MOTOROLA

Semiconductor Products Sector
Issuing Division: SPS

PRODUCT BULLETIN
Generic Copy

14-AUG-2002


Subject:               MOTOROLA PRODUCT BULLETIN 7899
TITLE:
44/52/68 PLCC ASSY MOVE FROM SDI TO KLM

EFFECTIVE DATE:        15-Aug-2003


AFFECTED CHANGE CATEGORIES
  • MOTOROLA ASSEMBLY SITE


  • AFFECTED PRODUCT DIVISIONS
  • WIRELESS COMMUNICATIONS DIV (VC)
  • ADVANCED VEHICLE SYS DIV (JB)
  • WIRELESS INFRASTRCT SYS DIV (NH
  • BODY ELECT, OCCUPANT SAFETY (JD
  • RF/IF DIV (VW)
  • CPD- COMPUTING PLATFORM DIVISION (NR)
  • SMARTMOS PROD TECH CTR (JS
  • DRIVER INFORMATION DIVISION (JI)
  • NETWORK & COMM SYS DIV (NB)
  • BRD. AND ENT. DIVISION BESD (VE)
  • MULTIMEDIA SYSTEMS (ND)

  • ADDITIONAL RELIABILITY DATA: None
    REFERENCE: Contact Sales Office ()

    SAMPLES: Contact Local Sales Office
    REFERENCE: Contact Sales Office ()
    Contact your local Motorola Sales Office.

    For any questions concerning this notification:
    REFERENCE: Contact Sales Office (ALLISON ADCOCK)

    DISCLAIMER
          DISCLAIMER:
         
          MOTOROLA CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS
          OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL
          MOTOROLA SALES OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          This notification is an update to the Final Manufacturing Assembly
          Consolidations Product Change Notifications that announced the
          qualification plan for all products that will be moved out of their
          current site, Silicon Harbor (Hong Kong- SHC) or Sendai (Japan-
          SDI), into a Motorola qualified assembly site in Kuala Lumpur,
          Malaysia (KLM) or Tianjin, China (BAT3) or subcontractor. All
          assembly qualification exercises met all Motorola internal
          requirements and specifications and were performed by package
          family.
         
          This Product Bulletin provides the reliability results and announces
          the completion of the assembly package qualification for the
          44/52/68 PLCC Transfer from Sendai (Japan- SDI) to Kuala Lumpur,
          Malaysia (KLM).
         
          Motorola continues to make substantial investments in both new
          technologies and improved manufacturing capabilities to provide you
          the highest quality and most reliable semiconductors in the
          industry. We believe that these actions will improve our ability to
          serve you in the future. We will strive to manage this transition
          to our mutual benefits.
         
          Please note: The Kuala Lumpur, Malaysia KLM Facility will begin
          the production ramp up of the 44/52/68 PLCC parts from Sendai
          (Japan- SDI)immediately. This is to ensure that we execute these
          consolidations on time and we complete these factory closures by the
          end of the year 2002.
          Please be aware that during the production ramp up of the 44/52 PLCC
          parts, you could receive a mix of parts from both Sendai (Japan-
          SDI)and Kuala Lumpur, Malaysia KLM until the ramp up is fully
          completed in the newly qualified site, KLM.
         
          REFERENCE PREVIOUS PCN NUMBERS:
          7278 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7281 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7283 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7285 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7416 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7418 - FINAL MANUFACTURING ASSY CONSOLIDATIONS
          7420 - FINAL MANUFACTURING ASSY CONSOLIDATIONS

    QUALIFICATION PLAN

          The qualification exercise was performed by package family. The
          qualification met all Motorola internal requirements and
          specifications. PLCC qual was a minimum qual to verify MSL
          differences. Minimum qual results below along with generic qual
          data from KLM.

    RELIABILITY DATA SUMMARY

          Qualification of 44ld/52ld/68ld PLCC
         
          (Minimum qual to verify MSL level - PASS)
         
          Technology AND Package: 44/52/68 PLCC)
          Qual Vehicle A: Q1A - 705C9A(K03B)(SAQ75C9A)- 1.8 mil diameter
          wire
          ____________Q1B - 705C9A(K03B)(SAQ75C9A)- 1.3 mil diameter wire
          _____Device: MC68HC705C9ACFN
          _____Fab/Assy/Test: TSC6/KLM/KLM
          _____Die Size: 240X250
          _____Hot: 125C_____Cold: -40C
         
          Qual Vehicle B: Q2 - SRQ5C8 (D67P)- 1.8 mil diameter wire
          _____Device: SC440951CFNW
          _____Fab/Assy/Test: TSC6/KLM/KLM
          _____Die Size: 113X200
          _____Hot: 125C_____Cold: -40C
         
