVANCED VEHICLE SYS DIV (JB)
  • WIRELESS INFRASTRCT SYS DIV (NH
  • BODY ELECT, OCCUPANT SAFETY (JD
  • RF/IF DIV (VW)
  • CPD- COMPUTING PLATFORM DIVISION (NR)
  • SMARTMOS PROD TECH CTR (JS
  • DRIVER INFORMATION DIVISION (JI)
  • NETWORK & COMM SYS DIV (NB)
  • BRD. AND ENT. DIVISION BESD (VE)
  • MULTIMEDIA SYSTEMS (ND)

  • ADDITIONAL RELIABILITY DATA: None
    REFERENCE: Contact Sales Office ()

    SAMPLES: Contact Local Sales Office
    REFERENCE: Contact Sales Office ()
    Contact your local Motorola Sales Office.

    For any questions concerning this notification:
    REFERENCE: Contact Sales Office (ALLISON ADCOCK)

    DISCLAIMER
          DISCLAIMER:
         
          MOTOROLA CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS
          OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL
          MOTOROLA SALES OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          This notification is an update to the Final Manufacturing Assembly
          Consolidations Product Change Notifications that announced the
          qualification plan for all products that will be moved out of their
          current site, Silicon Harbor (Hong Kong- SHC) or Sendai (Japan-
          SDI), into a Motorola qualified assembly site in Kuala Lumpur,
          Malaysia (KLM) or Tianjin, China (BAT3) or subcontractor. All
          assembly qualification exercises met all Motorola internal
          requirements and specifications and were performed by package
          family.
         
          This Product Bulletin provides the reliability results and announces
          the completion of the assembly package qualification for the 14x14
          QFP (64, 80, 100ld) Transfer from Silicon Harbor (Hong Kong- SHC) to
          Kuala Lumpur, Malaysia (KLM).
         
          Motorola continues to make substantial investments in both new
          technologies and improved manufacturing capabilities to provide you
          the highest quality and most reliable semiconductors in the
          industry. We believe that these actions will improve our ability to
          serve you in the future. We will strive to manage this transition
          to our mutual benefits.
         
          Please note: The Kuala Lumpur, Malaysia KLM Facility will be
          capable of starting the production ramp up of the 14x14 QFP parts
          from Silicon Harbor (Hong Kong- SHC) by September 2002, contingent
          on customer approval.
         
          Please be aware that during the production ramp up of the 14x14 QFP
          parts, you could receive a mix of parts from both Hong Kong SHC and
          Kuala Lumpur, Malaysia KLM until the ramp up is fully completed in
          the newly qualified site, KLM.
         
          BECAUSE OF THE LARGE QUANTITY OF DEVICE NUMBERS LISTED ON THIS
          NOTIFICATION, PRODUCT BULLETIN NUMBERS 7855 AND 7856 HAVE BEEN
          ASSIGNED.
         
          REFERENCE PREVIOUS PCN NUMBERS:
          7855 - 14X14 QFP ASSY MOVE FROM SHC TO KLM, PT 1 OF 2
          7278 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7281 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7283 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7285 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7345 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7347 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7348 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7416 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7418 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7420 - FINAL MANUFACTURING ASSY CONSOLIDATIONS

    QUALIFICATION PLAN

          Perform one full AEC Qualification by package technology family.
          Supplemental qualification data collected for specific differences
          across packages. The qualification met all Motorola internal
          requirements and specifications.

    RELIABILITY DATA SUMMARY

          Qualification of 14x14 QFP (64,80,100ld)
         
          Technology & Package: 14x14 QFP (64,80,100ld)
         
          (Full 3 lot AEC Qual):
          Qual Vehicle A: 912D60
          _______Q1- H14QFPD101
          _______Q2- H14QFPD102
          _______Q3- H14QFPD103
          _____Fab/Assy/Test: TSC8/KLM/KLM
          _____Die Size: 349 x 346
          _____Hot: 125C_____Cold: -40C
          -Note: (AEC)
         
          (Additional 1-lot quals = packaging variations):
          Qual Vehicle B: 9S12DP256, Q4-PC9SDQ256MFU25
          _____Fab/Assy/Test: TSMC3/KLM/KLM
          _____Die Size: 228x259
          _____Hot: 125C_____Cold: -40C
          -Note:(1 lot Fab/polyimide)= TSMC: Asashi PI, 0.25um
         
