MOTOROLA

Semiconductor Products Sector
Issuing Division: SPS

PRODUCT BULLETIN
Generic Copy

12-SEP-2002


Subject:               MOTOROLA PRODUCT BULLETIN 7977
TITLE:
14X14 QFP ASSY MOVE FROM SDI TO KLM

EFFECTIVE DATE:        13-Sep-2002


AFFECTED CHANGE CATEGORIES
  • MOTOROLA ASSEMBLY SITE


  • AFFECTED PRODUCT DIVISIONS
  • WIRELESS COMMUNICATIONS DIV (VC)
  • ADVANCED VEHICLE SYS DIV (JB)
  • WIRELESS INFRASTRCT SYS DIV (NH
  • BODY ELECT, OCCUPANT SAFETY (JD
  • RF/IF DIV (VW)
  • CPD- COMPUTING PLATFORM DIVISION (NR)
  • SMARTMOS PROD TECH CTR (JS
  • DRIVER INFORMATION DIVISION (JI)
  • NETWORK & COMM SYS DIV (NB)
  • BRD. AND ENT. DIVISION BESD (VE)
  • MULTIMEDIA SYSTEMS (ND)

  • ADDITIONAL RELIABILITY DATA: None
    REFERENCE: Contact Sales Office ()

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    Contact your local Motorola Sales Office.

    For any questions concerning this notification:
    REFERENCE: Contact Sales Office (ALLISON ADCOCK)

    DISCLAIMER
          DISCLAIMER:
         
          MOTOROLA CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS
          OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL
          MOTOROLA SALES OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          This notification is an update to the Final Manufacturing Assembly
          Consolidations Product Change Notifications that announced the
          qualification plan for all products that will be moved out of their
          current site, Silicon Harbor (Hong Kong- SHC) or Sendai (Japan-
          SDI), into a Motorola qualified assembly site in Kuala Lumpur,
          Malaysia (KLM) or Tianjin, China (BAT3) or subcontractor. All
          assembly qualification exercises met all Motorola internal
          requirements and specifications and were performed by package
          family.
         
          This Product Bulletin provides the reliability results and announces
          the completion of the assembly package qualification for the 14x14
          QFP Transfer from Sendai(Japan- SDI)to Kuala Lumpur, Malaysia (KLM).
         
         
          Motorola continues to make substantial investments in both new
          technologies and improved manufacturing capabilities to provide you
         
          the highest quality and most reliable semiconductors in the
          industry. We believe that these actions will improve our ability to
          serve you in the future. We will strive to manage this transition to
          our mutual benefits.
         
          Please note: The Kuala Lumpur, Malaysia KLM Facility will be
          capable of starting the production ramp up of the 14x14 QFP parts
          from Sendai(Japan- SDI) immediately, contingent on customer
          approval.
         
          Please be aware that in order for Motorola to execute the
          closures/consolidations on time and complete, by the end of the year
          2002, during the production ramp up of the 14x14 QFP parts, you
          could receive a mix of parts from both Sendai SDI and Kuala Lumpur,
          Malaysia-KLM, until the ramp up is fully completed in the newly
          qualified site, KLM.
         
          Related Product Notifications:
         
          PN# 7278: FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN# 7281: FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN# 7283: FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN# 7285: FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN# 7416: FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN# 7418: FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN# 7420: FINAL MANUFACTURING ASSY CONSOLIDATIONS

    QUALIFICATION PLAN

          The qualification exercise was performed by package family. The
          qualification met all Motorola internal requirements and
          specifications.

    RELIABILITY DATA SUMMARY

          Qualification of 14x14 QFP
         
         
          Technology & Package: 14x14QFP (64,80ld)
          Qual Vehicle A: HC711MA8
          Q1 - QS1S0222 (J14QFPD11S, S200)
          Q2 - QS1C0222 (J14QFPD11C, CRC6061)
          Q3 - QS2S0222 (J14QFPD12S, S200)
          Device: MC68HC711MA8FU
          Fab/Assy/Test: TSC6/KLM/KLM
          Die Size: 405X405 mils
          Hot: 85C Cold: -40C
         
          Qual Vehicle B: HC11K4
          Q4 - QS1H0222 (J14QFPD31H)
          Device: SC418434MFU4
          Fab/Assy/Test: MOS5/KLM/KLM
          Die Size: 311x281 mils
          Hot: 125C Cold: -40C
         
          Qual Vehicle C: HC11E9
          Q5 - QS1C0222 (J14QFP641C)
          Device: SC529211VFUB
          Fab/Assy/Test: TSC6/KLM/KLM
          Die Size: 137x172 mils
          Hot: 105C Cold: -40C
         
          PC (Preconditioning):
          Results: PASS
          Conditions: MSL2 (Moisture Sensitivity Level), 240C
          Q1: 0/231
          Q2: 0/231
          Q3: 0/231
          Q4: 0/231
          Q5: 0/66 (Note 1)
         
         
          HAST (Highly Accelerated Stress Test)96hrs:
          Results: PASS
          Q1: 0/77
          Q2: 0/77
          Q3: 0/77
          Q4: 0/77
          Q5: 0/22 (Note 1)
         