         
          PC (Preconditioning):
          ___Results: PASS
          ___Conditions: MSL2,(Moisture Sensitivity Level), 240C
          __________Q1A: 0/160
          __________Q1B: 0/160
          ___Conditions: MSL2 (Moisture Sensitivity Level), (125C/24hr,85C/85
          percent /24hr, solder dip 260C 10sec x 3
          __________Q2: 0/160
         
          AC (Autoclave): 96 hrs
          ___Results: PASS
          __________Q1A: 0/80
          __________Q1B: 0/80
          __________Q2: 0/80
         
          TC (Temp Cycle):
          ___Results: PASS
          ___Conditions: -65C to +150C for 100, 500 cycles
          __________Q1A:100 cycles- 0/80
          _______________500 cycles- 0/80
          __________Q1B:100 cycles- 0/80
          _______________500 cycles- 0/80
          __________Q2: 100 cycles- 0/80
          _______________500 cycles- 0/80
         
          EV (External Visual Inspection):
          ___Results: PASS (ALL UNITS, ALL LOTS)
         
         
          BPS (Bond Pull Strength):
          Qual Point Requirements: Ppk greater than 1.66 or
          Cpk greater than 1.33
          ___Results: PASS
          __________Q1A:5.53
          __________Q1B:4.13
          __________Q2: 2.37
         
          BS (Bond Shear Test):
          Qual Point Requirements: Ppk greater than 1.66 or
          Cpk greater than 1.33
          ___Results: PASS
          __________Q1A:1.86
          __________Q1B:2.91
          __________Q2: 2.41
          -------------------------------------------------------
         
          44PLCC Generic Qual Data
         
          Generic qual data 44 PLCC, from MOS5 to TSC6 Fab Transfer Qual
          Technology & Package: 44/52/68ld PLCC, 1.3 mil diameter wire)
          Qual Vehicle A: Q1- A2159500
          __________Q2- A2159600
          __________Q3- A2159700
          _____Device: 68HC711D3
          _____Fab/Assy/Test: TSC6/KLM/KLM
          _____Maskset: K05W Rev.0
          _____Die Size: 234.49 X 262.50
          _____Temp Range: -40C to +125C, Frequency Range: 3 MHZ
         
          HTOL (High Temperature Op Life 1008hrs at 125C)
          ___Results: PASS
          __________Q1: 0/77
          __________Q2: 0/77
          __________Q3: 0/77
         
          PC (Preconditioning):
          ___Results: PASS
          ___Conditions: MSL1 (Moisture Sensitivity Level), Tpeak 220C
          __________Q1: 0/231
          __________Q2: 0/231
          __________Q3: 0/231
         
          THB HAST (Highly Accelerated Stress Test):
          ___Results: PASS
          ___Conditions: 85C/85 percent RH for 1008 hrs,
          _______________130C/85 percent RH for 96 hrs
          __________Q1: 0/77
          __________Q2: 0/77
          __________Q3: 0/77
         
          AC (Autoclave): 96 hrs
          ___Results: PASS
          __________Q1: 0/77
          __________Q2: 0/77
          __________Q3: 0/77
         
          TC (Temp Cycle):
          ___Results: PASS
          ___Conditions: -65C to +150C for 100, 500 cycles
          __________Q1: 0/77
          __________Q2: 0/77
          __________Q3: 0/77
         
          BPS (Bond Pull Strength):
          Qual Point Requirements: Ppk greater than 1.66 or
          Cpk greater than 1.33
          ___Results: PASS
          __________Q1: Cpk 4.05
         
          BS (Bond Shear Test):
          Qual Point Requirements: Ppk greater than 1.66 or
          Cpk greater than 1.33
          ___Results: PASS
          __________Q1: Cpk 3.39
         
          ELFR (Early Life Failure Rate, 125C for 48hrs):
          ___Results: PASS
          __________Q1: 0/800
          __________Q2: 0/800
          __________Q3: 0/800
         
          ED (Electrical Distribution):
          ___Results: PASS - COMPLETE
          ---------------------------------------------------------
         
          52PLCC Generic Qual Data:
         
          Generic Qual Data (52PLCC/KLM) MOS5 to TSC6 Fab Transfer Qual
          _____Technology AND Package: 52ld PLCC
          _____Device: 68HC711E20
          _____Fab/Assy/Test: TSC6/KLM/KLM
          _____Maskset: H19S Rev.0
          _____Die Size: 362 X 254
          _____Qual Plan Ref #: Quartz Study#4918
          _____Temp Range: -40C to +125C, Frequency Range: 3 MHZ
         
