MOTOROLA

Semiconductor Products Sector
Issuing Division: SPS

PRODUCT AND PROCESS CHANGE NOTIFICATION
Generic Copy

09-DEC-2002

Subject:               MOTOROLA PRODUCT AND PROCESS CHANGE NOTIFICATION 8342
TITLE:
QUALIFICATION OF 1L54J IN TSC6

EFFECTIVE DATE:        04-Dec-2002


AFFECTED CHANGE CATEGORIES
  • DESIGN CHANGE


  • AFFECTED PRODUCT DIVISIONS
  • WIRELESS INFRASTRCT SYS DIV (NH
  • BODY ELECT, OCCUPANT SAFETY (JD
  • RF/IF DIV (VW)
  • CPD- COMPUTING PLATFORM DIVISION (NR)
  • SMARTMOS PROD TECH CTR (JS
  • DRIVER INFORMATION DIVISION (JI)
  • NETWORK & COMM SYS DIV (NB)
  • BRD. AND ENT. DIVISION BESD (VE)
  • ADVANCED VEHICLE SYS DIV (JB)

  • ADDITIONAL RELIABILITY DATA: Available
    REFERENCE: Contact Sales Office (RA7914)
    Contact your local Motorola Sales Office.

    SAMPLES: Contact Local Sales Office
    REFERENCE: Contact Sales Office ()
    Contact your local Motorola Sales Office.

    For any questions concerning this notification:
    REFERENCE: Contact Sales Office (JAIME KANE)

    DISCLAIMER
          DISCLAIMER:
         
          MOTOROLA WILL CONSIDER THIS CHANGE APPROVED UNLESS SPECIFIC
          CONDITIONS OF ACCEPTANCE ARE PROVIDED IN WRITING WITHIN 30 DAYS OF
          RECEIPT OF THIS NOTICE. TO DO SO, CONTACT YOUR LOCAL MOTOROLA SALES
          OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          Motorola is pleased to announce the successful transfer and
          qualification of the MC68HC908MR32/16 (1L54J) in our TSC6
          fabrication facility. This transfer will allow us to continue to
          fully support our customers. In addition, the 1L54J will provide
          improved ESD protection on all packages.

    QUALIFICATION PLAN

          High Temperature Operating Life (HTOL): 125C for 168 hours
         
          Generic TSC6 (0.5um SST Flash) Data:
          (L54J) TJ3230101: 0/70* (408hr @ 150C)
          *FA Confirmed EOS damage per Report#20021901 on 3 units. Other 4
          units confirmed by Signature Analysis.
          MC68HC908GP32 (0K08S): 0/231
         
          Preconditioning for HAST: Preconditioning; SMD only; Moisture
          Pre-conditioning for THB/HAST, AC and TC; MSL = 3; Reflow temp =
          240oC
          Generic SHC 64 QFP Data
          (L54J) TJ3230101: 0/231
          68HC08AZ60 (1J35D): 0/693 (MSL3, 220oC VPR)
          SC528656CFU (J74Y): 0/231, (MSL3, 240oC VPR)
          SC528656CFU (J74Y): 0/231, (MSL1, 240oC VPR)
          PC527283MFU (K59H): 0/231, (MSL3, 220oC VPR)
         
          Highly Accelerated Stress Test (HAST): 130C/85%RH for 96 hrs.; Bias
          = 5V
          Generic SHC 64 QFP Data:
          (L54J) TJ3230101:0/77
          68HC08AZ60 (1J35D): 0/231
          SC528656CFU (J74Y): 0/77, (MSL3, 240oC VPR)
          SC528656CFU (J74Y): 0/77, (MSL1, 240oC VPR)
          PC527283MFU (K59H): 0/77, (MSL3, 220oC VPR)
         
          Autoclave (AC): 121C/100%RH/15 psig for 96 hrs
          Generic SHC 64 QFP Data:
          (L54J) TJ3230101:0/77
          68HC08AZ60 (1J35D): 0/231
          SC528656CFU (J74Y): 0/77, (MSL3, 240oC VPR)
          SC528656CFU (J74Y): 0/77, (MSL1, 240oC VPR)
          PC527283MFU (K59H): 0/77, (MSL3, 220oC VPR)
         