          AC (Autoclave): 96 hrs
          Results: PASS
          Q1: 0/77
          Q2: 0/77
          Q3: 0/77
          Q4: 0/77
          Q5: 0/22 (Note 1)
         
          TC (Temp Cycle):
          Results: PASS
          Conditions: -65C to +150C for 500 cycles
          Q1: 0/77
          Q2: 0/77
          Q3: 0/77
          Q4: 0/77
          Q5: 0/22 (Note 1)
         
          EV (External Visual Inspection):
          Results: PASS (ALL UNITS, ALL LOTS)
         
          PD (Physical Dimensions)
          Qual Point Requirements: Cpk greater than 1.33
          Results: PASS
          Q1: Cpk= 7.81
          Q2: Cpk= 4.93
          Q3: Cpk= 6.89
         
          BPS (Bond Pull Strength):
          Qual Point Requirements: Cpk greater than 1.33
          Results: PASS
          Q1: Cpk = 3.11
          Q2: Cpk = 4.28
          Q3: Cpk = 4.94
          Q5: Cpk = 3.28
         
          BS (Bond Shear Test):
          Qual Point Requirements: Cpk greater than 1.33
          Results: PASS
          Q1: Cpk = 3.75
          Q2: Cpk = 2.88
          Q3: Cpk = 4.27
          Q5: Cpk = 1.79
         
          SD (Solderability):
          Results: PASS
          Q1: 0/15
          Q2: 0/15
          Q3: 0/15
         
          ELFR (Early Life Failure Rate) 48 hrs @ 125C
          Results: PASS
          Q1: 0/800
          Q2: 0/800
          Q3: 0/800
         
          ED (Electrical Distribution):
          Results: PASS - COMPLETE
          _________________________________________________________
         
          (Note 1- Quantity based on customer specific requirement)

    ELECTRICAL CHARACTERISTIC SUMMARY

          Passed, meets all electrical parametric requirements.

    CHANGED PART IDENTIFICATION

          The traceability codes for all parts included in this notification
          will reflect the new KLM assembly site. The marking will change
          from "S" which represents SDI to "Q" which represents KLM.


    RELATED NOTIFICATIONS:
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    AFFECTED DEVICE LIST
    PART
    JLC1600FB
    JLC1603FB
    LSC401758FU
    LSC401782FU
    LSC418380CFU3
    LSC436048FU
    MC68HC05G3FU
    MC68HC11E0CFU3
    MC68HC11E0FU
    MC68HC11E1CFU3
    MC68HC11E1FU
    MC68HC11K0CFU4
    MC68HC11K1CFU3
    MC68HC11K1CFU4
    MC68HC11L0FU
    MC68HC11L1CFU2
    MC68HC11L1FU
    MC68HC12BC32FU
    MC68HC12BE32FU
    MC68HC705C8ACFU
    MC68HC705C8AFU
    MC68HC705L13FU
    MC68HC705L16CFU
    MC68HC705L16FU
    MC68HC705L32FU
    MC68HC705L5FU
    MC68HC711E20CFU2
    MC68HC711E20CFU3
    MC68HC711E20CFU4
    MC68HC711E20VFU2
    MC68HC711E9CFU
    MC68HC711E9CFU2
    MC68HC711E9CFU3
    MC68HC711E9FU
    MC68HC711E9VFU2
    MC68HC711K4CFU3
    MC68HC711K4CFU4
    MC68HC711K4MFU4
    MC68HC711K4VFU4
    MC68HC711L6CFU2
    MC68HC711L6CFU3
    MC68HC711M2FU4
    MC68HC711MA8CFU
    MC68HC711MA8FU
    MC68HC916P1CFU16
    MC68HC916P1VFU16
    MC68HC916P3CFU16
    MC68HC916P3VFU16
    MC68HCP11E1CFU3
    MC68HCP11E1FU
    MC68L11K1FU2
    MC68L711E9FU2
    MC68L711L6FU2
    MC68L711M2CFU
    MC68S711E9CFU3
    MC711K4VFU4R2
    SC371034FU
    SC406839CFU
    SC406841FU
    SC406843FU
    SC418265CFU4
    SC418442CFUB
    SC418443CFUB
    SC418470CFU
    SC430313VFU16
    SC430320VFU16
    SC432317CFUR2
    SC432894VFU
    SC432929CFUB
    SC432932VFUB
    SC432949FU
    SC440968FU
    SC440970CFU
    SC505804CFUB8
    SC505806CFUB8
    SC505807CFUB8
    SC505808CFUB8
    SC505815CFUB8
    SC505817CFUB8
    SC508744CFUB8
    SC508754VFU8R2
    PART
    SC508774CFUB8
    SC511706CFU8
    SC511716CFU8
    SC514802CFU3
    SC525240VFUW
    SC525292VFUW
    SC525293VFUW
    SC525298MFUB
    SC529201VFU
    SC529204VFUB
    SC529227VFU
    XC501603MFU3
    XC508767VFU2R2
    XC513600MFU4
    XC513602MFU3