          _____Qual Vehicle A: A1000600
          _____Generic Data (60 percent TSC6):
          __________Q1: 68HC711K4 (K59D): Quartz#5244
          __________Q2: 68HC711KS2(0K08W,68PLCC): Quartz#3590/5312
          _____Generic Data (52PLCC/KLM)from BOM Std Qual):
          __________Q3: 68HC711E20(G59F)
         
          52 PLCC KLM Data:
          __________Q4: 68HC711E9 (3K81H): Quartz#5708
         
          Qual Vehicle B: TJ209851
          Generic Data used for the 52PLCC SDI data:
          __________Q5: 68HC711E9 (4K81H)
         
          Qual Vehicle C: A22232A100
          Generic 60 percent TSC6 10K cyc Data:
          __________Q6: 68HC711KS2 (0K08W), 68PLCC: Quartz#5312
         
          HTOL (High Temperature Op Life 1008hrs at 125C)
          ___Results: PASS
          __________Q1: 0/77
          __________Q2: 0/77
         
          PC (Preconditioning):
          ___Results: PASS
          ___Conditions: MSL3 (Moisture Sensitivity Level), Tpeak 220C
          __________Q1: 0/231
          __________Q2: 0/231
          __________Q3: 0/231
          __________Q4: 0/231
         
          THB HAST (Highly Accelerated Stress Test):
          ___Results: PASS
          ___Conditions: 85C/85 percent RH for 1008 hrs
          __________Q3: 0/77
         
          AC (Autoclave): 96 hrs
          ___Results: PASS
          __________Q3: 0/77
          __________Q4: 0/77
         
          TC (Temp Cycle):
          ___Results: PASS
          ___Conditions: -65C to +150C for 500 cycles
          __________Q3: 0/77
          __________Q4: 0/77
         
          BPS (Bond Pull Strength):
          Qual Point Requirements: Ppk greater than 1.66 or
          Cpk greater than 1.33
          ___Results: PASS
          __________Q1: Cpk 3.6037
         
          BS (Bond Shear Test):
          Qual Point Requirements: Ppk greater than 1.66 or
          Cpk greater than 1.33
          ___Results: PASS
          __________Q1: Cpk 4.1714
         
          LU (Dynamic Latch-up 125C, 100mA):
          __________Q5: 0/6
         
          ET (E2PROM Data Endurance and Retention Test):
          __________Q1: 0/77
          __________Q2: 0/77
          __________Q6: 0/77
         
          ELFR (Early Life Failure Rate, 150C for 24hrs):
          ___Results: PASS
          __________Q1: 0/800
          __________Q2: 0/800
         
         
          ED (Electrical Distribution):
          ___Results: PASS - COMPLETE
         
          -----------------------------------------------------
         
          KLM 68PLCC Generic Qual Data:
         
          Technology AND Package: 68ld PLCC
          Device:_____68HC711KS2
          Maskset:_____0K08W
          Die Size:_____410.0 X 312.50
          Fab/Asst/Test:_____TSC6/KLM/KLM
          Quartz Study:_____#3590, 5312
          Temp Range:_____-40C to +125C, Frequency Range: 4 MHZ
         
          Qual Vehicle A: A2103600
          Generic Data (TSC6 60 percent):
          __________Q1- 711E20 (H19S): Quartz#4918
          __________Q2- 711K4 (K59D): Quartz#5244
         
          Generic Data (TSC6 73 percent):
          __________Q3- HC11KS2 (K07E): Quartz#5154
          Generic Data (68PLCC/KLM) from BOM Std Qual:
          __________Q4- MC68882
          __________Q5- SC439135CFN1R2
         
         
          HTOL (High Temperature Op Life 1008hrs at 125C)
          ___Results: PASS
          __________Q1: 0/77
          __________Q2: 0/77
          __________Q3: 0/77
         
          PC (Preconditioning):
          ___Results: PASS
          ___Conditions: MSL3 (Moisture Sensitivity Level), Tpeak 240C
          __________Q3: 0/231
          __________Q4: 0/231
          __________Q5: 0/231
         
          THB HAST (Highly Accelerated Stress Test):
          ___Results: PASS
          ___Conditions: 130C/85 percent RH for 96 hrs
          __________Q4: 0/77
          __________Q5: 0/77
         
          AC (Autoclave): 96 hrs
          ___Results: PASS
          __________Q3: 0/77
          __________Q4: 0/77
          __________Q5: 0/77
         
          TC (Temp Cycle):
          ___Results: PASS
          ___Conditions: -65C to +150C for 500 cycles
          __________Q3: 0/77
          __________Q4: 0/77
          __________Q5: 0/77
         
          BPS (Bond Pull Strength):
          Qual Point Requirements: Ppk greater than 1.66 or
          Cpk greater than 1.33
          ___Results: PASS
          __________Q1: Cpk 1.61
         
          BS (Bond Shear Test):
          Qual Point Requirements: Ppk greater than 1.66 or
          Cpk greater than 1.33
          ___Results: PASS
          __________Q1: Cpk 1.69
         
          ELFR (Early Life Failure Rate, 150C for 24hrs):
          ___Results: PASS
          __________Q1: 0/800
          __________Q2: 0/800
          __________Q3: 0/800
         
          ED (Electrical Distribution):
          ___Results: PASS - COMPLETE
          ---------------------------------------------------------

    ELECTRICAL CHARACTERISTIC SUMMARY

          Passed, meets all electrical parametric requirements.