          Temp Cycle (TC): -65C to +150C for 500 cycles. BPS after TC on 5
          devices from 1 lot on corner bonds (2 bonds per corner) and one
          mid-bond per side on each device.
          Generic SHC 64 QFP Data:
          (L54J) TJ3230101:0/77
          Post T/C Wire Pull:
          TJ3230101:0/5
          68HC08AZ60 (1J35D): 0/231, BPS 0/15
          SC528656CFU (J74Y): 0/77, (MSL3, 240oC VPR)
          SC528656CFU (J74Y): 0/77, (MSL1, 240oC VPR)
          PC527283MFU (K59H): 0/77, (MSL3, 220oC VPR)
         
          Bond Pull Strength (BPS):
          Generic Data: 68HC08AS32 (SHC 64 QFP)
         
          Bond Shear Test (BST):
          Generic Data: 68HC08AS32 (SHC 64 QFP)
         
          Electrostatic Discharge (ESD), Human Body Model:
          0/3@500v
          0/3@1000v
          0/3@1500v
          0/3@2000v
         
          ESD, Machine Model:
          0/3@50v
          0/3@100v
          0/3@150v
          0/3@200v
         
          10k W/E Test: 10K Flash W/E Cycling @ -40C
          Generic TSC6 (0.5um SST Flash)-40oC W/E & 150oC
         
          Data Retention Bake (DRB):
          (L54J) TJ3230101:0/128 (-40),
          (L54J) TJ3230101:0/128 (125),
          MC68HC908GP32 (0K08S): 0/231
         
          Early Life Failure Rate (ELFR): TA = 125C for 48 hrs
         
          Generic TSC6 (0.5um SST Flash) Data:
          MC68HC908GP32 (0K08S): 0/2400
         
          Gate Leakage (GL): 155C, 4.0 min, +400/-400 V
          (L54J) TJ3230101: 0/6
         
          Electrical Distribution: Completed.

    RELIABILITY DATA SUMMARY

          High Temperature Operating Life (HTOL): 125C for 168 hours
         
          Generic TSC6 (0.5um SST Flash) Data:
          (L54J) TJ3230101: 0/70* (408hr @ 150C)
          *FA Confirmed EOS damage per Report#20021901 on 3 units. Other 4
          units confirmed by Signature Analysis.
          MC68HC908GP32 (0K08S): 0/231
         
          Preconditioning for HAST: Preconditioning; SMD only; Moisture
          Pre-conditioning for THB/HAST, AC and TC; MSL = 3; Reflow temp =
          240C
          Generic SHC 64 QFP Data
          (L54J) TJ3230101: 0/231
          68HC08AZ60 (1J35D): 0/693 (MSL3, 220oC VPR)
          SC528656CFU (J74Y): 0/231, (MSL3, 240oC VPR)
          SC528656CFU (J74Y): 0/231, (MSL1, 240oC VPR)
          PC527283MFU (K59H): 0/231, (MSL3, 220oC VPR)
         
          Highly Accelerated Stress Test (HAST): 130C/85%RH for 96 hrs.; Bias
          = 5V
          Generic SHC 64 QFP Data:
          (L54J) TJ3230101:0/77
          68HC08AZ60 (1J35D): 0/231
          SC528656CFU (J74Y): 0/77, (MSL3, 240oC VPR)
          SC528656CFU (J74Y): 0/77, (MSL1, 240oC VPR)
          PC527283MFU (K59H): 0/77, (MSL3, 220oC VPR)
         
          Autoclave (AC): 121C/100%RH/15 psig for 96 hrs
          Generic SHC 64 QFP Data:
          (L54J) TJ3230101:0/77
          68HC08AZ60 (1J35D): 0/231
          SC528656CFU (J74Y): 0/77, (MSL3, 240oC VPR)
          SC528656CFU (J74Y): 0/77, (MSL1, 240oC VPR)
          PC527283MFU (K59H): 0/77, (MSL3, 220oC VPR)
         