          Qual Vehicle C: 68EC000, Q5- MC68EC000FU12(J94M)
          _____Fab/Assy/Test: TSC8/KLM/KLM
          _____Die Size: 134x124
          _____Hot: 85C_____Cold: -40C
          -Note:(Moisture Sensitivity Level)MSL1 ,(Leadframe Design)X-flag
         
          Qual Vehicle D: 912B32: Q6- 68HC912B32 (J54E), LOT (H14QFPD401)
          _____Fab/Assy/Test: MOS12/KLM/KLM
          _____Die Size: 299 x 240
          _____Hot: 125C_____Cold: -40C
          -Note: (Large Die, UVO, MSL1)
         
          Qual Vehicle E: 912D60A Q7- MC912D60ACPV8, LOT (H14QFPD501)
          _____Fab/Assy/Test: TSC6/KLM/KLM
          _____Die Size: 281x264
          _____Hot: 125C_____Cold: -40C
          -Note: (Cu L/F-Lead finish, Bosch Qual)
         
          Qual Vehicle F: XF2013CV, Q8- XCF20013CV3
          _____Fab/Assy/Test: MOS11/KLM/KLM
          _____Die Size: 177x177
          _____Hot: 125C_____Cold: -40C
          -Note: (Fine pitch, Full-flag)
         
          TESTS:
          HTOL (High Temperature Op Life), 125C:
          ___Results: PASS
          HTOL 168 hr-
          _______Q1: 0/78
          _______Q2: 0/78
          _______Q3: 0/77 (Note 2)
          HTOL 504 hr
          _______Q1: 0/78
          _______Q2: 0/78
          _______Q3: 0/77
          HTOL 1008 hr
          _______Q1: 0/78
          _______Q2: 0/78
          _______Q3: 0/77
         
          PC (Preconditioning):
          ___Results: PASS
          Conditions: MSL3 (Moisture Sensitivity Level), 240C
          _______Q1, Q2, Q3: 0/699
          _______Q4: 0/231
          _______Q6: 0/234
          Conditions: MSL1 (Moisture Sensitivity Level), 220C
          _______Q5: 0/154
          Conditions: MSL3, 240C + 100 T/C (-40,150)
          _______Q7: 0/261
          Conditions: MSL3, 220C
          _______Q8: 0/154
         
          HAST (Highly Accelerated Stress Test), 96hrs:
          ___Results: PASS
          _______Q1: 0/78
          _______Q2: 0/78
          _______Q3: 1/78 (NOTE 3)
          _______Q4: 0/77
          _______Q6: 0/78
          _______Q7: (THB, 240hrs) = 0/30
          _______(HAST,96hrs) = 1/77 (Note 4)
         
         
          AC (Autoclave): 96 hrs
          ___Results: PASS
          _______Q1: 0/78
          _______Q2: 0/78
          _______Q3: 0/78
          _______Q4: 0/77
          _______Q5: 0/77
          _______Q6: 0/78
          _______Q7: 0/78
          _______Q8: 0/77
         
         
          TC (Temp Cycle):
          ___Results: PASS
          Conditions: -65C to +150C for 100, 500 cycles
          500 Cycles-
          _______Q1: 0/78
          _______Q2: 0/78
          _______Q3: 0/78,(Post stress wire pull: 7.6 - 9.4gm)
          _______Q4: 0/77
          _______Q5: 0/77,(Post stress wire pull: 6.7 - 8.6gm)
          _______Q6: 0/78,(Post stress wire pull: 7.8 - 9.0gm)
          _______Q8: 0/77,(Post stress wire pull: 7.1 - 9.8 gm)
          400 Cycles-
          _______Q7: 0/78, (Post stress wire pull: 7.6 - 9.4gm)
         
          EV (External Visual Inspection):
          ___Results: PASS (ALL UNITS, ALL LOTS)
         
          PD (Physical Dimensions)
          Qual Point Requirements: Ppk greater than 1.66
          or Cpk greater than 1.33
          ___Results: PASS
          _______Q1: 7.62
          _______Q2: 8.44
          _______Q3: 1.83
         
          BPS (Bond Pull Strength):
          Qual Point Requirements: Ppk greater than 1.66
          or Cpk greater than 1.33
          ___Results: PASS
          _______Q1: 3.8
          _______Q2: 5.8
          _______Q3: 4.2
          _______Q4: 3
          _______Q5: 3.77
          _______Q6: 3.46
          _______Q7: 4.83
          _______Q8: 3.65
         