    CHANGED PART IDENTIFICATION

          The traceability codes for all parts included on this notification
          will reflect the KLM assembly site with Q as opposed to S which
          represents SDI.


    RELATED NOTIFICATIONS:
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    AFFECTED DEVICE LIST
    PART
    KMC11A0CFN3
    KMC11E0CFN3
    KMC11E0MFN3
    KMC11E0VFN3
    KMC11E1CFN3
    KMC11E1MFN3
    KMC11E1VFN3
    KMC11E9BCFN2
    KMC11F1CFN3
    KMC11F1CFN4
    KMC11F1CFN5
    KMC68S711E9CFN2
    KMC705C8ACFN
    KMC705C9ACFN
    KMC711E9CFN3
    KMC711E9CFN4
    KMCL11F1CFN3
    MC68711E9CFN2R2
    MC68HC11A0CFN3
    MC68HC11A0CFN3R2
    MC68HC11A0FN
    MC68HC11A0FNR2
    MC68HC11E0CFN2
    MC68HC11E0CFN2R2
    MC68HC11E0CFN3
    MC68HC11E0CFN3R2
    MC68HC11E0FNR2
    MC68HC11E0MFN2
    MC68HC11E0MFN3
    MC68HC11E0VFN2
    MC68HC11E0VFN3
    MC68HC11E1CFN2
    MC68HC11E1CFN2R2
    MC68HC11E1CFN3
    MC68HC11E1CFN3R2
    MC68HC11E1FN
    MC68HC11E1FNR2
    MC68HC11E1MFN2
    MC68HC11E1MFN3
    MC68HC11E1VFN3
    MC68HC11E9BCFN2
    MC68HC11E9FN
    MC68HC11E9FN1
    MC68HC11F1CFN2
    MC68HC11F1CFN2R2
    MC68HC11F1CFN3
    MC68HC11F1CFN3R2
    MC68HC11F1CFN4
    MC68HC11F1CFN4R2
    MC68HC11F1CFN5
    MC68HC11F1FN
    MC68HC11F1FN4
    MC68HC11F1FNR2
    MC68HC11F1MFN4
    MC68HC11F1VFN2
    MC68HC11F1VFN3
    MC68HC11F1VFN4
    MC68HC11F1VFNR2
    MC68HC705C8ACFN
    MC68HC705C8AFN
    MC68HC705C8AVFN
    MC68HC705C9ACFN
    MC68HC705C9AFN
    MC68HC705C9AVFN
    MC68HC711E9CFN
    MC68HC711E9CFN2
    MC68HC711E9CFN3
    MC68HC711E9CFN4
    MC68HC711E9CFNW
    MC68HC711E9MFN2
    MC68HC711E9VFN2
    MC68HCP11A0CFN3
    MC68HCP11A0FN
    MC68HCP11A0FNR2
    MC68HCP11E0FN
    MC68HCP11E1CFN2
    MC68HCP11E1CFN3
    MC68HCP11E1VFN2
    MC68HSC705C8ACFN
    MC68L11F1CFN3
    MC68L711E9FN2
    PART
    MC68LNC705C9ACFN
    MC68P11E1CFN2R2
    MC68S711E9CFN2
    MC705C8ACFNR2
    SC404816CFNG
    SC404848CFNG
    SC404850CFNG
    SC404855CFNG
    SC432291CFN2R2
    SC432293CFN2R2
    SC432463CFN2R2
    SC432934CFN2R2
    SC433770CFN
    SC437975CFN2R2
    SC437994VFN2R2
    SC440951CFNW
    SC444393VFN2R2
    SC444399VFN2R2
    SC502428CFN2R2
    SC502512VFNB
    SC502513CFN2R2
    SC502559VFNB
    SC525160CFNR2
    SC528748CFN2
    SC528755CFN2
    SC528755CFN3
    SC528755VFN2
    SC529150CFN2
    SC529182VFN2R2
    SC551608VFN2R2
    SC551611VFN2R2
    SC551629CFN2R2
    SC551648CFN2R2
    SPAKHC705C9ACFN
    XC400363MFN3
    XC501603MFN3
    XC68HC705C9ACFN