          Temp Cycle (TC): -65C to +150C for 500 cycles. BPS after TC on 5
          devices from 1 lot on corner bonds (2 bonds per corner) and one
          mid-bond per side on each device.
          Generic SHC 64 QFP Data:
          (L54J) TJ3230101:0/77
          Post T/C Wire Pull:
          TJ3230101:0/5
          68HC08AZ60 (1J35D): 0/231, BPS 0/15
          SC528656CFU (J74Y): 0/77, (MSL3, 240oC VPR)
          SC528656CFU (J74Y): 0/77, (MSL1, 240oC VPR)
          PC527283MFU (K59H): 0/77, (MSL3, 220oC VPR)
         
          Bond Pull Strength (BPS):
          Generic Data: 68HC08AS32 (SHC 64 QFP)
         
          Bond Shear Test (BST):
          Generic Data: 68HC08AS32 (SHC 64 QFP)
         
          Electrostatic Discharge (ESD), Human Body Model:
          0/3@500v
          0/3@1000v
          0/3@1500v
          0/3@2000v
         
          ESD, Machine Model:
          0/3@50v
          0/3@100v
          0/3@150v
          0/3@200v
         
          10k W/E Test: 10K Flash W/E Cycling @ -40C
          Generic TSC6 (0.5um SST Flash)-40oC W/E & 150oC
         
          Data Retention Bake (DRB):
          (L54J) TJ3230101:0/128 (-40),
          (L54J) TJ3230101:0/128 (125),
          MC68HC908GP32 (0K08S): 0/231
         
          Early Life Failure Rate (ELFR): TA = 125C for 48 hrs
         
          Generic TSC6 (0.5um SST Flash) Data:
          MC68HC908GP32 (0K08S): 0/2400
         
          Gate Leakage (GL): 155C, 4.0 min, +400/-400 V
          (L54J) TJ3230101: 0/6
         
          Electrical Distribution: Completed.

    ELECTRICAL CHARACTERISTIC SUMMARY

          Electrical Distribution for 68HC908MR32/16
         
          Mask: 1L54J
          Wafer Lot: TJ32301.3J Sample: 30 parts
         
          RIDD in mA:
          25C: Cp Cpk Spec High Spec Low
          19.32 14.670 30.00 0.00
         
          115C:Cp Cpk Spec High Spec Low
          4.58 3.570 30.00 0.00
         
          -40C:Cp Cpk Spec High Spec Low
          19.78 14.750 30.00 0.00
         
          WIDD in mA:
          25C: Cp Cpk Spec High Spec Low
          11.74 8.350 12.00 0.00
         
          115C:Cp Cpk Spec High Spec Low
          13.91 9.930 12.00 0.00
         
          -40C:Cp Cpk Spec High Spec Low
          12.99 10.050 12.00 0.00
         
          SIDD in uA:
          25C: Cp Cpk Spec High Spec Low
          6.73 6.660 6.00 0.00
         
          115C:Cp Cpk Spec High Spec Low
          13.13 13.070 6.00 0.00
         
          -40C:Cp Cpk Spec High Spec Low
          9.50 9.490 6.00 0.00
         
          IRQ Leakage in nA:
          25C: Cp Cpk Spec High Spec Low
          55.09 55.010 1000.00 -1000.00
         
          115C:Cp Cpk Spec High Spec Low
          115.70 114.610 1,000.00 -1,000.00
         
          -40C:Cp Cpk Spec High Spec Low
          2.86 2.770 1000.00 -1000.00
         
         
          ADC 10-Bit Monotonicity
          25C: Cp Cpk Spec High Spec Low
          5.21 5.060 10.00 -10.00
         
          115C:Cp Cpk Spec High Spec Low
          5.90 5.630 10.00 -10.00
         
          -40C:Cp Cpk Spec High Spec Low
          6.14 5.860 10.00 -10.00
         

    CHANGED PART IDENTIFICATION

          No Change


    AFFECTED DEVICE LIST
    PART
    KMC908MR16CFU
    KMC908MR16VB
    KMC908MR16VFU
    KMC908MR32CB
    KMC908MR32CFU
    KMC908MR32VB
    KMC908MR32VFU
    KXC908MR16CFU
    KXC908MR32CB
    MC68HC908MR16CB
    MC68HC908MR16CFU
    MC68HC908MR16VB
    MC68HC908MR16VFU
    MC68HC908MR32CB
    MC68HC908MR32CFU
    MC68HC908MR32VB
    MC68HC908MR32VFU
    PC510763VB
    PC510763VFU