          BS (Bond Shear Test):
          Qual Point Requirements: Ppk greater than 1.66
          or Cpk greater than 1.33
          ___Results: PASS
          _______Q1: 2.1
          _______Q2: 2.5
          _______Q3: 2.3
          _______Q4: 2
          _______Q5: 2.15
          _______Q6: 3.9
          _______Q7: 3.06
          _______Q8: 3.1
         
          SD (Solderability):
          ___Results: PASS
          _______Q1: 0/15
          _______Q2: 0/15
          _______Q3: 0/15
          _______Q4: 0/15
          _______Q5: 0/15
          _______Q6: 0/15
         
          ELFR (Early Life Failure Rate), 125C for 48 hrs
          ___Results: PASS
          _______Q1: 0/797 (NOTE 1)
          _______Q2: 0/799 (NOTE 1)
          _______Q3: 0/800
         
          GL (Gate Leakage 155C, 4.0 min, +400/-400 V)
          ___Results: PASS
          _______Q1: 0/6
         
          ED (Electrical Distribution):
          ___Results: PASS - COMPLETE
         
          ---------------------------------------------------
          (NOTE 1) - 4 pc Various FModes: 1 pc ESD, 3 pc Gate oxide defects.
          Not assembly related.
          (NOTE 2) - 1 pc misprocessed - EE test issue resolved.
          (NOTE 3) - 1 pc Open. Lifted ball bonds. See FA/CQI 303870 and 8D.
          (NOTE 4) - 1 pc Sidd - ESD damage.

    ELECTRICAL CHARACTERISTIC SUMMARY

          Passed, meets all electrical parametric requirements.

    CHANGED PART IDENTIFICATION

          The traceability codes for all parts included on this notification
          will reflect the KLM assembly site with Q as opposed to H which
          represents SHC.


    RELATED NOTIFICATIONS:
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    14X14 QFP ASSY MOVE FROM SHC TO KLM, PT 1 OF 2
    AFFECTED DEVICE LIST
    PART
    LSC401757FU
    MC68HC05L5FU
    MC68HC08AB16AFU
    MC68HC705B16CFU
    MC68HC705B16MFU
    MC68HC705B16NCFU
    MC68HC705B16VFU
    MC68HC705F8FU
    MC68HC705G1CFU
    MC68HC908AB32VFU
    MC68HC908LD60IFU
    MC68HC908LD64IFU
    MC68HC908LJ12CFU
    MC68HC908MR16CFU
    MC68HC908MR16VFU
    MC68HC908MR32CFU
    MC68HC908MR32VFU
    MC912B32VFU8R2
    MC912D60ACFU8
    MC912D60AMFU8
    MC912D60AVFU8
    MC9S12A128BCFU
    MC9S12A256BCFU
    MC9S12DG128BCFU
    MC9S12DG128BMFU
    MC9S12DG128BVFU
    MC9S12DG256BCFU
    MC9S12DG256BMFU
    MC9S12DJ128BCFU
    MC9S12DJ256BCFU
    MC9S12DJ256BMFU
    MC9S12DJ256BVFU
    MC9SDJ256BCFUR2
    MC9SDJ256BMFUR2
    MC9SDJ256BVFUR2
    MC9SDT256BCFUR2
    MCHC908AB32CFUR2
    PC68HC908AB32MFU
    PC68HC908LJ12CFU
    PC9S12D64CFU25
    PC9S12DB128CFU25
    PC9S12DG128CFU25
    PC9S12DG128MFU25
    PC9S12DJ128CFU25
    PC9S12DJ128MFU25
    PC9S12DJ256MFU25
    PC9SDJ256MFU25R2
    PC9SDQ256MFU25
    SC510727MFU
    SC511357CFU8
    SC511361VFU8R2
    SC512793CFU
    SC512794CFU
    SSP25206FJ50R2
    XC431620CFU8
    XC431620CFU8R2
    XC431620MFU8
    XC431620MFU8R2
    XC431622CFU8
    XC431622MFU8
    XC431622MFU8R2
    XC431622VFU8
    XC431622VFU8R2
    XC511321CPV
    XC511322CPV
    XC511325CFU8
    XC511325MFU8
    XC511325VFU8
    XC511328CFU8
    XC68HC12D60FU
    XC68HC708KH12FU
    XC68HC708KH12IFU
    XC68HC912B32CFU8
    XC68HC912B32MFU8
    XC68HC912B32VFU8
    XC68HC912D60MFU8
    XC912BC32CFU8
    XC912BC32CFU8R2
    XC912BC32MFU8
    XC912BC32MFU8R2
    XC912D60ACFU8